JP7212830B2 - 封止用エポキシ樹脂組成物及び電子部品装置 - Google Patents
封止用エポキシ樹脂組成物及び電子部品装置 Download PDFInfo
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- JP7212830B2 JP7212830B2 JP2019510186A JP2019510186A JP7212830B2 JP 7212830 B2 JP7212830 B2 JP 7212830B2 JP 2019510186 A JP2019510186 A JP 2019510186A JP 2019510186 A JP2019510186 A JP 2019510186A JP 7212830 B2 JP7212830 B2 JP 7212830B2
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- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000003826 tablet Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011129272A1 (ja) | 2010-04-13 | 2011-10-20 | 積水化学工業株式会社 | 半導体チップ接合用接着材料、半導体チップ接合用接着フィルム、半導体装置の製造方法、及び、半導体装置 |
JP2012153885A (ja) | 2011-01-07 | 2012-08-16 | Ajinomoto Co Inc | 剥離フィルム用樹脂組成物 |
JP2013006981A (ja) | 2011-06-24 | 2013-01-10 | Mitsubishi Chemicals Corp | 三次元積層型半導体装置用の層間充填材組成物及びその塗布液 |
JP2014521754A (ja) | 2011-07-29 | 2014-08-28 | ナミックス株式会社 | 半導体封止用エポキシ樹脂組成物、それを用いた半導体装置及び半導体製造方法 |
JP2015010146A (ja) | 2013-06-28 | 2015-01-19 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物及びプリント配線板 |
JP2016179564A (ja) | 2015-03-23 | 2016-10-13 | 味の素株式会社 | 樹脂シート |
JP2017057313A (ja) | 2015-09-17 | 2017-03-23 | 味の素株式会社 | 粒状樹脂組成物 |
WO2017057561A1 (ja) | 2015-09-30 | 2017-04-06 | 積水化学工業株式会社 | 樹脂組成物及び多層基板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0551435A (ja) * | 1991-08-23 | 1993-03-02 | Mitsui Toatsu Chem Inc | エポキシ樹脂組成物 |
JPH1121426A (ja) * | 1997-07-02 | 1999-01-26 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JP2001131393A (ja) * | 1999-10-29 | 2001-05-15 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2002128868A (ja) * | 2000-10-24 | 2002-05-09 | Japan Epoxy Resin Kk | 半導体封止用エポキシ樹脂組成物 |
JP4096806B2 (ja) * | 2003-05-13 | 2008-06-04 | ジャパンエポキシレジン株式会社 | フェノール樹脂、エポキシ樹脂用硬化剤、及びエポキシ樹脂組成物 |
JP2007031698A (ja) * | 2005-06-21 | 2007-02-08 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及び電子部品装置 |
JP5166610B2 (ja) * | 2009-12-14 | 2013-03-21 | 新日鉄住金化学株式会社 | エポキシ樹脂、その製造方法、それを用いたエポキシ樹脂組成物および硬化物 |
KR101480178B1 (ko) * | 2011-12-20 | 2015-01-09 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
CN103819870B (zh) * | 2012-11-16 | 2016-06-15 | 株式会社田村制作所 | 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板 |
KR101518502B1 (ko) * | 2012-12-26 | 2015-05-11 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
JP6315170B2 (ja) * | 2013-09-30 | 2018-04-25 | ナガセケムテックス株式会社 | 半導体封止用エポキシ樹脂組成物、半導体実装構造体、およびその製造方法 |
CN106398112B (zh) * | 2016-05-31 | 2019-09-13 | 江苏华海诚科新材料股份有限公司 | 一种适用于esop封装的环氧树脂组合物 |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011129272A1 (ja) | 2010-04-13 | 2011-10-20 | 積水化学工業株式会社 | 半導体チップ接合用接着材料、半導体チップ接合用接着フィルム、半導体装置の製造方法、及び、半導体装置 |
JP2012153885A (ja) | 2011-01-07 | 2012-08-16 | Ajinomoto Co Inc | 剥離フィルム用樹脂組成物 |
JP2013006981A (ja) | 2011-06-24 | 2013-01-10 | Mitsubishi Chemicals Corp | 三次元積層型半導体装置用の層間充填材組成物及びその塗布液 |
JP2014521754A (ja) | 2011-07-29 | 2014-08-28 | ナミックス株式会社 | 半導体封止用エポキシ樹脂組成物、それを用いた半導体装置及び半導体製造方法 |
JP2015010146A (ja) | 2013-06-28 | 2015-01-19 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物及びプリント配線板 |
JP2016179564A (ja) | 2015-03-23 | 2016-10-13 | 味の素株式会社 | 樹脂シート |
JP2017057313A (ja) | 2015-09-17 | 2017-03-23 | 味の素株式会社 | 粒状樹脂組成物 |
WO2017057561A1 (ja) | 2015-09-30 | 2017-04-06 | 積水化学工業株式会社 | 樹脂組成物及び多層基板 |
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WO2018181813A1 (ja) | 2018-10-04 |
JPWO2018181813A1 (ja) | 2020-02-06 |
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