CN110426917A - 感光性层叠体和其制造方法 - Google Patents

感光性层叠体和其制造方法 Download PDF

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Publication number
CN110426917A
CN110426917A CN201910342786.8A CN201910342786A CN110426917A CN 110426917 A CN110426917 A CN 110426917A CN 201910342786 A CN201910342786 A CN 201910342786A CN 110426917 A CN110426917 A CN 110426917A
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CN
China
Prior art keywords
film
photosensitive
laminated body
photosensitive resin
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910342786.8A
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English (en)
Chinese (zh)
Inventor
井上浩辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
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Asahi Kasei Corp
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Filing date
Publication date
Application filed by Asahi Kasei Corp filed Critical Asahi Kasei Corp
Publication of CN110426917A publication Critical patent/CN110426917A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201910342786.8A 2018-05-01 2019-04-26 感光性层叠体和其制造方法 Pending CN110426917A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018088407 2018-05-01
JP2018-088407 2018-05-01

Publications (1)

Publication Number Publication Date
CN110426917A true CN110426917A (zh) 2019-11-08

Family

ID=68408408

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910342786.8A Pending CN110426917A (zh) 2018-05-01 2019-04-26 感光性层叠体和其制造方法

Country Status (2)

Country Link
JP (1) JP7317550B2 (https=)
CN (1) CN110426917A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6966526B2 (ja) * 2019-12-04 2021-11-17 日東電工株式会社 配線回路基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140333A (ja) * 2001-11-01 2003-05-14 Kanegafuchi Chem Ind Co Ltd 剥離作業性に優れた感光性カバーレイフィルム
CN101144981A (zh) * 2006-09-11 2008-03-19 旭化成电子材料元件株式会社 带有感光性树脂的层压板
JP2011215366A (ja) * 2010-03-31 2011-10-27 Asahi Kasei E-Materials Corp ドライフィルムレジストロール
CN102405441A (zh) * 2009-04-20 2012-04-04 旭化成电子材料株式会社 感光性树脂层压体
WO2017213056A1 (ja) * 2016-06-10 2017-12-14 富士フイルム株式会社 パターン付き基材の製造方法、及び、回路基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3449572B2 (ja) * 1994-08-12 2003-09-22 東京応化工業株式会社 感光性樹脂組成物およびこれを用いた感光性ドライフィルム
JP2007094361A (ja) 2005-09-01 2007-04-12 Hitachi Chem Co Ltd 液晶スペーサー形成用感光性フィルム、感光性樹脂組成物、及び液晶スペーサーの製造方法
JP4592544B2 (ja) 2005-09-21 2010-12-01 日本合成化学工業株式会社 感光性樹脂組成物及びフォトレジストフィルム
JP2016097595A (ja) 2014-11-21 2016-05-30 日立化成株式会社 積層体及びその製造方法、フィルムセット、感光性導電フィルム、並びに、電子部品
JP2016122031A (ja) 2014-12-24 2016-07-07 三菱樹脂株式会社 ドライフィルムレジスト用保護フィルムおよび感光性樹脂積層体
JP6631026B2 (ja) 2015-03-30 2020-01-15 日立化成株式会社 ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140333A (ja) * 2001-11-01 2003-05-14 Kanegafuchi Chem Ind Co Ltd 剥離作業性に優れた感光性カバーレイフィルム
CN101144981A (zh) * 2006-09-11 2008-03-19 旭化成电子材料元件株式会社 带有感光性树脂的层压板
CN102405441A (zh) * 2009-04-20 2012-04-04 旭化成电子材料株式会社 感光性树脂层压体
JP2011215366A (ja) * 2010-03-31 2011-10-27 Asahi Kasei E-Materials Corp ドライフィルムレジストロール
WO2017213056A1 (ja) * 2016-06-10 2017-12-14 富士フイルム株式会社 パターン付き基材の製造方法、及び、回路基板の製造方法

Also Published As

Publication number Publication date
JP7317550B2 (ja) 2023-07-31
JP2019194007A (ja) 2019-11-07

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