JP7334619B2 - ポリメタロキサン、組成物、硬化膜、部材、電子部品、繊維、セラミックス成型用結着剤、硬化膜の製造方法、および繊維の製造方法 - Google Patents
ポリメタロキサン、組成物、硬化膜、部材、電子部品、繊維、セラミックス成型用結着剤、硬化膜の製造方法、および繊維の製造方法 Download PDFInfo
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- JP7334619B2 JP7334619B2 JP2019516547A JP2019516547A JP7334619B2 JP 7334619 B2 JP7334619 B2 JP 7334619B2 JP 2019516547 A JP2019516547 A JP 2019516547A JP 2019516547 A JP2019516547 A JP 2019516547A JP 7334619 B2 JP7334619 B2 JP 7334619B2
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Description
本発明の実施の形態に係るポリメタロキサンは、下記一般式(1)で表される構成単位を有するものである。
つぎに、本発明の実施の形態に係るポリメタロキサンの製造方法について説明する。本発明において、一般式(1)で表される構成単位を有するポリメタロキサンの製造方法には、特に制限はない。この製造方法では、下記一般式(4)で表される金属アルコキシドを加水分解し、部分縮合および重合させることによってポリメタロキサンを製造することが好ましい。ここで、部分縮合とは、加水分解物のM-OHを全て縮合させるのではなく、得られるポリメタロキサンに一部のM-OHを残存させることを指す。後述する一般的な縮合条件であれば、M-OHが部分的に残存することが一般的である。残存させるM-OHの量は、特に制限されない。
本発明の実施の形態に係るポリメタロキサンは、溶媒やその他必要な成分と混合して組成物とすることができる。すなわち、本発明の実施の形態に係る組成物は、少なくとも、上述したポリメタロキサンを含むものである。
本発明の実施の形態に係る硬化膜は、上述したポリメタロキサンを含有するもの、または上述したポリメタロキサンの組成物を含有するものである。本発明の実施の形態に係る硬化膜の製造方法において、上述したポリメタロキサンまたはそれを含む組成物は、基板上に塗布し、加熱することにより硬化膜とすることができる。すなわち、この硬化膜の製造方法は、少なくとも、上述したポリメタロキサンまたはその組成物を加熱する加熱工程を含む。このようにして得られた硬化膜は、電子密度の高い金属原子を主鎖に有する樹脂を主体とする硬化膜となるため、硬化膜中における金属原子の密度を高くすることができ、容易に高い屈折率を得ることができる。また、当該硬化膜は、自由電子を有さない誘電体となることから、高い耐熱性を得ることができる。
本発明の実施の形態に係る硬化膜は、屈折率や絶縁性に優れるため、固体撮像素子、ディスプレイ等の電子部品の部材として好適に用いられる。部材とは、電子部品を組み立てている部分品を指す。すなわち、本発明の実施の形態に係る部材は、上述したポリメタロキサンまたはその組成物を含有する硬化膜を具備するものである。本発明の実施の形態に係る電子部品は、このような硬化膜を具備するものである。例えば、固体撮像素子の部材として、集光用レンズや、集光用レンズと光センサー部とを繋ぐ光導波路、反射防止膜などが挙げられる。ディスプレイの部材として、インデックスマッチング材、平坦化材、絶縁保護材などが挙げられる。
本発明の実施の形態に係るポリメタロキサンまたはその組成物の溶液を紡糸することで、繊維とすることができる。すなわち、本発明の実施の形態に係る繊維は、上述したポリメタロキサンを含有するもの、または上述したポリメタロキサンの組成物を含有するものである。このようにして得られた繊維は、焼成することにより、金属酸化物繊維とすることができる。
