JP7260526B2 - 表示装置及びその製造方法 - Google Patents

表示装置及びその製造方法 Download PDF

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Publication number
JP7260526B2
JP7260526B2 JP2020512507A JP2020512507A JP7260526B2 JP 7260526 B2 JP7260526 B2 JP 7260526B2 JP 2020512507 A JP2020512507 A JP 2020512507A JP 2020512507 A JP2020512507 A JP 2020512507A JP 7260526 B2 JP7260526 B2 JP 7260526B2
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light emitting
emitting modules
line terminals
display device
light
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JP2020532762A5 (https=
JP2020532762A (ja
Inventor
元伸 竹谷
ソン ス ソン,
ジョン イク リ,
ソン シク ホン,
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Seoul Semiconductor Co Ltd
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Seoul Semiconductor Co Ltd
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Priority to JP2021154042A priority Critical patent/JP7170809B2/ja
Priority to JP2021154305A priority patent/JP7178466B2/ja
Publication of JP2020532762A5 publication Critical patent/JP2020532762A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections

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  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Devices (AREA)
JP2020512507A 2017-09-04 2018-09-04 表示装置及びその製造方法 Active JP7260526B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021154042A JP7170809B2 (ja) 2017-09-04 2021-09-22 発光装置
JP2021154305A JP7178466B2 (ja) 2017-09-04 2021-09-22 表示装置

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR10-2017-0112750 2017-09-04
KR20170112750 2017-09-04
KR10-2017-0120303 2017-09-19
KR20170120303 2017-09-19
KR20170124432 2017-09-26
KR10-2017-0124432 2017-09-26
PCT/KR2018/010291 WO2019045549A1 (ko) 2017-09-04 2018-09-04 표시 장치 및 그의 제조 방법

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2021154305A Division JP7178466B2 (ja) 2017-09-04 2021-09-22 表示装置
JP2021154042A Division JP7170809B2 (ja) 2017-09-04 2021-09-22 発光装置

Publications (3)

Publication Number Publication Date
JP2020532762A JP2020532762A (ja) 2020-11-12
JP2020532762A5 JP2020532762A5 (https=) 2021-10-14
JP7260526B2 true JP7260526B2 (ja) 2023-04-18

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JP2020512507A Active JP7260526B2 (ja) 2017-09-04 2018-09-04 表示装置及びその製造方法
JP2021154305A Active JP7178466B2 (ja) 2017-09-04 2021-09-22 表示装置
JP2021154042A Active JP7170809B2 (ja) 2017-09-04 2021-09-22 発光装置

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JP2021154305A Active JP7178466B2 (ja) 2017-09-04 2021-09-22 表示装置
JP2021154042A Active JP7170809B2 (ja) 2017-09-04 2021-09-22 発光装置

Country Status (6)

