JP7233156B2 - 異方導電性フィルム及び接続構造体 - Google Patents

異方導電性フィルム及び接続構造体 Download PDF

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Publication number
JP7233156B2
JP7233156B2 JP2016106500A JP2016106500A JP7233156B2 JP 7233156 B2 JP7233156 B2 JP 7233156B2 JP 2016106500 A JP2016106500 A JP 2016106500A JP 2016106500 A JP2016106500 A JP 2016106500A JP 7233156 B2 JP7233156 B2 JP 7233156B2
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Prior art keywords
axis
conductive particles
conductive
particles
particle
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JP2016106500A
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Japanese (ja)
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JP2016225296A5 (enExample
JP2016225296A (ja
Inventor
誠一郎 篠原
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Dexerials Corp
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Dexerials Corp
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Publication of JP2016225296A publication Critical patent/JP2016225296A/ja
Publication of JP2016225296A5 publication Critical patent/JP2016225296A5/ja
Priority to JP2021207342A priority Critical patent/JP7356046B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H10W72/073—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H10W72/013—
    • H10W72/01315—
    • H10W72/01335—
    • H10W72/074—
    • H10W72/261—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W90/732—
    • H10W90/734—
    • H10W99/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
JP2016106500A 2015-05-27 2016-05-27 異方導電性フィルム及び接続構造体 Active JP7233156B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021207342A JP7356046B2 (ja) 2015-05-27 2021-12-21 異方導電性フィルム及び接続構造体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015120627 2015-05-27
JP2015120627 2015-05-27
JP2015108662 2015-05-28
JP2015108662 2015-05-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021207342A Division JP7356046B2 (ja) 2015-05-27 2021-12-21 異方導電性フィルム及び接続構造体

Publications (3)

Publication Number Publication Date
JP2016225296A JP2016225296A (ja) 2016-12-28
JP2016225296A5 JP2016225296A5 (enExample) 2019-06-20
JP7233156B2 true JP7233156B2 (ja) 2023-03-06

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Family Applications (2)

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JP2016106500A Active JP7233156B2 (ja) 2015-05-27 2016-05-27 異方導電性フィルム及び接続構造体
JP2021207342A Active JP7356046B2 (ja) 2015-05-27 2021-12-21 異方導電性フィルム及び接続構造体

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JP2021207342A Active JP7356046B2 (ja) 2015-05-27 2021-12-21 異方導電性フィルム及び接続構造体

Country Status (6)

Country Link
US (2) US10546831B2 (enExample)
JP (2) JP7233156B2 (enExample)
KR (2) KR102042400B1 (enExample)
CN (2) CN111640528B (enExample)
TW (1) TWI711222B (enExample)
WO (1) WO2016190432A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546831B2 (en) * 2015-05-27 2020-01-28 Dexerials Corporation Anisotropic electrically conductive film and connection structure
CN107452634B (zh) 2016-05-17 2021-03-09 台湾积体电路制造股份有限公司 封装件结构及其形成方法
KR102803081B1 (ko) * 2018-01-17 2025-05-07 세키스이가가쿠 고교가부시키가이샤 조광 적층체 및 조광 적층체용 수지 스페이서
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
KR102519126B1 (ko) * 2018-03-30 2023-04-06 삼성디스플레이 주식회사 표시 장치
JP7313913B2 (ja) * 2018-06-06 2023-07-25 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
WO2019235596A1 (ja) * 2018-06-06 2019-12-12 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
US11694988B2 (en) 2018-08-08 2023-07-04 Dexerials Corporation Anisotropic conductive film
JP2020095922A (ja) * 2018-12-14 2020-06-18 デクセリアルズ株式会社 異方性導電フィルム
US11488841B2 (en) * 2019-02-20 2022-11-01 Electronics And Telecommunications Research Institute Method for manufacturing semiconductor package
US20230176263A1 (en) * 2020-02-12 2023-06-08 Dexerials Corporation Pseudo random dot pattern and creation method of same
KR102774692B1 (ko) 2020-03-10 2025-03-05 삼성디스플레이 주식회사 표시장치
US12418130B2 (en) * 2020-03-19 2025-09-16 Dexerials Corporation Connection body and method for manufacturing connection body
KR20210152066A (ko) * 2020-06-05 2021-12-15 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법
KR20230134656A (ko) * 2022-03-14 2023-09-22 삼성디스플레이 주식회사 이방성 도전 필름 및 이를 포함하는 표시 장치

Citations (2)

* Cited by examiner, † Cited by third party
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JP2003208931A (ja) 2002-10-04 2003-07-25 Hitachi Chem Co Ltd 接続部材
WO2014034741A1 (ja) 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

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BE794600A (fr) 1972-01-28 1973-05-16 Usel Hubert Cartouche sans etui pour mise a feu electrique
JPH0574512A (ja) * 1991-09-12 1993-03-26 Japan Aviation Electron Ind Ltd 電気接続用コネクタ
JPH09320345A (ja) 1996-05-31 1997-12-12 Whitaker Corp:The 異方導電性フィルム
JP3624818B2 (ja) 1999-10-12 2005-03-02 ソニーケミカル株式会社 異方性導電接続材料、接続体、およびその製造方法
JP2005327509A (ja) 2004-05-12 2005-11-24 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP4887700B2 (ja) 2005-09-09 2012-02-29 住友ベークライト株式会社 異方導電性フィルムおよび電子・電機機器
JP2009076431A (ja) * 2007-01-31 2009-04-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
CN101556838B (zh) * 2008-04-09 2011-06-01 北京京东方光电科技有限公司 各向异性导电膜
JP5185839B2 (ja) 2009-01-07 2013-04-17 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP6061443B2 (ja) 2010-12-24 2017-01-18 デクセリアルズ株式会社 異方性導電接着フィルム、接続構造体及びその製造方法
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JP6333626B2 (ja) 2013-05-29 2018-05-30 積水化学工業株式会社 突起粒子、導電性粒子、導電材料及び接続構造体
US10546831B2 (en) * 2015-05-27 2020-01-28 Dexerials Corporation Anisotropic electrically conductive film and connection structure

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Publication number Priority date Publication date Assignee Title
JP2003208931A (ja) 2002-10-04 2003-07-25 Hitachi Chem Co Ltd 接続部材
WO2014034741A1 (ja) 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

Also Published As

Publication number Publication date
CN111640528A (zh) 2020-09-08
US10892243B2 (en) 2021-01-12
HK1246509A1 (zh) 2018-09-07
JP2022043193A (ja) 2022-03-15
TWI711222B (zh) 2020-11-21
JP2016225296A (ja) 2016-12-28
US20180301432A1 (en) 2018-10-18
KR20190126456A (ko) 2019-11-11
WO2016190432A1 (ja) 2016-12-01
CN107534231A (zh) 2018-01-02
KR102449287B1 (ko) 2022-09-29
CN111640528B (zh) 2022-06-28
JP7356046B2 (ja) 2023-10-04
CN107534231B (zh) 2020-04-14
US20200161268A1 (en) 2020-05-21
KR20170134679A (ko) 2017-12-06
TW201717489A (zh) 2017-05-16
KR102042400B1 (ko) 2019-11-08
US10546831B2 (en) 2020-01-28

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