JP7275100B2 - 溶融球状シリカ粉末およびその製造方法 - Google Patents

溶融球状シリカ粉末およびその製造方法 Download PDF

Info

Publication number
JP7275100B2
JP7275100B2 JP2020502920A JP2020502920A JP7275100B2 JP 7275100 B2 JP7275100 B2 JP 7275100B2 JP 2020502920 A JP2020502920 A JP 2020502920A JP 2020502920 A JP2020502920 A JP 2020502920A JP 7275100 B2 JP7275100 B2 JP 7275100B2
Authority
JP
Japan
Prior art keywords
silica
fused
spherical silica
fused spherical
silica powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020502920A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019167618A1 (ja
Inventor
孝雄 浦川
尊凡 永野
政斗 柏木
俊重 梶山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of JPWO2019167618A1 publication Critical patent/JPWO2019167618A1/ja
Priority to JP2023075989A priority Critical patent/JP2023087034A/ja
Application granted granted Critical
Publication of JP7275100B2 publication Critical patent/JP7275100B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
JP2020502920A 2018-03-01 2019-02-13 溶融球状シリカ粉末およびその製造方法 Active JP7275100B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023075989A JP2023087034A (ja) 2018-03-01 2023-05-02 溶融球状シリカ粉末

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018036100 2018-03-01
JP2018036100 2018-03-01
PCT/JP2019/005011 WO2019167618A1 (ja) 2018-03-01 2019-02-13 溶融球状シリカ粉末およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023075989A Division JP2023087034A (ja) 2018-03-01 2023-05-02 溶融球状シリカ粉末

Publications (2)

Publication Number Publication Date
JPWO2019167618A1 JPWO2019167618A1 (ja) 2021-02-25
JP7275100B2 true JP7275100B2 (ja) 2023-05-17

Family

ID=67805329

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020502920A Active JP7275100B2 (ja) 2018-03-01 2019-02-13 溶融球状シリカ粉末およびその製造方法
JP2023075989A Pending JP2023087034A (ja) 2018-03-01 2023-05-02 溶融球状シリカ粉末

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023075989A Pending JP2023087034A (ja) 2018-03-01 2023-05-02 溶融球状シリカ粉末

Country Status (5)

Country Link
JP (2) JP7275100B2 (zh)
KR (1) KR102649474B1 (zh)
CN (1) CN111629998B (zh)
TW (1) TWI809042B (zh)
WO (1) WO2019167618A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7003075B2 (ja) * 2019-02-15 2022-01-20 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス
CN115515899A (zh) * 2020-04-24 2022-12-23 电化株式会社 球状二氧化硅粉末
EP4317065A1 (en) 2021-03-31 2024-02-07 Denka Company Limited Inorganic oxide powder
WO2023153355A1 (ja) * 2022-02-09 2023-08-17 デンカ株式会社 球状シリカ粉末

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006062902A (ja) 2004-08-26 2006-03-09 Denki Kagaku Kogyo Kk 球状無機質中空粉体およびその製造方法、樹脂組成物
JP2008031409A (ja) 2006-06-27 2008-02-14 Matsushita Electric Works Ltd 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191315A (ja) * 1998-12-25 2000-07-11 Tokuyama Corp 溶融シリカ粒子の製造方法
JP2000191316A (ja) 1998-12-25 2000-07-11 Tokuyama Corp 凝集性の小さい溶融シリカ
JP4112125B2 (ja) * 1999-08-13 2008-07-02 電気化学工業株式会社 微細球状シリカ粉末の製造方法
JP4614214B2 (ja) * 1999-12-02 2011-01-19 信越化学工業株式会社 半導体装置素子用中空パッケージ
JP4313924B2 (ja) * 2000-03-16 2009-08-12 電気化学工業株式会社 球状シリカ粉末及びその製造方法
JP3796565B2 (ja) * 2000-08-15 2006-07-12 信越化学工業株式会社 球状シリカ微粒子の製造方法
JP5230051B2 (ja) 2002-09-11 2013-07-10 株式会社トクヤマ 微小溶融シリカ粒子
JP2005119884A (ja) * 2003-10-14 2005-05-12 Mitsubishi Rayon Co Ltd 非孔性球状シリカ及びその製造方法
JP4691321B2 (ja) * 2003-12-26 2011-06-01 三菱レイヨン株式会社 高純度酸化ケイ素粉末の製造方法
CN101454246A (zh) * 2006-06-09 2009-06-10 株式会社德山 干式二氧化硅微粒
MY150827A (en) * 2007-08-01 2014-02-28 Denki Kagaku Kogyo Kk Silica powder, process for its production, and composition employing it
JP2010143806A (ja) * 2008-12-19 2010-07-01 Tokuyama Corp 表面処理シリカ系粒子及びその製造方法
KR101260346B1 (ko) 2012-11-16 2013-05-07 주식회사 신아티앤씨 에폭시 수지 조성물
JP2015086120A (ja) * 2013-10-31 2015-05-07 株式会社トクヤマ 球状シリカ微粉末とその製造方法
CN105084373A (zh) * 2015-07-24 2015-11-25 陈林 低介电常数硅微粉的制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006062902A (ja) 2004-08-26 2006-03-09 Denki Kagaku Kogyo Kk 球状無機質中空粉体およびその製造方法、樹脂組成物
JP2008031409A (ja) 2006-06-27 2008-02-14 Matsushita Electric Works Ltd 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板