Country Link
US (6) US11282820B2 (https=)
EP (2) EP3680932B1 (https=)
JP (3) JP7260526B2 (https=)
KR (2) KR102689439B1 (https=)
CN (4) CN118263235A (https=)
WO (1) WO2019045549A1 (https=)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102415343B1 (ko) * 2017-09-25 2022-06-30 엘지전자 주식회사 디스플레이 디바이스
TWI816727B (zh) * 2018-12-26 2023-10-01 晶元光電股份有限公司 發光二極體顯示器
CN109888085B (zh) * 2019-03-11 2021-01-26 京东方科技集团股份有限公司 显示面板及其制备方法
US11450648B2 (en) 2019-03-19 2022-09-20 Seoul Viosys Co., Ltd. Light emitting device package and application thereof
US11437551B2 (en) 2019-03-19 2022-09-06 Seoul Viosys Co., Ltd. Light emitting device package and application thereof
US11355686B2 (en) * 2019-03-29 2022-06-07 Seoul Semiconductor Co., Ltd. Unit pixel having light emitting device, pixel module and displaying apparatus
WO2020226369A1 (en) * 2019-05-03 2020-11-12 Samsung Electronics Co., Ltd. Light emitting diode module
US11482586B2 (en) * 2019-07-31 2022-10-25 Beijing Boe Technology Development Co., Ltd. Array substrate having groups of transistors with source and drain electrode indifferent layers
TWI730385B (zh) * 2019-08-23 2021-06-11 力晶積成電子製造股份有限公司 插塞偏移的監控測試結構
KR102784811B1 (ko) * 2019-09-04 2025-03-24 삼성전자주식회사 발광 패키지 및 이를 포함하는 디스플레이 소자
WO2021051924A1 (zh) * 2019-09-18 2021-03-25 泉州三安半导体科技有限公司 发光二极管封装组件
KR102244667B1 (ko) * 2019-10-17 2021-04-23 이명종 마이크로 엘이디 픽셀 패키지의 제조 방법 및 이에 의해 제조된 마이크로 엘이디 픽셀 패키지
US11489002B2 (en) * 2019-10-29 2022-11-01 Seoul Viosys Co., Ltd. LED display apparatus
US11664355B2 (en) * 2019-12-02 2023-05-30 Seoul Semiconductor Co., Ltd. Display apparatus
US11757073B2 (en) * 2019-12-28 2023-09-12 Seoul Viosys Co., Ltd. Light emitting device and LED display apparatus having the same
US11881473B2 (en) * 2020-01-09 2024-01-23 Seoul Semiconductor Co., Ltd. Display apparatus
US11476301B2 (en) * 2020-01-14 2022-10-18 Au Optronics Corporation Display apparatus and manufacturing method thereof
CN113498554B (zh) * 2020-01-21 2024-09-17 京东方科技集团股份有限公司 发光板、线路板以及显示装置
KR102818698B1 (ko) * 2020-01-22 2025-06-10 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
JP2021125616A (ja) * 2020-02-07 2021-08-30 ソニーセミコンダクタソリューションズ株式会社 表示装置
US11843077B2 (en) * 2020-02-11 2023-12-12 Seoul Viosys Co., Ltd. Unit pixel having light emitting device and displaying apparatus
US12355017B2 (en) * 2020-02-19 2025-07-08 Innolux Corporation Display panel and tiled display device
CN113362726A (zh) * 2020-02-19 2021-09-07 群创光电股份有限公司 显示面板与拼接显示装置
KR20210122406A (ko) * 2020-03-31 2021-10-12 삼성디스플레이 주식회사 표시패널 및 그 제조방법
US11949055B2 (en) 2020-05-22 2024-04-02 Seoul Viosys Co., Ltd. Unit pixel having light emitting device and displaying apparatus
JP7418568B2 (ja) * 2020-05-26 2024-01-19 京セラ株式会社 表示装置および複合型表示装置
KR102382049B1 (ko) 2020-05-29 2022-04-04 삼성전자주식회사 모듈러 디스플레이 장치 및 그 제어 방법
US11355473B2 (en) * 2020-06-16 2022-06-07 A.U. Vista, Inc. Tiled light emitting diode display panel having different resistance per unit length signal lines
US20210399041A1 (en) * 2020-06-18 2021-12-23 Seoul Semiconductor Co., Ltd. Light emitting module having a plurality of unit pixels, method of fabricating the same, and displaying apparatus having the same
KR102781957B1 (ko) 2020-07-07 2025-03-18 삼성전자주식회사 디스플레이 모듈 및 그 제조 방법
US12119333B2 (en) 2020-07-08 2024-10-15 Lg Electronics Inc. Display apparatus using semiconductor light-emitting device
JP7581685B2 (ja) * 2020-07-27 2024-11-13 沖電気工業株式会社 発光装置、発光ディスプレイ、及び発光装置の製造方法
US11296269B2 (en) * 2020-07-30 2022-04-05 Lextar Electronics Corporation Light emitting diode packaging structure and method for manufacturing the same
US11495149B2 (en) * 2020-08-24 2022-11-08 PlayNitride Display Co., Ltd. Display apparatus
US12027654B2 (en) * 2020-09-11 2024-07-02 Seoul Viosys Co., Ltd. Unit pixel having light emitting device and displaying apparatus
