JP7136334B2 - チップ型セラミック電子部品およびその製造方法 - Google Patents

チップ型セラミック電子部品およびその製造方法 Download PDF

Info

Publication number
JP7136334B2
JP7136334B2 JP2021508856A JP2021508856A JP7136334B2 JP 7136334 B2 JP7136334 B2 JP 7136334B2 JP 2021508856 A JP2021508856 A JP 2021508856A JP 2021508856 A JP2021508856 A JP 2021508856A JP 7136334 B2 JP7136334 B2 JP 7136334B2
Authority
JP
Japan
Prior art keywords
glass
conductive paste
free
ceramic body
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021508856A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020195523A1 (https=
Inventor
孝太 善哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2020195523A1 publication Critical patent/JPWO2020195523A1/ja
Application granted granted Critical
Publication of JP7136334B2 publication Critical patent/JP7136334B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2021508856A 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法 Active JP7136334B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062901 2019-03-28
JP2019062901 2019-03-28
PCT/JP2020/008132 WO2020195523A1 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2020195523A1 JPWO2020195523A1 (https=) 2020-10-01
JP7136334B2 true JP7136334B2 (ja) 2022-09-13

Family

ID=72608992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508856A Active JP7136334B2 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Country Status (5)

Country Link
US (2) US12243689B2 (https=)
JP (1) JP7136334B2 (https=)
KR (2) KR102558658B1 (https=)
CN (1) CN113614866B (https=)
WO (1) WO2020195523A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
TWI628678B (zh) * 2016-04-21 2018-07-01 Tdk 股份有限公司 電子零件
JP7136333B2 (ja) * 2019-03-28 2022-09-13 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
WO2022065004A1 (ja) * 2020-09-25 2022-03-31 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
KR102911094B1 (ko) * 2021-02-05 2026-01-13 삼성전기주식회사 적층 세라믹 전자부품
JP2023099275A (ja) * 2021-12-30 2023-07-12 サムソン エレクトロ－メカニックス カンパニーリミテッド． セラミック電子部品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216046A (ja) 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
JP2010199168A (ja) 2009-02-24 2010-09-09 Murata Mfg Co Ltd セラミックコンデンサの製造方法
WO2012111479A1 (ja) 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
JP2015109411A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2018098327A (ja) 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1051862C (zh) * 1991-04-20 2000-04-26 旭化成工业株式会社 高温烧结用糊剂及其应用
JPH05290622A (ja) * 1992-04-09 1993-11-05 Sumitomo Metal Mining Co Ltd Ｎｉペースト組成物
JP4083971B2 (ja) * 2000-11-22 2008-04-30 Ｔｄｋ株式会社 積層セラミック電子部品及びその製造方法
CN100383899C (zh) * 2003-01-30 2008-04-23 广东风华高新科技股份有限公司 高频多层片式陶瓷电容器的制造方法
CN100583328C (zh) * 2004-04-23 2010-01-20 株式会社村田制作所 电子元件及其制造方法
WO2007072894A1 (ja) * 2005-12-22 2007-06-28 Namics Corporation 熱硬化性導電ペースト及びそれを用いて形成した外部電極を有する積層セラミック部品
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
JP5211970B2 (ja) * 2008-09-17 2013-06-12 株式会社村田製作所 セラミック電子部品の製造方法
CN102044344A (zh) * 2009-10-13 2011-05-04 东莞市长凌电子材料有限公司 贴片电容
KR20110067509A (ko) * 2009-12-14 2011-06-22 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR20130005518A (ko) * 2011-07-06 2013-01-16 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR20140012322A (ko) * 2012-07-19 2014-02-03 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP2015046644A (ja) * 2014-12-11 2015-03-12 株式会社村田製作所 積層セラミック電子部品
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터
JP6787364B2 (ja) * 2018-05-16 2020-11-18 株式会社村田製作所 導電性ペースト

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216046A (ja) 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
JP2010199168A (ja) 2009-02-24 2010-09-09 Murata Mfg Co Ltd セラミックコンデンサの製造方法
WO2012111479A1 (ja) 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
JP2015109411A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2018098327A (ja) 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法

Also Published As

Publication number Publication date
KR102558658B1 (ko) 2023-07-24
US12243689B2 (en) 2025-03-04
CN113614866B (zh) 2023-06-27
US20210375545A1 (en) 2021-12-02
WO2020195523A1 (ja) 2020-10-01
US12278050B2 (en) 2025-04-15
JPWO2020195523A1 (https=) 2020-10-01
KR20210114531A (ko) 2021-09-23
US20240266112A1 (en) 2024-08-08
KR20230107899A (ko) 2023-07-18
KR102678767B1 (ko) 2024-06-26
CN113614866A (zh) 2021-11-05

Similar Documents

Publication Publication Date Title
JP7136334B2 (ja) チップ型セラミック電子部品およびその製造方法
TWI517190B (zh) 晶片型電子零件
JP4423707B2 (ja) 積層セラミック電子部品の製造方法
US20130107419A1 (en) Multilayered ceramic capacitor with improved lead frame attachment
WO2008023496A1 (fr) Composant électronique feuilleté et procédé pour le fabriquer
JP2001307947A (ja) 積層チップ部品及びその製造方法
US20250062074A1 (en) Ceramic electronic chip component and method for manufacturing the same
JP2003318059A (ja) 積層セラミックコンデンサ
JPWO2017002495A1 (ja) チップ型セラミック電子部品
JP7136333B2 (ja) チップ型セラミック電子部品およびその製造方法
JP2022163228A5 (ja) チップ型セラミック電子部品の製造方法
JP3716746B2 (ja) 積層セラミック電子部品及びその製造方法
JP2002289464A (ja) セラミック電子部品およびその製造方法
WO2025094421A1 (ja) 積層セラミック電子部品及び積層セラミック電子部品の製造方法
JP2006216781A (ja) 電子部品
JP2007234773A (ja) セラミック電子部品

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210908

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210908

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220802

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220815

R150 Certificate of patent or registration of utility model

Ref document number: 7136334

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150