TWI765984B - 具有線性真空傳送模組之降低的覆蓋區域平台架構 - Google Patents

具有線性真空傳送模組之降低的覆蓋區域平台架構 Download PDF

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Publication number
TWI765984B
TWI765984B TW107108573A TW107108573A TWI765984B TW I765984 B TWI765984 B TW I765984B TW 107108573 A TW107108573 A TW 107108573A TW 107108573 A TW107108573 A TW 107108573A TW I765984 B TWI765984 B TW I765984B
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TW
Taiwan
Prior art keywords
transfer
robot
transfer robot
atv
module
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TW107108573A
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English (en)
Chinese (zh)
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TW201901835A (zh
Inventor
理查 Ｈ 古德
理查 布蘭克
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美商蘭姆研究公司
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Publication of TW201901835A publication Critical patent/TW201901835A/zh
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Publication of TWI765984B publication Critical patent/TWI765984B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Prostheses (AREA)
TW107108573A 2017-03-15 2018-03-14 具有線性真空傳送模組之降低的覆蓋區域平台架構 TWI765984B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762471478P 2017-03-15 2017-03-15
US62/471,478 2017-03-15

Publications (2)

Publication Number Publication Date
TW201901835A TW201901835A (zh) 2019-01-01
TWI765984B true TWI765984B (zh) 2022-06-01

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW107108573A TWI765984B (zh) 2017-03-15 2018-03-14 具有線性真空傳送模組之降低的覆蓋區域平台架構
TW111116765A TWI793000B (zh) 2017-03-15 2018-03-14 具有線性真空傳送模組之降低的覆蓋區域平台架構

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111116765A TWI793000B (zh) 2017-03-15 2018-03-14 具有線性真空傳送模組之降低的覆蓋區域平台架構

Country Status (8)

Country Link
US (3) US11521869B2 (https=)
EP (2) EP3596752B1 (https=)
JP (3) JP7275039B2 (https=)
KR (3) KR20250035046A (https=)
CN (3) CN110447095B (https=)
SG (2) SG10202110040SA (https=)
TW (2) TWI765984B (https=)
WO (1) WO2018170104A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
CN114026680A (zh) * 2019-02-14 2022-02-08 柿子技术公司 带有双连杆臂的线性机器人
US11164769B2 (en) * 2019-07-30 2021-11-02 Brooks Automation, Inc. Robot embedded vision apparatus
JP7705388B2 (ja) 2019-11-01 2025-07-09 ラム リサーチ コーポレーション 重力場センサを備えたウエハハンドリングロボット
CN111081619B (zh) * 2019-12-27 2022-11-25 上海至纯洁净系统科技股份有限公司 一种晶圆片传输装置以及方法
US12562356B2 (en) 2020-03-02 2026-02-24 Lam Research Corporation Linear arrangement for substrate processing tools
KR20250162936A (ko) * 2020-03-02 2025-11-19 램 리써치 코포레이션 기판 프로세싱 시스템들을 위한 칠러 (chiller) 메이크-브레이크 커넥터
WO2021206940A1 (en) * 2020-04-06 2021-10-14 Lam Research Corporation Slide and pivot assemblies for process module bias assemblies of substrate processing systems
CN113644005A (zh) * 2020-05-11 2021-11-12 中微半导体设备(上海)股份有限公司 一种半导体处理系统
CN114242631B (zh) * 2020-06-01 2026-04-24 上海果纳半导体技术有限公司 一种半导体设备
US11581203B2 (en) * 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space
KR102866529B1 (ko) * 2020-10-28 2025-09-30 삼성전자주식회사 반도체 소자의 제조 장치
JP2024518235A (ja) * 2021-04-28 2024-05-01 ラム リサーチ コーポレーション 半導体ツールの構成
KR102614918B1 (ko) * 2021-06-28 2023-12-20 세메스 주식회사 반송 어셈블리 및 이를 가지는 기판 처리 장치
JP7726746B2 (ja) 2021-11-09 2025-08-20 東京エレクトロン株式会社 基板処理システム
CN118511269A (zh) * 2021-11-11 2024-08-16 朗姆研究公司 用于高产能的嵌套式大气机械臂
KR20230111438A (ko) 2022-01-18 2023-07-25 삼성전자주식회사 반도체 기판 처리 장치
WO2023205361A1 (en) * 2022-04-22 2023-10-26 Lam Research Corporation Shallow-depth equipment front end module with robot
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
TWI874040B (zh) * 2023-12-13 2025-02-21 日商Ｊｅｌ股份有限公司 搬送裝置及搬送裝置之控制方法
KR102874818B1 (ko) * 2024-10-17 2025-10-22 주식회사 나인벨 쓰루풋이 향상된 듀얼 스캔 타입 이온 임플란트 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999065803A1 (en) * 1998-06-17 1999-12-23 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
US20080206036A1 (en) * 2007-02-27 2008-08-28 Smith John M Magnetic media processing tool with storage bays and multi-axis robot arms
WO2015057959A1 (en) * 2013-10-18 2015-04-23 Brooks Automation, Inc. Processing apparatus
US20150179488A1 (en) * 2013-12-23 2015-06-25 Lam Research Corporation Robot with integrated aligner
US20150311102A1 (en) * 2014-04-25 2015-10-29 Applied Materials, Inc. Load lock door assembly, load lock apparatus, electronic device processing systems, and methods

