JP7317550B2 - 感光性積層体及びその製造方法 - Google Patents

感光性積層体及びその製造方法 Download PDF

Info

Publication number
JP7317550B2
JP7317550B2 JP2019070806A JP2019070806A JP7317550B2 JP 7317550 B2 JP7317550 B2 JP 7317550B2 JP 2019070806 A JP2019070806 A JP 2019070806A JP 2019070806 A JP2019070806 A JP 2019070806A JP 7317550 B2 JP7317550 B2 JP 7317550B2
Authority
JP
Japan
Prior art keywords
laminate
photosensitive resin
photosensitive
resin composition
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019070806A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019194007A (ja
JP2019194007A5 (https=
Inventor
浩輔 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Publication of JP2019194007A publication Critical patent/JP2019194007A/ja
Publication of JP2019194007A5 publication Critical patent/JP2019194007A5/ja
Application granted granted Critical
Publication of JP7317550B2 publication Critical patent/JP7317550B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2019070806A 2018-05-01 2019-04-02 感光性積層体及びその製造方法 Active JP7317550B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018088407 2018-05-01
JP2018088407 2018-05-01

Publications (3)

Publication Number Publication Date
JP2019194007A JP2019194007A (ja) 2019-11-07
JP2019194007A5 JP2019194007A5 (https=) 2022-01-31
JP7317550B2 true JP7317550B2 (ja) 2023-07-31

Family

ID=68408408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019070806A Active JP7317550B2 (ja) 2018-05-01 2019-04-02 感光性積層体及びその製造方法

Country Status (2)

Country Link
JP (1) JP7317550B2 (https=)
CN (1) CN110426917A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6966526B2 (ja) * 2019-12-04 2021-11-17 日東電工株式会社 配線回路基板の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007086292A (ja) 2005-09-21 2007-04-05 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、及び感光性樹脂組成物
JP2007094361A (ja) 2005-09-01 2007-04-12 Hitachi Chem Co Ltd 液晶スペーサー形成用感光性フィルム、感光性樹脂組成物、及び液晶スペーサーの製造方法
JP2010271709A (ja) 2009-04-20 2010-12-02 Asahi Kasei E-Materials Corp 感光性樹脂積層体
JP2016097595A (ja) 2014-11-21 2016-05-30 日立化成株式会社 積層体及びその製造方法、フィルムセット、感光性導電フィルム、並びに、電子部品
JP2016122031A (ja) 2014-12-24 2016-07-07 三菱樹脂株式会社 ドライフィルムレジスト用保護フィルムおよび感光性樹脂積層体
JP2016188924A (ja) 2015-03-30 2016-11-04 日立化成株式会社 ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法
WO2017213056A1 (ja) 2016-06-10 2017-12-14 富士フイルム株式会社 パターン付き基材の製造方法、及び、回路基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3449572B2 (ja) * 1994-08-12 2003-09-22 東京応化工業株式会社 感光性樹脂組成物およびこれを用いた感光性ドライフィルム
JP2003140333A (ja) * 2001-11-01 2003-05-14 Kanegafuchi Chem Ind Co Ltd 剥離作業性に優れた感光性カバーレイフィルム
CN101144981A (zh) * 2006-09-11 2008-03-19 旭化成电子材料元件株式会社 带有感光性树脂的层压板
JP5570275B2 (ja) * 2010-03-31 2014-08-13 旭化成イーマテリアルズ株式会社 ドライフィルムレジストロール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007094361A (ja) 2005-09-01 2007-04-12 Hitachi Chem Co Ltd 液晶スペーサー形成用感光性フィルム、感光性樹脂組成物、及び液晶スペーサーの製造方法
JP2007086292A (ja) 2005-09-21 2007-04-05 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、及び感光性樹脂組成物
JP2010271709A (ja) 2009-04-20 2010-12-02 Asahi Kasei E-Materials Corp 感光性樹脂積層体
JP2016097595A (ja) 2014-11-21 2016-05-30 日立化成株式会社 積層体及びその製造方法、フィルムセット、感光性導電フィルム、並びに、電子部品
JP2016122031A (ja) 2014-12-24 2016-07-07 三菱樹脂株式会社 ドライフィルムレジスト用保護フィルムおよび感光性樹脂積層体
JP2016188924A (ja) 2015-03-30 2016-11-04 日立化成株式会社 ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法
WO2017213056A1 (ja) 2016-06-10 2017-12-14 富士フイルム株式会社 パターン付き基材の製造方法、及び、回路基板の製造方法

Also Published As

Publication number Publication date
JP2019194007A (ja) 2019-11-07
CN110426917A (zh) 2019-11-08

Similar Documents

Publication Publication Date Title
TWI480683B (zh) A photosensitive resin composition and a photosensitive member using the same, a method for forming a photoresist pattern, and a method for manufacturing a printed circuit board
WO2008015983A1 (fr) Composition de résine photosensible et stratifié
JP4847582B2 (ja) 感光性樹脂組成物および積層体
TWI690774B (zh) 感光性樹脂積層體及抗蝕劑圖案之製造方法
JP7340643B2 (ja) 感光性樹脂組成物及び感光性樹脂積層体
JP6637511B2 (ja) 感光性樹脂組成物
TWI240149B (en) Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
JP2001201851A (ja) 光重合性樹脂組成物
CN102047180B (zh) 薄膜型可光降解的转印材料
TW202020563A (zh) 感光性樹脂組合物
JP5600903B2 (ja) 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TWI664497B (zh) 感光性樹脂組合物、感光性樹脂積層體、形成有光阻圖案之基板及電路基板之製造方法
JP5793924B2 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法
JP2005215142A (ja) 感光性樹脂組成物及び積層体
JP2009128419A (ja) 感光性樹脂組成物および積層体
JP5570275B2 (ja) ドライフィルムレジストロール
TWI412884B (zh) Photosensitive resin composition, photosensitive resin laminate, photoresist pattern forming method and manufacturing method of conductor pattern, printed wiring board, lead frame, substrate and semiconductor package
WO2007114014A1 (ja) 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5376043B2 (ja) 感光性樹脂組成物並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP7317550B2 (ja) 感光性積層体及びその製造方法
CN111492309B (zh) 感光性树脂层叠体
JP6981864B2 (ja) 感光性樹脂組成物、感光性樹脂積層体、レジストパターンが形成された基板および回路基板の製造方法
JP2012220686A (ja) 感光性樹脂組成物及びその積層体
JP5411521B2 (ja) 感光性樹脂積層体
KR101582484B1 (ko) 판막 형성용 부재

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220121

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220121

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20221102

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221213

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230530

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230608

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230711

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230719

R150 Certificate of patent or registration of utility model

Ref document number: 7317550

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150