KR102924542B1 (ko) * 2020-09-16 2026-02-09 삼성디스플레이 주식회사 표시 장치
US12439758B2 (en) 2020-10-09 2025-10-07 Seoul Viosys Co., Ltd. Wafer having auxiliary pattern for aligning light emitting device and method of fabricating unit pixel using the same
US12080687B2 (en) * 2020-10-16 2024-09-03 Seoul Viosys Co., Ltd. Unit pixel having light emitting device, method of fabricating the same, and displaying apparatus having the same
EP4167218A4 (en) * 2020-11-06 2023-07-26 Samsung Electronics Co., Ltd. DISPLAY MODULE, DISPLAY DEVICE AND METHOD OF MANUFACTURE THEREOF
JP2022079295A (ja) * 2020-11-16 2022-05-26 沖電気工業株式会社 複合集積フィルム、複合集積フィルム供給ウェハ及び半導体複合装置
KR102925292B1 (ko) * 2020-11-16 2026-02-06 엘지디스플레이 주식회사 표시 장치
CN112397669B (zh) * 2020-11-26 2024-01-23 武汉天马微电子有限公司 显示模组及其制作方法、显示装置
US11901481B2 (en) * 2020-12-04 2024-02-13 Lumileds Llc Reduction of defective pixel appearance in light-emitting arrays
CN114725158A (zh) * 2021-01-06 2022-07-08 群创光电股份有限公司 发光装置
KR102539565B1 (ko) * 2021-01-21 2023-06-05 주식회사 포톤웨이브 자외선 발광소자
US12568726B2 (en) * 2021-02-17 2026-03-03 Innolux Corporation Electronic device having light-emitting diode display modules configured for reducing gap sizes at splices of modules
US12218293B2 (en) 2021-02-18 2025-02-04 Seoul Viosys Co., Ltd. Pixel module employing molding member having multi-molding layer and displaying apparatus having the same
US12438131B2 (en) 2021-05-28 2025-10-07 Industrial Technology Research Institute Display apparatus
TWI789133B (zh) * 2021-05-28 2023-01-01 財團法人工業技術研究院 顯示裝置
TWI776549B (zh) * 2021-06-15 2022-09-01 光鋐科技股份有限公司 微型發光薄膜結構及其製造方法
US12193180B2 (en) * 2021-06-15 2025-01-07 Innolux Corporation Electronic device
US12237316B2 (en) 2021-06-25 2025-02-25 Boe Technology Group Co., Ltd. Display substrate, tiled display panel and display device
TWI775530B (zh) * 2021-07-13 2022-08-21 友達光電股份有限公司 顯示裝置
CN115020394B (zh) * 2021-08-30 2025-11-11 友达光电股份有限公司 显示组件、包含其的显示装置及显示装置的制造方法
CN117916789A (zh) * 2021-09-09 2024-04-19 京瓷株式会社 显示装置以及多屏显示器
KR102605143B1 (ko) * 2021-10-18 2023-11-23 김범식 표시패널 및 이를 포함하는 표시장치
JP7739964B2 (ja) * 2021-11-17 2025-09-17 沖電気工業株式会社 電子構造体及び電子回路の製造方法
EP4379802A4 (en) * 2021-12-02 2024-12-25 Samsung Electronics Co., Ltd. DISPLAY MODULE AND DISPLAY DEVICE THEREFOR
TWI806275B (zh) * 2021-12-08 2023-06-21 欣興電子股份有限公司 發光二極體封裝及其製作方法
KR102436566B1 (ko) * 2022-03-22 2022-08-25 주식회사 서브뮬레드 단면 폴리머 기판 대응형 능동구동 led 패키지 및 그를 포함하는 led 매트릭스
KR102798054B1 (ko) * 2022-06-22 2025-04-22 주식회사 글로우원 디스플레이 모듈 및 디스플레이 모듈을 포함한 디스플레이 장치
EP4325471B1 (en) * 2022-07-05 2025-10-01 Jiangxi MTC Visual Display Co., Ltd Led lamp panel structure
KR20240084305A (ko) * 2022-12-06 2024-06-13 엘지디스플레이 주식회사 표시 장치
TWI835452B (zh) * 2022-12-07 2024-03-11 友達光電股份有限公司 發光裝置及其製造方法
KR20240098502A (ko) * 2022-12-21 2024-06-28 엘지디스플레이 주식회사 마이크로 엘이디 표시 장치 및 타일링 표시 장치
CN116137119B (zh) * 2023-01-20 2025-03-21 武汉天马微电子有限公司 显示面板及显示装置
US20240310566A1 (en) * 2023-03-16 2024-09-19 Apple Inc. Waveguide Display with Staircase Grating Input Coupler
KR102862338B1 (ko) * 2023-08-10 2025-10-17 주식회사 글로벌테크놀로지 디스플레이 일체형 구동 패키지 및 이의 제조 방법
CN221595885U (zh) * 2023-12-01 2024-08-23 林剑涵 一种透明发光模组及透明显示屏
CN120187241B (zh) * 2025-05-21 2025-10-21 合肥维信诺科技有限公司 显示面板母板、显示面板及显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140572A (ja) 2001-10-31 2003-05-16 Sony Corp 画像表示装置及びその製造方法
JP2003150075A (ja) 2001-11-15 2003-05-21 Sony Corp パネルモジュールのタイリング構造、パネルモジュールの接続方法、画像表示装置及びその製造方法
JP2003216072A (ja) 2002-01-17 2003-07-30 Sony Corp 画像表示装置及びその製造方法
JP2009177117A (ja) 2007-12-25 2009-08-06 Toshiba Lighting & Technology Corp 表示装置
CN101702401A (zh) 2009-11-03 2010-05-05 中山大学 一种GaN基LED薄膜器件的制备与批处理式封装方法
JP2015169760A (ja) 2014-03-06 2015-09-28 株式会社ジャパンディスプレイ 表示装置の製造方法、表示装置および表示装置形成基板
US20160267835A1 (en) 2013-10-28 2016-09-15 Barco N.V. Flexible display tile and method of producing same

