CN113614866B - 芯片型陶瓷电子部件及其制造方法 - Google Patents

芯片型陶瓷电子部件及其制造方法 Download PDF

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Publication number
CN113614866B
CN113614866B CN202080024137.4A CN202080024137A CN113614866B CN 113614866 B CN113614866 B CN 113614866B CN 202080024137 A CN202080024137 A CN 202080024137A CN 113614866 B CN113614866 B CN 113614866B
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China
Prior art keywords
glass
conductive paste
free
ceramic body
electronic component
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CN202080024137.4A
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English (en)
Chinese (zh)
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CN113614866A (zh
Inventor
善哉孝太
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202080024137.4A 2019-03-28 2020-02-27 芯片型陶瓷电子部件及其制造方法 Active CN113614866B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062901 2019-03-28
JP2019-062901 2019-03-28
PCT/JP2020/008132 WO2020195523A1 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
CN113614866A CN113614866A (zh) 2021-11-05
CN113614866B true CN113614866B (zh) 2023-06-27

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CN202080024137.4A Active CN113614866B (zh) 2019-03-28 2020-02-27 芯片型陶瓷电子部件及其制造方法

Country Status (5)

Country Link
US (2) US12243689B2 (https=)
JP (1) JP7136334B2 (https=)
KR (2) KR102558658B1 (https=)
CN (1) CN113614866B (https=)
WO (1) WO2020195523A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
TWI628678B (zh) * 2016-04-21 2018-07-01 Tdk 股份有限公司 電子零件
JP7136333B2 (ja) * 2019-03-28 2022-09-13 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
WO2022065004A1 (ja) * 2020-09-25 2022-03-31 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
KR102911094B1 (ko) * 2021-02-05 2026-01-13 삼성전기주식회사 적층 세라믹 전자부품
JP2023099275A (ja) * 2021-12-30 2023-07-12 サムソン エレクトロ－メカニックス カンパニーリミテッド． セラミック電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158137A (ja) * 2000-11-22 2002-05-31 Tdk Corp 積層セラミック電子部品及びその製造方法
CN1820333A (zh) * 2004-04-23 2006-08-16 株式会社村田制作所 电子元件及其制造方法

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CN1051862C (zh) * 1991-04-20 2000-04-26 旭化成工业株式会社 高温烧结用糊剂及其应用
JPH05290622A (ja) * 1992-04-09 1993-11-05 Sumitomo Metal Mining Co Ltd Ｎｉペースト組成物
JP2000216046A (ja) * 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
CN100383899C (zh) * 2003-01-30 2008-04-23 广东风华高新科技股份有限公司 高频多层片式陶瓷电容器的制造方法
WO2007072894A1 (ja) * 2005-12-22 2007-06-28 Namics Corporation 熱硬化性導電ペースト及びそれを用いて形成した外部電極を有する積層セラミック部品
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
JP5211970B2 (ja) * 2008-09-17 2013-06-12 株式会社村田製作所 セラミック電子部品の製造方法
JP5251589B2 (ja) * 2009-02-24 2013-07-31 株式会社村田製作所 セラミックコンデンサの製造方法
CN102044344A (zh) * 2009-10-13 2011-05-04 东莞市长凌电子材料有限公司 贴片电容
KR20110067509A (ko) * 2009-12-14 2011-06-22 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
WO2012111479A1 (ja) * 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
KR20130005518A (ko) * 2011-07-06 2013-01-16 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR20140012322A (ko) * 2012-07-19 2014-02-03 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP2015109411A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2015046644A (ja) * 2014-12-11 2015-03-12 株式会社村田製作所 積層セラミック電子部品
JP2018098327A (ja) 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터
JP6787364B2 (ja) * 2018-05-16 2020-11-18 株式会社村田製作所 導電性ペースト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158137A (ja) * 2000-11-22 2002-05-31 Tdk Corp 積層セラミック電子部品及びその製造方法
CN1820333A (zh) * 2004-04-23 2006-08-16 株式会社村田制作所 电子元件及其制造方法

Also Published As

Publication number Publication date
KR102558658B1 (ko) 2023-07-24
US12243689B2 (en) 2025-03-04
US20210375545A1 (en) 2021-12-02
JP7136334B2 (ja) 2022-09-13
WO2020195523A1 (ja) 2020-10-01
US12278050B2 (en) 2025-04-15
JPWO2020195523A1 (https=) 2020-10-01
KR20210114531A (ko) 2021-09-23
US20240266112A1 (en) 2024-08-08
KR20230107899A (ko) 2023-07-18
KR102678767B1 (ko) 2024-06-26
CN113614866A (zh) 2021-11-05

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