本発明の実施の形態に係る繊維の製造方法は、少なくとも、上述したポリメタロキサンまたはその組成物を紡糸して繊維を得る紡糸工程を含む。この紡糸工程において、ポリメタロキサンまたはその組成物の溶液を紡糸する方法としては、公知の方法を用いることができる。例えば、この紡糸の方法として、乾式紡糸法、湿式紡糸法、乾湿式紡糸法、エレクトロスピニング法が挙げられる。以下、「ポリメタロキサンまたはその組成物」は、「組成物等」と適宜略記する。
本発明の実施の形態に係るポリメタロキサンは、セラミックス成型体用結着剤として好適に用いられる。すなわち、本発明の実施の形態に係るセラミックス成型体用結着剤は、上述したポリメタロキサンを含有するものである。セラミックス成型体用結着剤とは、金属酸化物粒子や焼結助剤からなるセラミックス原料粉末を成型可能なペースト状にするための結合剤である。本発明の実施の形態に係るセラミックス成型体用結着剤中のポリメタロキサンをバインダーとして用いて製造されたセラミックスは、電子部材として使用することができる。より具体的には、このセラミックス成型体用結着剤中のポリメタロキサンは、グリーンシート製造用の無機バインダーとして用いることができる。そのような方法で製造されたグリーンシートは、積層コンデンサやセラミックス基板等の電子部材の製造に好適に用いられる。
合成例1のチタン化合物(T-1)の合成方法について説明する。チタン化合物(T-1)の合成方法では、容量500mLの三口フラスコに、テトライソプロポキシチタン(28.4g(0.1mol))を仕込み、この三口フラスコを40℃のオイルバスに浸けて30分間撹拌した。その後、N-ヒドロキシスクシイミド(11.5g(0.1mol))を50gのN-メチル-2-ピロリドン(以下、NMPと略す)に溶解させ、その溶液を、滴下ロートを用いて1時間かけて、この三口フラスコ内に添加した。添加後、さらに1時間撹拌した。その後、減圧留去によって副生成物のイソプロピルアルコールを除去し、この結果、合成例1のチタン化合物溶液、すなわち、チタン化合物(T-1)のNMP溶液を82.1g得た。
合成例2のチタン化合物(T-2)の合成方法について説明する。チタン化合物(T-2)の合成方法では、合成例1のN-ヒドロキシスクシイミド(11.5g(0.1mol))をN-ヒドロキシ-5-ノルボルネン-2,3-ジカルボキシイミド(17.9g(0.1mol))に替えたこと以外は合成例1と同様に合成した。この結果、合成例2のチタン化合物溶液、すなわち、チタン化合物(T-2)のNMP溶液を88.5g得た。
合成例3のチタン化合物(T-3)の合成方法について説明する。チタン化合物(T-3)の合成方法では、合成例1のN-ヒドロキシスクシイミド(11.5g(0.1mol))をN-ヒドロキシフタルイミド(16.3g(0.1mol))に替えたこと以外は合成例1と同様に合成した。この結果、合成例3のチタン化合物溶液、すなわち、チタン化合物(T-3)のNMP溶液を87.1g得た。
合成例4のジルコニウム化合物(Z-1)の合成方法について説明する。ジルコニウム化合物(Z-1)の合成方法では、合成例2のテトライソプロポキシチタン(28.4g(0.1mol))をテトラ-n-プロポキシジルコニウム(32.7g(0.1mol))に替え、副生成物であるn-プロピルアルコールを減圧留去で除去したこと以外は合成例2と同様に合成した。この結果、合成例4のジルコニウム化合物溶液、すなわち、ジルコニウム化合物(Z-1)のNMP溶液を92.1g得た。
合成例5のアルミニウム化合物(A-1)の合成方法について説明する。アルミニウム化合物(A-1)の合成方法では、合成例2のテトライソプロポキシチタン(28.4g(0.1mol))をトリ-s-ブトキシアルミニウム(24.6g(0.1mol))に替え、副生成物であるs-ブチルアルコールを減圧留去で除去したこと以外は合成例2と同様に合成した。この結果、合成例5のアルミニウム化合物溶液、すなわち、アルミニウム化合物(A-1)のNMP溶液を83.1g得た。