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019233A (en) * 1988-10-31 1991-05-28 Eaton Corporation Sputtering system
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
JPH0982780A (ja) * 1995-09-18 1997-03-28 Kokusai Electric Co Ltd 基板搬送装置
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
JPH10335410A (ja) * 1997-05-29 1998-12-18 Sony Corp ウエハ搬送装置及びウエハアライメント方法
US6050891A (en) * 1998-02-06 2000-04-18 Applied Materials, Inc. Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment
JPH11238779A (ja) * 1998-02-23 1999-08-31 Mecs Corp 薄型基板搬送多関節ロボット
JP4558981B2 (ja) * 2000-11-14 2010-10-06 株式会社ダイヘン トランスファロボット
US7066707B1 (en) 2001-08-31 2006-06-27 Asyst Technologies, Inc. Wafer engine
US7351291B2 (en) * 2002-02-20 2008-04-01 Tokyo Electron Limited Semiconductor processing system
JP2004006665A (ja) 2002-02-20 2004-01-08 Tokyo Electron Ltd 真空処理装置
AU2003259203A1 (en) * 2002-07-22 2004-02-09 Brooks Automation, Inc. Substrate processing apparatus
JP4283559B2 (ja) 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
US7905960B2 (en) * 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
US7246985B2 (en) * 2004-04-16 2007-07-24 Axcelis Technologies, Inc. Work-piece processing system
JP4907077B2 (ja) * 2004-11-30 2012-03-28 株式会社Ｓｅｎ ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
JP4619854B2 (ja) 2005-04-18 2011-01-26 東京エレクトロン株式会社 ロードロック装置及び処理方法
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR101413762B1 (ko) 2007-08-22 2014-07-01 위순임 기판 처리 시스템
CN101383311B (zh) * 2007-09-04 2010-12-08 北京北方微电子基地设备工艺研究中心有限责任公司 晶片传输系统
JP4473343B2 (ja) * 2007-11-09 2010-06-02 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置
KR100998663B1 (ko) 2010-05-24 2010-12-07 지이에스(주) 로드락챔버 진공형성장치
JP5387622B2 (ja) * 2011-06-17 2014-01-15 株式会社安川電機 搬送ロボット
KR20250119665A (ko) 2011-09-16 2025-08-07 퍼시몬 테크놀로지스 코포레이션 운송 장치 및 이를 포함하는 처리 장치
JP5810929B2 (ja) * 2012-01-13 2015-11-11 シンフォニアテクノロジー株式会社 ウェーハ搬送装置
US8961099B2 (en) * 2012-01-13 2015-02-24 Novellus Systems, Inc. Dual arm vacuum robot with common drive pulley
TWI629743B (zh) 2012-02-10 2018-07-11 布魯克斯自動機械公司 基材處理設備
US9213565B2 (en) 2013-06-28 2015-12-15 Vmware, Inc. Methods and systems for mining datacenter telemetry data
WO2015013266A1 (en) 2013-07-24 2015-01-29 Applied Materials, Inc Cobalt substrate processing systems, apparatus, and methods
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US10347516B2 (en) * 2014-11-11 2019-07-09 Applied Materials, Inc. Substrate transfer chamber
KR102417929B1 (ko) 2015-08-07 2022-07-06 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
JP6710518B2 (ja) * 2015-12-03 2020-06-17 東京エレクトロン株式会社 搬送装置及び補正方法
JP2018174186A (ja) * 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999065803A1 (en) * 1998-06-17 1999-12-23 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
US20080206036A1 (en) * 2007-02-27 2008-08-28 Smith John M Magnetic media processing tool with storage bays and multi-axis robot arms
WO2015057959A1 (en) * 2013-10-18 2015-04-23 Brooks Automation, Inc. Processing apparatus
US20150179488A1 (en) * 2013-12-23 2015-06-25 Lam Research Corporation Robot with integrated aligner
US20150311102A1 (en) * 2014-04-25 2015-10-29 Applied Materials, Inc. Load lock door assembly, load lock apparatus, electronic device processing systems, and methods

Also Published As

Publication number Publication date
TWI793000B (zh) 2023-02-11
EP3596752A1 (en) 2020-01-22
EP3596752B1 (en) 2025-01-08
KR102577199B1 (ko) 2023-09-08
KR102778382B1 (ko) 2025-03-06
CN110447095A (zh) 2019-11-12
EP3596752A4 (en) 2021-01-06
JP2020510310A (ja) 2020-04-02
EP4456120A2 (en) 2024-10-30
EP4456120A3 (en) 2025-01-01
JP7275039B2 (ja) 2023-05-17
SG10202110040SA (en) 2021-10-28
JP2025038126A (ja) 2025-03-18
US20240194505A1 (en) 2024-06-13
WO2018170104A1 (en) 2018-09-20
KR20250035046A (ko) 2025-03-11
KR20190120834A (ko) 2019-10-24
SG11201908188SA (en) 2019-10-30
JP7608512B2 (ja) 2025-01-06
US20200083071A1 (en) 2020-03-12
US11908714B2 (en) 2024-02-20
US20230062737A1 (en) 2023-03-02
TW202232632A (zh) 2022-08-16
TW201901835A (zh) 2019-01-01
JP2023099172A (ja) 2023-07-11
CN110447095B (zh) 2024-04-26
KR20230131969A (ko) 2023-09-14
US11521869B2 (en) 2022-12-06
CN118538644A (zh) 2024-08-23
CN118538643A (zh) 2024-08-23

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