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575083A (en) * 1980-06-13 1982-01-11 Tokyo Shibaura Electric Co Display unit
JP3195720B2 (ja) * 1994-12-20 2001-08-06 シャープ株式会社 多色led素子およびその多色led素子を用いたled表示装置、並びに多色led素子の製造方法
JP2000101149A (ja) * 1998-09-25 2000-04-07 Rohm Co Ltd 半導体発光素子
JP2002189121A (ja) * 2000-12-21 2002-07-05 Seiko Epson Corp カラーフィルタ基板、カラーフィルタ基板の製造方法及び液晶装置
JP2003150119A (ja) * 2001-08-27 2003-05-23 Horon Kk Ledマトリックス表示装置
KR100698044B1 (ko) * 2002-10-19 2007-03-23 엘지.필립스 엘시디 주식회사 마스크 설계 방법 및 패널 형성 방법
JP2004251981A (ja) * 2003-02-18 2004-09-09 Seiko Epson Corp 複合型表示装置
JP2005123153A (ja) * 2003-09-24 2005-05-12 Fuji Photo Film Co Ltd エレクトロルミネッセンス表示パネル、エレクトロルミネッセンス表示装置およびそれらの製造方法
KR100645657B1 (ko) 2004-05-04 2006-11-14 삼성전기주식회사 플립칩 인쇄회로기판 및 플립칩 인쇄회로기판을 구비한백색 발광 다이오드 모듈
JP4186952B2 (ja) 2005-05-25 2008-11-26 セイコーエプソン株式会社 端末装置、測位システム、端末装置の制御方法、プログラム及び記録媒体
KR20060134373A (ko) * 2005-06-22 2006-12-28 엘지전자 주식회사 듀얼 패널 장치
US7719099B2 (en) * 2005-10-21 2010-05-18 Advanced Optoelectronic Technology Inc. Package structure for solid-state lighting devices and method of fabricating the same
KR101171186B1 (ko) 2005-11-10 2012-08-06 삼성전자주식회사 고휘도 발광 다이오드 및 이를 이용한 액정 표시 장치
JP2007233220A (ja) 2006-03-03 2007-09-13 Seiko Epson Corp 液晶表示装置及び液晶表示装置の製造方法
JP5010198B2 (ja) 2006-07-26 2012-08-29 パナソニック株式会社 発光装置
KR100846509B1 (ko) 2006-12-22 2008-07-17 삼성전자주식회사 자구벽 이동을 이용한 정보 저장 장치 및 그 제조방법
KR20090063369A (ko) 2007-12-14 2009-06-18 삼성전자주식회사 컬러 표시 장치
JP2009176847A (ja) * 2008-01-23 2009-08-06 Citizen Electronics Co Ltd 発光ダイオード
CN102044600A (zh) * 2009-10-15 2011-05-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制备方法
JPWO2011108664A1 (ja) 2010-03-03 2013-06-27 有限会社Mtec 光半導体装置
WO2012002580A1 (ja) * 2010-07-01 2012-01-05 シチズンホールディングス株式会社 Led光源装置及びその製造方法
KR101144351B1 (ko) * 2010-09-30 2012-05-11 서울옵토디바이스주식회사 웨이퍼 레벨 발광다이오드 패키지 및 그 제조방법
US9092191B2 (en) * 2010-10-01 2015-07-28 Z124 Smart pad operation with differing aspect ratios
JP2012227294A (ja) * 2011-04-18 2012-11-15 Ibiden Co Ltd Led基板、発光モジュール、led基板の製造方法、及び発光モジュールの製造方法
JP2013026510A (ja) * 2011-07-22 2013-02-04 Rohm Co Ltd Ledモジュールおよびledモジュールの実装構造
JP6013067B2 (ja) * 2012-07-26 2016-10-25 株式会社ジャパンディスプレイ 表示装置及びその製造方法
CN103797531A (zh) * 2012-09-10 2014-05-14 深圳市柔宇科技有限公司 一种大尺寸显示屏及其制造方法
JP5985414B2 (ja) * 2013-02-19 2016-09-06 デクセリアルズ株式会社 異方性導電接着剤、発光装置及び異方性導電接着剤の製造方法
KR102082783B1 (ko) * 2013-07-23 2020-03-02 삼성디스플레이 주식회사 와이어 그리드 편광판 및 이를 구비하는 유기 발광 디스플레이 장치
KR101476688B1 (ko) 2013-10-24 2014-12-26 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