実施例1では、ポリメタロキサン(TP-1)の合成を行った。このポリメタロキサン(TP-1)の合成方法では、合成例1で合成したチタン化合物(T-1)のNMP溶液(82.1g)を溶液1とした。この量の溶液1は、チタン化合物(T-1)の0.1molのモル量に相当する。また、水(5.4g(0.30mol))と、水希釈溶媒としてのNMP(15.0g)と、重合触媒としてのトリプロピルアミン(1.4g(0.01mol))とを混合し、この混合液を溶液2とした。
実施例2では、ポリメタロキサン(TP-2)の合成を行った。このポリメタロキサン(TP-2)の合成方法では、実施例1の、チタン化合物(T-1)のNMP溶液(82.1g)の替わりに合成例2で合成したチタン化合物(T-2)のNMP溶液(88.5g:チタン化合物(T-2)の0.1mol相当)を溶液1としたこと以外は実施例1と同様に合成し、実施例2のポリメタロキサン溶液を得た。この得られたポリメタロキサン溶液の固形分濃度を求め、その後、固形分濃度が20wt%となるようにNMPを加え、ポリメタロキサン(TP-2)の溶液とした。
実施例3では、ポリメタロキサン(TP-3)の合成を行った。このポリメタロキサン(TP-3)の合成方法では、実施例1の、チタン化合物(T-1)のNMP溶液(82.1g)の替わりに合成例3で合成したチタン化合物(T-3)のNMP溶液(87.1g:チタン化合物(T-3)の0.1mol相当)を溶液1としたこと以外は実施例1と同様に合成し、実施例3のポリメタロキサン溶液を得た。この得られたポリメタロキサン溶液の固形分濃度を求め、その後、固形分濃度が20wt%となるようにNMPを加え、ポリメタロキサン(TP-3)の溶液とした。
実施例4では、ポリメタロキサン(ZP-1)の合成を行った。このポリメタロキサン(ZP-1)の合成方法では、実施例1の、チタン化合物(T-1)のNMP溶液(82.1g)の替わりに合成例4で合成したジルコニウム化合物(Z-1)のNMP溶液(92.1g:ジルコニウム化合物(Z-1)の0.1mol相当)を溶液1としたこと以外は実施例1と同様に合成し、実施例4のポリメタロキサン溶液を得た。実施例4では、反応中に、副生成物であるn-プロピルアルコールおよび水が留出した。実施例4で得られたポリメタロキサン溶液の固形分濃度を求め、その後、固形分濃度が20wt%となるようにNMPを加え、ポリメタロキサン(ZP-1)の溶液とした。
実施例5では、ポリメタロキサン(ZAP-1)の合成を行った。このポリメタロキサン(ZAP-1)の合成方法では、実施例1の、チタン化合物(T-1)のNMP溶液(82.1g)の替わりに合成例4で合成したジルコニウム化合物(Z-1)のNMP溶液(46.0g:ジルコニウム化合物(Z-1)の0.05mol相当)および合成例5で合成したアルミニウム化合物(A-1)のNMP溶液(41.6g:アルミニウム化合物(A-1)の0.05mol相当)を溶液1としたこと以外は実施例1と同様に合成し、実施例5のポリメタロキサン溶液を得た。実施例5では、反応中に、副生成物であるn-プロピルアルコール、s-ブチルアルコールおよび水が留出した。実施例5で得られたポリメタロキサン溶液の固形分濃度を求め、その後、固形分濃度が20wt%となるようにNMPを加え、ポリメタロキサン(ZAP-1)の溶液とした。
実施例6では、ポリメタロキサン(TAP-1)の合成を行った。このポリメタロキサン(TAP-1)の合成方法では、実施例1の、チタン化合物(T-1)のNMP溶液(82.1g)の替わりに合成例2で合成したチタン化合物(T-2)のNMP溶液(44.2g:チタン化合物(T-2)の0.05mol相当)および合成例5で合成したアルミニウム化合物(A-1)のNMP溶液(41.6g:アルミニウム化合物(A-1)の0.05mol相当)を溶液1としたこと以外は実施例1と同様に合成し、実施例6のポリメタロキサン溶液を得た。実施例6では、反応中に、副生成物であるIPA、s-ブチルアルコールおよび水が留出した。実施例6で得られたポリメタロキサン溶液の固形分濃度を求め、その後、固形分濃度が20wt%となるようにNMPを加え、ポリメタロキサン(TAP-1)の溶液とした。
