JP7215327B2 - 積層型コイル部品 - Google Patents

積層型コイル部品 Download PDF

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Publication number
JP7215327B2
JP7215327B2 JP2019097639A JP2019097639A JP7215327B2 JP 7215327 B2 JP7215327 B2 JP 7215327B2 JP 2019097639 A JP2019097639 A JP 2019097639A JP 2019097639 A JP2019097639 A JP 2019097639A JP 7215327 B2 JP7215327 B2 JP 7215327B2
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JP
Japan
Prior art keywords
coil
conductor
laminated
external electrode
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019097639A
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English (en)
Japanese (ja)
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JP2020194805A (ja
Inventor
敦夫 比留川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2019097639A priority Critical patent/JP7215327B2/ja
Priority to CN202010435408.7A priority patent/CN111986875B/zh
Priority to CN202020869002.5U priority patent/CN212434376U/zh
Priority to US16/881,526 priority patent/US11646144B2/en
Publication of JP2020194805A publication Critical patent/JP2020194805A/ja
Priority to JP2022166898A priority patent/JP7476937B2/ja
Application granted granted Critical
Publication of JP7215327B2 publication Critical patent/JP7215327B2/ja
Active legal-status Critical Current
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/34Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • H01F2017/002Details of via holes for interconnecting the layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2809Printed windings on stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/288Shielding
    • H01F27/2885Shielding with shields or electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
JP2019097639A 2019-05-24 2019-05-24 積層型コイル部品 Active JP7215327B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019097639A JP7215327B2 (ja) 2019-05-24 2019-05-24 積層型コイル部品
CN202010435408.7A CN111986875B (zh) 2019-05-24 2020-05-21 层叠型线圈部件
CN202020869002.5U CN212434376U (zh) 2019-05-24 2020-05-21 层叠型线圈部件
US16/881,526 US11646144B2 (en) 2019-05-24 2020-05-22 Multilayer coil component
JP2022166898A JP7476937B2 (ja) 2019-05-24 2022-10-18 積層型コイル部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019097639A JP7215327B2 (ja) 2019-05-24 2019-05-24 積層型コイル部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022166898A Division JP7476937B2 (ja) 2019-05-24 2022-10-18 積層型コイル部品

Publications (2)

Publication Number Publication Date
JP2020194805A JP2020194805A (ja) 2020-12-03
JP7215327B2 true JP7215327B2 (ja) 2023-01-31

Family

ID=73442203

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019097639A Active JP7215327B2 (ja) 2019-05-24 2019-05-24 積層型コイル部品
JP2022166898A Active JP7476937B2 (ja) 2019-05-24 2022-10-18 積層型コイル部品

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022166898A Active JP7476937B2 (ja) 2019-05-24 2022-10-18 積層型コイル部品

Country Status (3)

Country Link
US (1) US11646144B2 (https=)
JP (2) JP7215327B2 (https=)
CN (2) CN212434376U (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7215327B2 (ja) * 2019-05-24 2023-01-31 株式会社村田製作所 積層型コイル部品
JP7409357B2 (ja) * 2021-08-19 2024-01-09 株式会社村田製作所 インダクタ部品