CN103807826A (zh) * 2014-01-27 2014-05-21 常州市武进区半导体照明应用技术研究院 软基板光源模组和其制造方法以及平面光源装置
JP2015197544A (ja) * 2014-03-31 2015-11-09 ソニー株式会社 実装基板および電子機器
JP2016110075A (ja) * 2014-10-03 2016-06-20 株式会社半導体エネルギー研究所 発光装置、モジュール、及び電子機器
TWI589031B (zh) 2014-10-20 2017-06-21 錼創科技股份有限公司 Light-emitting device transfer method
JP2016145273A (ja) * 2015-02-06 2016-08-12 コニカミノルタ株式会社 無機微粒子含有ポリシロキサン組成物、及びその製造方法
KR102377794B1 (ko) * 2015-07-06 2022-03-23 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR102465382B1 (ko) 2015-08-31 2022-11-10 삼성디스플레이 주식회사 표시장치 및 표시장치의 제조방법
US9477438B1 (en) * 2015-09-25 2016-10-25 Revolution Display, Llc Devices for creating mosaicked display systems, and display mosaic systems comprising same
KR102591388B1 (ko) * 2016-01-18 2023-10-19 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
WO2017146477A1 (ko) 2016-02-26 2017-08-31 서울반도체주식회사 디스플레이 장치 및 그의 제조 방법
KR101845907B1 (ko) * 2016-02-26 2018-04-06 피에스아이 주식회사 초소형 led 모듈을 포함하는 디스플레이 장치
KR20170102782A (ko) * 2016-03-02 2017-09-12 엘지이노텍 주식회사 발광 모듈 및 표시장치
KR102573587B1 (ko) * 2016-06-21 2023-09-01 엘지이노텍 주식회사 반도체 소자 및 이를 포함하는 표시 장치
KR102480220B1 (ko) * 2016-04-08 2022-12-26 삼성전자주식회사 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널
JP2018022225A (ja) * 2016-08-01 2018-02-08 株式会社ジャパンディスプレイ 圧力検出装置およびこれを備える表示装置
JP2018049104A (ja) * 2016-09-21 2018-03-29 パナソニック液晶ディスプレイ株式会社 液晶表示装置
US11011555B2 (en) * 2016-10-12 2021-05-18 Shaoher Pan Fabricating integrated light-emitting pixel arrays for displays
US10445048B2 (en) * 2016-12-30 2019-10-15 Shaoher Pan Larger displays formed by multiple integrated LED array micro-displays
US10832609B2 (en) * 2017-01-10 2020-11-10 X Display Company Technology Limited Digital-drive pulse-width-modulated output system
KR102806285B1 (ko) * 2017-02-02 2025-05-14 서울반도체 주식회사 발광 다이오드 유닛

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140572A (ja) 2001-10-31 2003-05-16 Sony Corp 画像表示装置及びその製造方法
JP2003150075A (ja) 2001-11-15 2003-05-21 Sony Corp パネルモジュールのタイリング構造、パネルモジュールの接続方法、画像表示装置及びその製造方法
JP2003216072A (ja) 2002-01-17 2003-07-30 Sony Corp 画像表示装置及びその製造方法
JP2009177117A (ja) 2007-12-25 2009-08-06 Toshiba Lighting & Technology Corp 表示装置
CN101702401A (zh) 2009-11-03 2010-05-05 中山大学 一种GaN基LED薄膜器件的制备与批处理式封装方法
US20160267835A1 (en) 2013-10-28 2016-09-15 Barco N.V. Flexible display tile and method of producing same
JP2015169760A (ja) 2014-03-06 2015-09-28 株式会社ジャパンディスプレイ 表示装置の製造方法、表示装置および表示装置形成基板

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