比較合成例1では、ポリメタロキサン(TP-4)の合成を行った。このポリメタロキサン(TP-4)の合成方法では、容量500mLの三口フラスコに、テトラブトキシチタン(34.0g(0.1mol))を仕込み、この三口フラスコを75℃のオイルバスに浸けて30分間撹拌した(内温は70℃)。その後、加水分解を目的として水(3.1g(0.17mol))とブタノール(50g)との混合溶液を滴下ロートで1時間かけて、この三口フラスコ内に添加した。その後、オイルバスを90℃に昇温し、1時間、撹拌を保持して反応を熟成した。
比較合成例2では、ポリメタロキサン(TP-5)の合成を行った。このポリメタロキサン(TP-5)の合成方法では、容量500mLの三口フラスコに、テトラブトキシチタン(34.0g(0.1mol))と溶媒としてのエタノール(100g)とを仕込み、この三口フラスコを40℃のオイルバスにつけて30分間攪拌した。その後、加水分解を目的として水(2.7g(0.15mol))とt-ブチルヒドラジン塩酸塩(0.25g(0.002モル))とエタノール(50g)との混合溶液を滴下ロートに充填し、1時間かけて、この三口フラスコ内に添加した。この混合溶液の添加後、NMP(50g)を加え、さらに1時間撹拌した。その後、重縮合を目的として、オイルバスを30分間かけて140℃まで昇温した。昇温開始1時間後に溶液の内温が100℃に到達し、そこから2時間、加熱撹拌した(内温は100~130℃)。比較合成例2では、反応中に、副生成物であるブタノールおよび水が留出した。
(第1項目:硬化膜の作製)
実施例7の第1項目では、硬化膜の作製方法について説明する。この方法では、ポリメタロキサン(TP-1)の溶液を、2枚の4インチシリコンウェハにそれぞれスピンコーター(ミカサ社製1H-360S)を用いてスピン塗布し、その後、ホットプレート(大日本スクリ-ン製造社製SCW-636)を用いて100℃で3分間加熱し、プリベーク膜を作製した。その後、ホットプレートを用いて300℃で5分間キュアして、膜厚0.3μmの硬化膜と膜厚0.5μmの硬化膜とを作製した。なお、膜厚は、光干渉式膜厚計(大日本スクリ-ン製造社製ラムダエ-スSTM602)を用いて、測定した。
実施例7の第2項目では、硬化膜の耐クラック性評価について説明する。この評価では、上記第1項目の方法で得られた2種の硬化膜の耐クラック性について、それぞれ下記のように定義される5段階のレベルで評価した。硬化膜の耐クラック性評価は、レベルが4以上である場合を合格とした。
5:光学顕微鏡観察(倍率:5倍)においてクラックが見えない
4:光学顕微鏡観察(倍率:5倍)においてわずかにクラックが見える
3:光学顕微鏡観察(倍率:5倍)においてはっきりクラックが見える
2:通常の目視でわずかにクラックが見える
1:通常の目視ではっきりクラックが見える
実施例7の第3項目では、硬化膜の屈折率の測定について説明する。この測定では、上記第1項目の方法で得られた膜厚0.3μmの硬化膜について、分光エリプソメーター(大塚電子社製FE5000)を用いて硬化膜からの反射光の偏光状態変化を測定し、入射光との位相差と振幅反射率のスペクトルとを得た。測定時の温度は、22℃とした。得られたスペクトルに近づくように計算モデルの誘電関数をフィッティングすることにより、屈折率スペクトルが得られた。この屈折率スペクトルから、波長550nmにおける屈折率値を読み取り、この屈折率値を、対象とする硬化膜の屈折率とした。実施例7における硬化膜の測定および評価の結果は、後述の表3に示した。
実施例8~12および比較例1、2の各々では、表3に示したポリメタロキサン溶液につき、実施例7と同様にして、上記第1項目の方法による硬化膜の作製、上記第2項目の硬化膜の耐クラック性評価、および上記第3項目の硬化膜の屈折率測定を行った。実施例8~12および比較例1、2の測定および評価の各結果は、表3に示した。
