JP7168691B2 - 導電性基板の製造方法、導電性基板 - Google Patents

導電性基板の製造方法、導電性基板 Download PDF

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Publication number
JP7168691B2
JP7168691B2 JP2020569524A JP2020569524A JP7168691B2 JP 7168691 B2 JP7168691 B2 JP 7168691B2 JP 2020569524 A JP2020569524 A JP 2020569524A JP 2020569524 A JP2020569524 A JP 2020569524A JP 7168691 B2 JP7168691 B2 JP 7168691B2
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JP
Japan
Prior art keywords
silver
conductive
conductive thin
thin wire
conductive substrate
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JP2020569524A
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English (en)
Japanese (ja)
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JPWO2020158494A1 (ja
Inventor
基 原田
健介 片桐
順矢 小川
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Fujifilm Corp
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Fujifilm Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/14—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
JP2020569524A 2019-01-31 2020-01-21 導電性基板の製造方法、導電性基板 Active JP7168691B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019016322 2019-01-31
JP2019016322 2019-01-31
PCT/JP2020/001843 WO2020158494A1 (ja) 2019-01-31 2020-01-21 導電性基板の製造方法、導電性基板

Publications (2)

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JPWO2020158494A1 JPWO2020158494A1 (ja) 2021-10-28
JP7168691B2 true JP7168691B2 (ja) 2022-11-09

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JP2020569524A Active JP7168691B2 (ja) 2019-01-31 2020-01-21 導電性基板の製造方法、導電性基板

Country Status (3)

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JP (1) JP7168691B2 (zh)
CN (1) CN113286697A (zh)
WO (1) WO2020158494A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2938578T3 (es) * 2021-01-18 2023-04-12 Longserving Tech Co Ltd Procedimiento de fabricación de un patrón de circuito a escala picoscópica/nanoscópica
WO2023120297A1 (ja) * 2021-12-24 2023-06-29 富士フイルム株式会社 導電性基板、導電性基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080199665A1 (en) 2005-04-22 2008-08-21 Slater Sean D Method of Forming Flexible Electronic Circuits
JP2012234695A (ja) 2011-04-28 2012-11-29 Fujifilm Corp 導電シート、導電シートの製造方法、及び導電シートを用いた静電容量方式のタッチパネル
JP2014209332A (ja) 2013-03-27 2014-11-06 富士フイルム株式会社 導電シートおよびその製造方法、タッチパネル
WO2017017973A1 (ja) 2015-07-24 2017-02-02 富士フイルム株式会社 タッチパネル用導電フィルム、タッチパネル、および、タッチパネル付き表示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3822128A (en) * 1971-10-22 1974-07-02 Horizons Inc Metal-plated images
JP5990493B2 (ja) * 2012-11-12 2016-09-14 富士フイルム株式会社 導電シートの製造方法、導電シート
JP6377007B2 (ja) * 2015-04-20 2018-08-22 富士フイルム株式会社 導電性フィルム、配線、およびタッチパネルセンサ
WO2018047493A1 (ja) * 2016-09-12 2018-03-15 富士フイルム株式会社 導電性フィルム、タッチパネルセンサー、および、タッチパネル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080199665A1 (en) 2005-04-22 2008-08-21 Slater Sean D Method of Forming Flexible Electronic Circuits
JP2012234695A (ja) 2011-04-28 2012-11-29 Fujifilm Corp 導電シート、導電シートの製造方法、及び導電シートを用いた静電容量方式のタッチパネル
JP2014209332A (ja) 2013-03-27 2014-11-06 富士フイルム株式会社 導電シートおよびその製造方法、タッチパネル
WO2017017973A1 (ja) 2015-07-24 2017-02-02 富士フイルム株式会社 タッチパネル用導電フィルム、タッチパネル、および、タッチパネル付き表示装置

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WO2020158494A1 (ja) 2020-08-06
JPWO2020158494A1 (ja) 2021-10-28
CN113286697A (zh) 2021-08-20

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