KR20250035046A - 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture) - Google Patents

선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture) Download PDF

Info

Publication number
KR20250035046A
KR20250035046A KR1020257007190A KR20257007190A KR20250035046A KR 20250035046 A KR20250035046 A KR 20250035046A KR 1020257007190 A KR1020257007190 A KR 1020257007190A KR 20257007190 A KR20257007190 A KR 20257007190A KR 20250035046 A KR20250035046 A KR 20250035046A
Authority
KR
South Korea
Prior art keywords
robot
load lock
transport
transfer
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257007190A
Other languages
English (en)
Korean (ko)
Inventor
리처드 에이치. 굴드
리처드 블랭크
Original Assignee
램 리써치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션
Publication of KR20250035046A publication Critical patent/KR20250035046A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H01L21/67742—
    • H01L21/67178—
    • H01L21/67201—
    • H01L21/67766—
    • H01L21/67769—
    • H01L21/68—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Prostheses (AREA)
KR1020257007190A 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture) Pending KR20250035046A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762471478P 2017-03-15 2017-03-15
US62/471,478 2017-03-15
KR1020237030422A KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
PCT/US2018/022397 WO2018170104A1 (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020237030422A Division KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)

Publications (1)

Publication Number Publication Date
KR20250035046A true KR20250035046A (ko) 2025-03-11

Family

ID=63523643

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020257007190A Pending KR20250035046A (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
KR1020197030174A Active KR102577199B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
KR1020237030422A Active KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020197030174A Active KR102577199B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
KR1020237030422A Active KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)

Country Status (8)

Country Link
US (3) US11521869B2 (https=)
EP (2) EP3596752B1 (https=)
JP (3) JP7275039B2 (https=)
KR (3) KR20250035046A (https=)
CN (3) CN110447095B (https=)
SG (2) SG10202110040SA (https=)
TW (2) TWI765984B (https=)
WO (1) WO2018170104A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
CN114026680A (zh) * 2019-02-14 2022-02-08 柿子技术公司 带有双连杆臂的线性机器人
US11164769B2 (en) * 2019-07-30 2021-11-02 Brooks Automation, Inc. Robot embedded vision apparatus
JP7705388B2 (ja) 2019-11-01 2025-07-09 ラム リサーチ コーポレーション 重力場センサを備えたウエハハンドリングロボット
CN111081619B (zh) * 2019-12-27 2022-11-25 上海至纯洁净系统科技股份有限公司 一种晶圆片传输装置以及方法
US12562356B2 (en) 2020-03-02 2026-02-24 Lam Research Corporation Linear arrangement for substrate processing tools
KR20250162936A (ko) * 2020-03-02 2025-11-19 램 리써치 코포레이션 기판 프로세싱 시스템들을 위한 칠러 (chiller) 메이크-브레이크 커넥터
WO2021206940A1 (en) * 2020-04-06 2021-10-14 Lam Research Corporation Slide and pivot assemblies for process module bias assemblies of substrate processing systems
CN113644005A (zh) * 2020-05-11 2021-11-12 中微半导体设备(上海)股份有限公司 一种半导体处理系统
CN114242631B (zh) * 2020-06-01 2026-04-24 上海果纳半导体技术有限公司 一种半导体设备
US11581203B2 (en) * 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space
KR102866529B1 (ko) * 2020-10-28 2025-09-30 삼성전자주식회사 반도체 소자의 제조 장치
JP2024518235A (ja) * 2021-04-28 2024-05-01 ラム リサーチ コーポレーション 半導体ツールの構成
KR102614918B1 (ko) * 2021-06-28 2023-12-20 세메스 주식회사 반송 어셈블리 및 이를 가지는 기판 처리 장치
JP7726746B2 (ja) 2021-11-09 2025-08-20 東京エレクトロン株式会社 基板処理システム
CN118511269A (zh) * 2021-11-11 2024-08-16 朗姆研究公司 用于高产能的嵌套式大气机械臂
KR20230111438A (ko) 2022-01-18 2023-07-25 삼성전자주식회사 반도체 기판 처리 장치
WO2023205361A1 (en) * 2022-04-22 2023-10-26 Lam Research Corporation Shallow-depth equipment front end module with robot
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
TWI874040B (zh) * 2023-12-13 2025-02-21 日商Ｊｅｌ股份有限公司 搬送裝置及搬送裝置之控制方法
KR102874818B1 (ko) * 2024-10-17 2025-10-22 주식회사 나인벨 쓰루풋이 향상된 듀얼 스캔 타입 이온 임플란트 시스템

