JP7215327B2 - 積層型コイル部品 - Google Patents
積層型コイル部品 Download PDFInfo
- Publication number
- JP7215327B2 JP7215327B2 JP2019097639A JP2019097639A JP7215327B2 JP 7215327 B2 JP7215327 B2 JP 7215327B2 JP 2019097639 A JP2019097639 A JP 2019097639A JP 2019097639 A JP2019097639 A JP 2019097639A JP 7215327 B2 JP7215327 B2 JP 7215327B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- conductor
- laminated
- external electrode
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 321
- 238000003475 lamination Methods 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 description 19
- 238000010168 coupling process Methods 0.000 description 19
- 238000005859 coupling reaction Methods 0.000 description 19
- 239000000919 ceramic Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/288—Shielding
- H01F27/2885—Shielding with shields or electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019097639A JP7215327B2 (ja) | 2019-05-24 | 2019-05-24 | 積層型コイル部品 |
| CN202010435408.7A CN111986875B (zh) | 2019-05-24 | 2020-05-21 | 层叠型线圈部件 |
| CN202020869002.5U CN212434376U (zh) | 2019-05-24 | 2020-05-21 | 层叠型线圈部件 |
| US16/881,526 US11646144B2 (en) | 2019-05-24 | 2020-05-22 | Multilayer coil component |
| JP2022166898A JP7476937B2 (ja) | 2019-05-24 | 2022-10-18 | 積層型コイル部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019097639A JP7215327B2 (ja) | 2019-05-24 | 2019-05-24 | 積層型コイル部品 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022166898A Division JP7476937B2 (ja) | 2019-05-24 | 2022-10-18 | 積層型コイル部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020194805A JP2020194805A (ja) | 2020-12-03 |
| JP7215327B2 true JP7215327B2 (ja) | 2023-01-31 |
Family
ID=73442203
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019097639A Active JP7215327B2 (ja) | 2019-05-24 | 2019-05-24 | 積層型コイル部品 |
| JP2022166898A Active JP7476937B2 (ja) | 2019-05-24 | 2022-10-18 | 積層型コイル部品 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022166898A Active JP7476937B2 (ja) | 2019-05-24 | 2022-10-18 | 積層型コイル部品 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11646144B2 (https=) |
| JP (2) | JP7215327B2 (https=) |
| CN (2) | CN212434376U (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7215327B2 (ja) * | 2019-05-24 | 2023-01-31 | 株式会社村田製作所 | 積層型コイル部品 |
| JP7409357B2 (ja) * | 2021-08-19 | 2024-01-09 | 株式会社村田製作所 | インダクタ部品 |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000138120A (ja) | 1998-11-02 | 2000-05-16 | Murata Mfg Co Ltd | 積層型インダクタ |
| JP2001044038A (ja) | 1999-08-03 | 2001-02-16 | Taiyo Yuden Co Ltd | 積層電子部品 |
| JP2002134321A (ja) | 2000-10-23 | 2002-05-10 | Tdk Corp | 高周波コイル及びその製造方法 |
| JP2004153067A (ja) | 2002-10-31 | 2004-05-27 | Toko Inc | 積層型インダクタ |
| JP2005167130A (ja) | 2003-12-05 | 2005-06-23 | Murata Mfg Co Ltd | 積層型電子部品の製造方法および積層型電子部品 |
| JP2006041320A (ja) | 2004-07-29 | 2006-02-09 | Kyocera Corp | 積層型インダクタ |
| WO2010087220A1 (ja) | 2009-01-30 | 2010-08-05 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP2010245134A (ja) | 2009-04-02 | 2010-10-28 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
| WO2012023315A1 (ja) | 2010-08-18 | 2012-02-23 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP2013243366A (ja) | 2012-05-22 | 2013-12-05 | Samsung Electro-Mechanics Co Ltd | チップインダクタおよびその製造方法 |
| JP2014107513A (ja) | 2012-11-29 | 2014-06-09 | Taiyo Yuden Co Ltd | 積層インダクタ |
| US20140333405A1 (en) | 2013-05-10 | 2014-11-13 | Tdk Corporation | Composite ferrite composition and electronic device |
| WO2015022889A1 (ja) | 2013-08-13 | 2015-02-19 | 株式会社村田製作所 | 電子部品 |