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138120A (ja) 1998-11-02 2000-05-16 Murata Mfg Co Ltd 積層型インダクタ
JP2001044038A (ja) 1999-08-03 2001-02-16 Taiyo Yuden Co Ltd 積層電子部品
JP2002134321A (ja) 2000-10-23 2002-05-10 Tdk Corp 高周波コイル及びその製造方法
JP2004153067A (ja) 2002-10-31 2004-05-27 Toko Inc 積層型インダクタ
JP2005167130A (ja) 2003-12-05 2005-06-23 Murata Mfg Co Ltd 積層型電子部品の製造方法および積層型電子部品
JP2006041320A (ja) 2004-07-29 2006-02-09 Kyocera Corp 積層型インダクタ
WO2010087220A1 (ja) 2009-01-30 2010-08-05 株式会社村田製作所 電子部品及びその製造方法
JP2010245134A (ja) 2009-04-02 2010-10-28 Murata Mfg Co Ltd 電子部品及びその製造方法
WO2012023315A1 (ja) 2010-08-18 2012-02-23 株式会社村田製作所 電子部品及びその製造方法
JP2013243366A (ja) 2012-05-22 2013-12-05 Samsung Electro-Mechanics Co Ltd チップインダクタおよびその製造方法
JP2014107513A (ja) 2012-11-29 2014-06-09 Taiyo Yuden Co Ltd 積層インダクタ
US20140333405A1 (en) 2013-05-10 2014-11-13 Tdk Corporation Composite ferrite composition and electronic device
WO2015022889A1 (ja) 2013-08-13 2015-02-19 株式会社村田製作所 電子部品
JP2016139742A (ja) 2015-01-28 2016-08-04 株式会社村田製作所 コイル部品
JP2016189451A (ja) 2015-03-27 2016-11-04 株式会社村田製作所 積層コイル部品
JP2018098368A (ja) 2016-12-14 2018-06-21 株式会社村田製作所 チップインダクタ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206910A (ja) * 1990-11-30 1992-07-28 Kyocera Corp 積層コイルの製造方法
JPH10335143A (ja) * 1997-06-04 1998-12-18 Murata Mfg Co Ltd 積層型インダクタ
JP2001023822A (ja) * 1999-07-07 2001-01-26 Tdk Corp 積層フェライトチップインダクタアレイおよびその製造方法
US20050124197A1 (en) * 2003-12-04 2005-06-09 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
JP2005294637A (ja) * 2004-04-01 2005-10-20 Murata Mfg Co Ltd 積層コイルアレイ
WO2010082579A1 (ja) * 2009-01-14 2010-07-22 株式会社村田製作所 電子部品及びその製造方法
WO2015016079A1 (ja) * 2013-07-29 2015-02-05 株式会社村田製作所 積層コイル
JP6398857B2 (ja) * 2015-04-27 2018-10-03 株式会社村田製作所 電子部品及びその製造方法
JP6614050B2 (ja) * 2016-07-01 2019-12-04 株式会社村田製作所 コモンモードチョークコイル
JP6686979B2 (ja) * 2017-06-26 2020-04-22 株式会社村田製作所 積層インダクタ
JP6407400B1 (ja) * 2017-12-26 2018-10-17 Tdk株式会社 積層コイル部品
JP7200499B2 (ja) * 2018-04-26 2023-01-10 Tdk株式会社 積層コイル部品
JP7215327B2 (ja) * 2019-05-24 2023-01-31 株式会社村田製作所 積層型コイル部品

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138120A (ja) 1998-11-02 2000-05-16 Murata Mfg Co Ltd 積層型インダクタ
JP2001044038A (ja) 1999-08-03 2001-02-16 Taiyo Yuden Co Ltd 積層電子部品
JP2002134321A (ja) 2000-10-23 2002-05-10 Tdk Corp 高周波コイル及びその製造方法
JP2004153067A (ja) 2002-10-31 2004-05-27 Toko Inc 積層型インダクタ
JP2005167130A (ja) 2003-12-05 2005-06-23 Murata Mfg Co Ltd 積層型電子部品の製造方法および積層型電子部品
JP2006041320A (ja) 2004-07-29 2006-02-09 Kyocera Corp 積層型インダクタ
WO2010087220A1 (ja) 2009-01-30 2010-08-05 株式会社村田製作所 電子部品及びその製造方法
JP2010245134A (ja) 2009-04-02 2010-10-28 Murata Mfg Co Ltd 電子部品及びその製造方法
WO2012023315A1 (ja) 2010-08-18 2012-02-23 株式会社村田製作所 電子部品及びその製造方法
JP2013243366A (ja) 2012-05-22 2013-12-05 Samsung Electro-Mechanics Co Ltd チップインダクタおよびその製造方法
JP2014107513A (ja) 2012-11-29 2014-06-09 Taiyo Yuden Co Ltd 積層インダクタ
US20140333405A1 (en) 2013-05-10 2014-11-13 Tdk Corporation Composite ferrite composition and electronic device
JP2014220469A (ja) 2013-05-10 2014-11-20 Tdk株式会社 複合フェライト組成物および電子部品
WO2015022889A1 (ja) 2013-08-13 2015-02-19 株式会社村田製作所 電子部品
JP2016139742A (ja) 2015-01-28 2016-08-04 株式会社村田製作所 コイル部品
JP2016189451A (ja) 2015-03-27 2016-11-04 株式会社村田製作所 積層コイル部品
JP2018098368A (ja) 2016-12-14 2018-06-21 株式会社村田製作所 チップインダクタ

Also Published As

Publication number Publication date
CN111986875B (zh) 2023-07-28
JP7476937B2 (ja) 2024-05-01
JP2022191427A (ja) 2022-12-27
JP2020194805A (ja) 2020-12-03
US11646144B2 (en) 2023-05-09
US20200373054A1 (en) 2020-11-26
CN111986875A (zh) 2020-11-24
CN212434376U (zh) 2021-01-29

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