(第4項目:硬化膜の耐薬品性評価)
実施例13の第4項目では、硬化膜の耐薬品性評価について説明する。この評価では、ポリメタロキサン(TP-2)の溶液を、2枚の4インチシリコンウェハにそれぞれスピンコーター(ミカサ社製1H-360S)を用いてスピン塗布し、その後、ホットプレート(大日本スクリ-ン製造社製SCW-636)を用いて100℃で3分間加熱し、プリベーク膜を作製した。その後、ホットプレートを用い、1枚は230℃で5分間キュアして、膜厚0.3μmの硬化膜を作製し、また、もう1枚は300℃で5分間キュアして、0.3μmの硬化膜を作製した。
硬化膜の膜厚変化率(%)=(耐薬品性処理前後の硬化膜の膜厚差)/(耐薬品性処理前の硬化膜の膜厚)×100
実施例14では、実施例13のポリメタロキサン(TP-2)の溶液を、ポリメタロキサン(TP-2)の溶液に金属元素含有化合物であるアルミキレートA(W)(製品名、アルミニウムトリス(アセチルアセテート、川研ファインケミカル社製)をポリメタロキサン溶液の固形分に対して1質量%加えた組成物に替えたこと以外は、実施例13と同様にして、硬化膜の耐薬品性評価を行った。実施例14の評価結果は、表4に示した。
実施例15では、実施例14のアルミキレートA(W)をB-10(製品名、テトラ-n-ブトキシチタンの縮合物(オリゴマー)、日本曹達社製)に替えたこと以外は、実施例14と同様にして、硬化膜の耐薬品性評価を行った。実施例15の評価結果は、表4に示した。
実施例16では、実施例1で合成したポリメタロキサン(TP-1)の溶液を、固形分濃度が40%となるまで、減圧下で濃縮した。濃縮後のポリメタロキサン(TP-1)の溶液の粘度は、2000Pであった。
実施例17では、ポリメタロキサン(TP-1)の溶液の替わりに、ポリメタロキサン(TP-1)溶液にB-10(金属元素含有化合物)をポリメタロキサン溶液の固形分に対して10質量%加えたものを、固形分濃度が40%となるように減圧下で濃縮したこと以外は実施例16と同様にして、焼成後の繊維を作製した。実施例17における焼成後の繊維の平均繊維径は40μmであり、当該繊維の引張強度は1.5GPaであった。
実施例18では、ポリメタロキサン(TP-1)の溶液の替わりに、ポリメタロキサン(ZAP-1)の溶液を用いたこと以外は実施例16と同様にして、焼成後の繊維を作製した。実施例18における焼成後の繊維の平均繊維径は45μmであり、当該繊維の引張強度は1.5GPaであった。
Claims (13)
- 下記一般式(1)で表される構成単位を有し、
前記一般式(1)で表される構成単位は、下記一般式(3)で表される構成単位である、
ことを特徴とするポリメタロキサン。
- 請求項1に記載のポリメタロキサンを含む、
ことを特徴とする組成物。 - さらに金属元素含有化合物を含む、
ことを特徴とする請求項2に記載の組成物。 - 請求項1に記載のポリメタロキサンを含有する、
ことを特徴とする硬化膜。 - 請求項2または3に記載の組成物を含有する、
ことを特徴とする硬化膜。 - 請求項1に記載のポリメタロキサン、または請求項2または3に記載の組成物を加熱する加熱工程を含む、
ことを特徴とする硬化膜の製造方法。 - 請求項4または5に記載の硬化膜を具備する、
ことを特徴とする部材。 - 請求項7に記載の部材を具備する、
ことを特徴とする電子部品。 - 請求項1に記載のポリメタロキサンを含有する、
ことを特徴とする繊維。 - 請求項2または3に記載の組成物を含有する、
ことを特徴とする繊維。 - 請求項1に記載のポリメタロキサン、または請求項2または3に記載の組成物を紡糸して繊維を得る紡糸工程を含む、
ことを特徴とする繊維の製造方法。 - 前記紡糸工程によって得られた前記繊維を焼成する焼成工程を含む、
ことを特徴とする請求項11に記載の繊維の製造方法。 - 請求項1に記載のポリメタロキサンを含有する、
ことを特徴とするセラミックス成型体用結着剤。
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