JP7275039B2 - リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ - Google Patents

リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ Download PDF

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Publication number
JP7275039B2
JP7275039B2 JP2019548638A JP2019548638A JP7275039B2 JP 7275039 B2 JP7275039 B2 JP 7275039B2 JP 2019548638 A JP2019548638 A JP 2019548638A JP 2019548638 A JP2019548638 A JP 2019548638A JP 7275039 B2 JP7275039 B2 JP 7275039B2
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Prior art keywords
transfer robot
robot
transfer
atv
transport module
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Japanese (ja)
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JP2020510310A (ja
JP2020510310A5 (https=
Inventor
グールド・リチャード・エイチ．
ブランク・リチャード
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Lam Research Corp
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Lam Research Corp
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Priority to JP2023076062A priority Critical patent/JP7608512B2/ja
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Publication of JP7275039B2 publication Critical patent/JP7275039B2/ja
Priority to JP2024221226A priority patent/JP2025038126A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Prostheses (AREA)
JP2019548638A 2017-03-15 2018-03-14 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ Active JP7275039B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023076062A JP7608512B2 (ja) 2017-03-15 2023-05-02 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2024221226A JP2025038126A (ja) 2017-03-15 2024-12-18 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762471478P 2017-03-15 2017-03-15
US62/471,478 2017-03-15
PCT/US2018/022397 WO2018170104A1 (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023076062A Division JP7608512B2 (ja) 2017-03-15 2023-05-02 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ

Publications (3)

Publication Number Publication Date
JP2020510310A JP2020510310A (ja) 2020-04-02
JP2020510310A5 JP2020510310A5 (https=) 2023-01-27
JP7275039B2 true JP7275039B2 (ja) 2023-05-17

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JP2019548638A Active JP7275039B2 (ja) 2017-03-15 2018-03-14 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2023076062A Active JP7608512B2 (ja) 2017-03-15 2023-05-02 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2024221226A Pending JP2025038126A (ja) 2017-03-15 2024-12-18 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ

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JP2023076062A Active JP7608512B2 (ja) 2017-03-15 2023-05-02 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2024221226A Pending JP2025038126A (ja) 2017-03-15 2024-12-18 リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ

Country Status (8)

Country Link
US (3) US11521869B2 (https=)
EP (2) EP3596752B1 (https=)
JP (3) JP7275039B2 (https=)
KR (3) KR20250035046A (https=)
CN (3) CN110447095B (https=)
SG (2) SG10202110040SA (https=)
TW (2) TWI765984B (https=)
WO (1) WO2018170104A1 (https=)

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US12562356B2 (en) 2020-03-02 2026-02-24 Lam Research Corporation Linear arrangement for substrate processing tools
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WO2021206940A1 (en) * 2020-04-06 2021-10-14 Lam Research Corporation Slide and pivot assemblies for process module bias assemblies of substrate processing systems
CN113644005A (zh) * 2020-05-11 2021-11-12 中微半导体设备(上海)股份有限公司 一种半导体处理系统
CN114242631B (zh) * 2020-06-01 2026-04-24 上海果纳半导体技术有限公司 一种半导体设备
US11581203B2 (en) * 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space
KR102866529B1 (ko) * 2020-10-28 2025-09-30 삼성전자주식회사 반도체 소자의 제조 장치
JP2024518235A (ja) * 2021-04-28 2024-05-01 ラム リサーチ コーポレーション 半導体ツールの構成
KR102614918B1 (ko) * 2021-06-28 2023-12-20 세메스 주식회사 반송 어셈블리 및 이를 가지는 기판 처리 장치
JP7726746B2 (ja) 2021-11-09 2025-08-20 東京エレクトロン株式会社 基板処理システム
CN118511269A (zh) * 2021-11-11 2024-08-16 朗姆研究公司 用于高产能的嵌套式大气机械臂
KR20230111438A (ko) 2022-01-18 2023-07-25 삼성전자주식회사 반도체 기판 처리 장치
WO2023205361A1 (en) * 2022-04-22 2023-10-26 Lam Research Corporation Shallow-depth equipment front end module with robot
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
TWI874040B (zh) * 2023-12-13 2025-02-21 日商Ｊｅｌ股份有限公司 搬送裝置及搬送裝置之控制方法
KR102874818B1 (ko) * 2024-10-17 2025-10-22 주식회사 나인벨 쓰루풋이 향상된 듀얼 스캔 타입 이온 임플란트 시스템

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Also Published As

Publication number Publication date
TWI793000B (zh) 2023-02-11
EP3596752A1 (en) 2020-01-22
EP3596752B1 (en) 2025-01-08
KR102577199B1 (ko) 2023-09-08
KR102778382B1 (ko) 2025-03-06
CN110447095A (zh) 2019-11-12
EP3596752A4 (en) 2021-01-06
JP2020510310A (ja) 2020-04-02
EP4456120A2 (en) 2024-10-30
EP4456120A3 (en) 2025-01-01
SG10202110040SA (en) 2021-10-28
JP2025038126A (ja) 2025-03-18
US20240194505A1 (en) 2024-06-13
WO2018170104A1 (en) 2018-09-20
KR20250035046A (ko) 2025-03-11
KR20190120834A (ko) 2019-10-24
SG11201908188SA (en) 2019-10-30
JP7608512B2 (ja) 2025-01-06
US20200083071A1 (en) 2020-03-12
US11908714B2 (en) 2024-02-20
US20230062737A1 (en) 2023-03-02
TW202232632A (zh) 2022-08-16
TW201901835A (zh) 2019-01-01
JP2023099172A (ja) 2023-07-11
TWI765984B (zh) 2022-06-01
CN110447095B (zh) 2024-04-26
KR20230131969A (ko) 2023-09-14
US11521869B2 (en) 2022-12-06
CN118538644A (zh) 2024-08-23
CN118538643A (zh) 2024-08-23

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