Also Published As

Publication number Publication date
JPWO2019167618A1 (ja) 2021-02-25
KR102649474B1 (ko) 2024-03-20
JP2023087034A (ja) 2023-06-22
KR20200127159A (ko) 2020-11-10
TW201936498A (zh) 2019-09-16
TWI809042B (zh) 2023-07-21
CN111629998A (zh) 2020-09-04
WO2019167618A1 (ja) 2019-09-06
CN111629998B (zh) 2023-06-30

Similar Documents

Publication Publication Date Title
JP7275100B2 (ja) 溶融球状シリカ粉末およびその製造方法
JP6803823B2 (ja) セリア系複合微粒子分散液、その製造方法及びセリア系複合微粒子分散液を含む研磨用砥粒分散液
TW460963B (en) Polishing slurry and polishing method
EP2351709B1 (en) Zinc oxide particles, process for producing same, heat-releasing filler, resin composition, heat-releasing grease, and heat-releasing coating composition
JP2015086120A (ja) 球状シリカ微粉末とその製造方法
KR100793503B1 (ko) 비공성 구상 실리카 및 그의 제조 방법
JP4043103B2 (ja) 溶融球状シリカ及びその製造方法
US20230125516A1 (en) Method for producing surface-treated silica powder, resin composition, and slurry
JP6305007B2 (ja) 球状非晶質シリカ粒子、その製造方法およびこれを含有する樹脂組成物
CN1408642A (zh) 热解二氧化硅粒子及其制造方法
JP2016190769A (ja) シリカ粒子の製造方法
KR20090104000A (ko) 비정질 실리카질 분말, 그 제조 방법 및 반도체 봉지재
JP5116968B2 (ja) 球状アルミナ粉末の製造方法
JP6329776B2 (ja) モールドアンダーフィル用封止材
JP6899495B2 (ja) 非晶質シリカチタニア複合酸化物粉末、樹脂組成物及び分散液
CN113365943B (zh) 二氧化硅粉末、树脂组合物及分散体
JP6752658B2 (ja) 異形シリカ粉末、その製造方法、それを含有する樹脂組成物
JP2004203664A (ja) 球状シリカ質粉末及びその製造方法、用途
JP2016079278A (ja) 無機フィラー及びその製造方法、樹脂組成物、及び成形品
JP5506883B2 (ja) 球状アルミナ粉末
JP2022090679A (ja) 球状シリカ粉末の製造方法
EP4299510A1 (en) Metal oxide powder, and method for producing same
JP2023083524A (ja) 複合酸化物粉末の製造方法
KR0173179B1 (ko) 졸-겔법에 의한 리드 알루미노실리케이트계 유리의 제조방법
WO2021200485A1 (ja) アルミナ粉末、フィラー組成物、樹脂組成物、封止材、及び指紋認証センサー

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210622

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220802

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220930

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221201

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230405

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230502

R150 Certificate of patent or registration of utility model

Ref document number: 7275100

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150