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019233A (en) * 1988-10-31 1991-05-28 Eaton Corporation Sputtering system
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
JPH0982780A (ja) * 1995-09-18 1997-03-28 Kokusai Electric Co Ltd 基板搬送装置
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
JPH10335410A (ja) * 1997-05-29 1998-12-18 Sony Corp ウエハ搬送装置及びウエハアライメント方法
US6050891A (en) * 1998-02-06 2000-04-18 Applied Materials, Inc. Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment
JPH11238779A (ja) * 1998-02-23 1999-08-31 Mecs Corp 薄型基板搬送多関節ロボット
US6142722A (en) 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
JP4558981B2 (ja) * 2000-11-14 2010-10-06 株式会社ダイヘン トランスファロボット
US7066707B1 (en) 2001-08-31 2006-06-27 Asyst Technologies, Inc. Wafer engine
US7351291B2 (en) * 2002-02-20 2008-04-01 Tokyo Electron Limited Semiconductor processing system
JP2004006665A (ja) 2002-02-20 2004-01-08 Tokyo Electron Ltd 真空処理装置
AU2003259203A1 (en) * 2002-07-22 2004-02-09 Brooks Automation, Inc. Substrate processing apparatus
JP4283559B2 (ja) 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
US7905960B2 (en) * 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
US7246985B2 (en) * 2004-04-16 2007-07-24 Axcelis Technologies, Inc. Work-piece processing system
JP4907077B2 (ja) * 2004-11-30 2012-03-28 株式会社Ｓｅｎ ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
JP4619854B2 (ja) 2005-04-18 2011-01-26 東京エレクトロン株式会社 ロードロック装置及び処理方法
US20080206036A1 (en) * 2007-02-27 2008-08-28 Smith John M Magnetic media processing tool with storage bays and multi-axis robot arms
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR101413762B1 (ko) 2007-08-22 2014-07-01 위순임 기판 처리 시스템
CN101383311B (zh) * 2007-09-04 2010-12-08 北京北方微电子基地设备工艺研究中心有限责任公司 晶片传输系统
JP4473343B2 (ja) * 2007-11-09 2010-06-02 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置
KR100998663B1 (ko) 2010-05-24 2010-12-07 지이에스(주) 로드락챔버 진공형성장치
JP5387622B2 (ja) * 2011-06-17 2014-01-15 株式会社安川電機 搬送ロボット
KR20250119665A (ko) 2011-09-16 2025-08-07 퍼시몬 테크놀로지스 코포레이션 운송 장치 및 이를 포함하는 처리 장치
JP5810929B2 (ja) * 2012-01-13 2015-11-11 シンフォニアテクノロジー株式会社 ウェーハ搬送装置
US8961099B2 (en) * 2012-01-13 2015-02-24 Novellus Systems, Inc. Dual arm vacuum robot with common drive pulley
TWI629743B (zh) 2012-02-10 2018-07-11 布魯克斯自動機械公司 基材處理設備
US9213565B2 (en) 2013-06-28 2015-12-15 Vmware, Inc. Methods and systems for mining datacenter telemetry data
WO2015013266A1 (en) 2013-07-24 2015-01-29 Applied Materials, Inc Cobalt substrate processing systems, apparatus, and methods
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
JP6594304B2 (ja) * 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US9299598B2 (en) * 2013-12-23 2016-03-29 Lam Research Corp. Robot with integrated aligner
US10278501B2 (en) * 2014-04-25 2019-05-07 Applied Materials, Inc. Load lock door assembly, load lock apparatus, electronic device processing systems, and methods
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US10347516B2 (en) * 2014-11-11 2019-07-09 Applied Materials, Inc. Substrate transfer chamber
KR102417929B1 (ko) 2015-08-07 2022-07-06 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
JP6710518B2 (ja) * 2015-12-03 2020-06-17 東京エレクトロン株式会社 搬送装置及び補正方法
JP2018174186A (ja) * 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
TWI793000B (zh) 2023-02-11
EP3596752A1 (en) 2020-01-22
EP3596752B1 (en) 2025-01-08
KR102577199B1 (ko) 2023-09-08
KR102778382B1 (ko) 2025-03-06
CN110447095A (zh) 2019-11-12
EP3596752A4 (en) 2021-01-06
JP2020510310A (ja) 2020-04-02
EP4456120A2 (en) 2024-10-30
EP4456120A3 (en) 2025-01-01
JP7275039B2 (ja) 2023-05-17
SG10202110040SA (en) 2021-10-28
JP2025038126A (ja) 2025-03-18
US20240194505A1 (en) 2024-06-13
WO2018170104A1 (en) 2018-09-20
KR20190120834A (ko) 2019-10-24
SG11201908188SA (en) 2019-10-30
JP7608512B2 (ja) 2025-01-06
US20200083071A1 (en) 2020-03-12
US11908714B2 (en) 2024-02-20
US20230062737A1 (en) 2023-03-02
TW202232632A (zh) 2022-08-16
TW201901835A (zh) 2019-01-01
JP2023099172A (ja) 2023-07-11
TWI765984B (zh) 2022-06-01
CN110447095B (zh) 2024-04-26
KR20230131969A (ko) 2023-09-14
US11521869B2 (en) 2022-12-06
CN118538644A (zh) 2024-08-23
CN118538643A (zh) 2024-08-23

Similar Documents

Publication Publication Date Title
KR102778382B1 (ko) 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
JP7440592B2 (ja) 最適化された低エネルギ／高生産性の蒸着システム
US10559483B2 (en) Platform architecture to improve system productivity
KR102706036B1 (ko) 기판 이송 챔버 이동
JP7854393B2 (ja) 基板処理ツール用の直線配置
TW202609860A (zh) 基板處理工具的線性配置

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000