| JP2016139742A (ja) | 2015-01-28 | 2016-08-04 | 株式会社村田製作所 | コイル部品 |
| JP2016189451A (ja) | 2015-03-27 | 2016-11-04 | 株式会社村田製作所 | 積層コイル部品 |
| JP2018098368A (ja) | 2016-12-14 | 2018-06-21 | 株式会社村田製作所 | チップインダクタ |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206910A (ja) * | 1990-11-30 | 1992-07-28 | Kyocera Corp | 積層コイルの製造方法 |
| JPH10335143A (ja) * | 1997-06-04 | 1998-12-18 | Murata Mfg Co Ltd | 積層型インダクタ |
| JP2001023822A (ja) * | 1999-07-07 | 2001-01-26 | Tdk Corp | 積層フェライトチップインダクタアレイおよびその製造方法 |
| US20050124197A1 (en) * | 2003-12-04 | 2005-06-09 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment |
| JP2005294637A (ja) * | 2004-04-01 | 2005-10-20 | Murata Mfg Co Ltd | 積層コイルアレイ |
| WO2010082579A1 (ja) * | 2009-01-14 | 2010-07-22 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| WO2015016079A1 (ja) * | 2013-07-29 | 2015-02-05 | 株式会社村田製作所 | 積層コイル |
| JP6398857B2 (ja) * | 2015-04-27 | 2018-10-03 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP6614050B2 (ja) * | 2016-07-01 | 2019-12-04 | 株式会社村田製作所 | コモンモードチョークコイル |
| JP6686979B2 (ja) * | 2017-06-26 | 2020-04-22 | 株式会社村田製作所 | 積層インダクタ |
| JP6407400B1 (ja) * | 2017-12-26 | 2018-10-17 | Tdk株式会社 | 積層コイル部品 |
| JP7200499B2 (ja) * | 2018-04-26 | 2023-01-10 | Tdk株式会社 | 積層コイル部品 |
| JP7215327B2 (ja) * | 2019-05-24 | 2023-01-31 | 株式会社村田製作所 | 積層型コイル部品 |
-
2019
- 2019-05-24 JP JP2019097639A patent/JP7215327B2/ja active Active
-
2020
- 2020-05-21 CN CN202020869002.5U patent/CN212434376U/zh active Active
- 2020-05-21 CN CN202010435408.7A patent/CN111986875B/zh active Active
- 2020-05-22 US US16/881,526 patent/US11646144B2/en active Active
-
2022
- 2022-10-18 JP JP2022166898A patent/JP7476937B2/ja active Active
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000138120A (ja) | 1998-11-02 | 2000-05-16 | Murata Mfg Co Ltd | 積層型インダクタ |
| JP2001044038A (ja) | 1999-08-03 | 2001-02-16 | Taiyo Yuden Co Ltd | 積層電子部品 |
| JP2002134321A (ja) | 2000-10-23 | 2002-05-10 | Tdk Corp | 高周波コイル及びその製造方法 |
| JP2004153067A (ja) | 2002-10-31 | 2004-05-27 | Toko Inc | 積層型インダクタ |
| JP2005167130A (ja) | 2003-12-05 | 2005-06-23 | Murata Mfg Co Ltd | 積層型電子部品の製造方法および積層型電子部品 |
| JP2006041320A (ja) | 2004-07-29 | 2006-02-09 | Kyocera Corp | 積層型インダクタ |
| WO2010087220A1 (ja) | 2009-01-30 | 2010-08-05 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP2010245134A (ja) | 2009-04-02 | 2010-10-28 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
| WO2012023315A1 (ja) | 2010-08-18 | 2012-02-23 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP2013243366A (ja) | 2012-05-22 | 2013-12-05 | Samsung Electro-Mechanics Co Ltd | チップインダクタおよびその製造方法 |
| JP2014107513A (ja) | 2012-11-29 | 2014-06-09 | Taiyo Yuden Co Ltd | 積層インダクタ |
| US20140333405A1 (en) | 2013-05-10 | 2014-11-13 | Tdk Corporation | Composite ferrite composition and electronic device |
| JP2014220469A (ja) | 2013-05-10 | 2014-11-20 | Tdk株式会社 | 複合フェライト組成物および電子部品 |
| WO2015022889A1 (ja) | 2013-08-13 | 2015-02-19 | 株式会社村田製作所 | 電子部品 |
| JP2016139742A (ja) | 2015-01-28 | 2016-08-04 | 株式会社村田製作所 | コイル部品 |
| JP2016189451A (ja) | 2015-03-27 | 2016-11-04 | 株式会社村田製作所 | 積層コイル部品 |
| JP2018098368A (ja) | 2016-12-14 | 2018-06-21 | 株式会社村田製作所 | チップインダクタ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111986875B (zh) | 2023-07-28 |
| JP7476937B2 (ja) | 2024-05-01 |
| JP2022191427A (ja) | 2022-12-27 |
| JP2020194805A (ja) | 2020-12-03 |
| US11646144B2 (en) | 2023-05-09 |
| US20200373054A1 (en) | 2020-11-26 |
| CN111986875A (zh) | 2020-11-24 |
| CN212434376U (zh) | 2021-01-29 |
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