KR102558658B1 - 칩형 세라믹 전자부품의 제조 방법 - Google Patents

칩형 세라믹 전자부품의 제조 방법 Download PDF

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Publication number
KR102558658B1
KR102558658B1 KR1020217026670A KR20217026670A KR102558658B1 KR 102558658 B1 KR102558658 B1 KR 102558658B1 KR 1020217026670 A KR1020217026670 A KR 1020217026670A KR 20217026670 A KR20217026670 A KR 20217026670A KR 102558658 B1 KR102558658 B1 KR 102558658B1
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South Korea
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glass
conductive paste
ceramic body
free
sintered layer
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KR1020217026670A
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Korean (ko)
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KR20210114531A (ko
Inventor
코타 젠자이
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가부시키가이샤 무라타 세이사쿠쇼
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Priority to KR1020237022740A priority Critical patent/KR102678767B1/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020217026670A 2019-03-28 2020-02-27 칩형 세라믹 전자부품의 제조 방법 Active KR102558658B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237022740A KR102678767B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-062901 2019-03-28
JP2019062901 2019-03-28
PCT/JP2020/008132 WO2020195523A1 (ja) 2019-03-28 2020-02-27 チップ型セラミック電子部品およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237022740A Division KR102678767B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

Publications (2)

Publication Number Publication Date
KR20210114531A KR20210114531A (ko) 2021-09-23
KR102558658B1 true KR102558658B1 (ko) 2023-07-24

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KR1020217026670A Active KR102558658B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품의 제조 방법
KR1020237022740A Active KR102678767B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

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KR1020237022740A Active KR102678767B1 (ko) 2019-03-28 2020-02-27 칩형 세라믹 전자부품

Country Status (5)

Country Link
US (2) US12243689B2 (https=)
JP (1) JP7136334B2 (https=)
KR (2) KR102558658B1 (https=)
CN (1) CN113614866B (https=)
WO (1) WO2020195523A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
TWI628678B (zh) * 2016-04-21 2018-07-01 Tdk 股份有限公司 電子零件
JP7136333B2 (ja) * 2019-03-28 2022-09-13 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
WO2022065004A1 (ja) * 2020-09-25 2022-03-31 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
KR102911094B1 (ko) * 2021-02-05 2026-01-13 삼성전기주식회사 적층 세라믹 전자부품
JP2023099275A (ja) * 2021-12-30 2023-07-12 サムソン エレクトロ－メカニックス カンパニーリミテッド． セラミック電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180233289A1 (en) * 2017-01-25 2018-08-16 Holy Stone Enterprise Co., Ltd. Multilayer ceramic capacitor

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CN1051862C (zh) * 1991-04-20 2000-04-26 旭化成工业株式会社 高温烧结用糊剂及其应用
JPH05290622A (ja) * 1992-04-09 1993-11-05 Sumitomo Metal Mining Co Ltd Ｎｉペースト組成物
JP2000216046A (ja) * 1999-01-26 2000-08-04 Murata Mfg Co Ltd 積層セラミック電子部品
JP4083971B2 (ja) * 2000-11-22 2008-04-30 Ｔｄｋ株式会社 積層セラミック電子部品及びその製造方法
CN100383899C (zh) * 2003-01-30 2008-04-23 广东风华高新科技股份有限公司 高频多层片式陶瓷电容器的制造方法
CN100583328C (zh) * 2004-04-23 2010-01-20 株式会社村田制作所 电子元件及其制造方法
WO2007072894A1 (ja) * 2005-12-22 2007-06-28 Namics Corporation 熱硬化性導電ペースト及びそれを用いて形成した外部電極を有する積層セラミック部品
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
JP5211970B2 (ja) * 2008-09-17 2013-06-12 株式会社村田製作所 セラミック電子部品の製造方法
JP5251589B2 (ja) * 2009-02-24 2013-07-31 株式会社村田製作所 セラミックコンデンサの製造方法
CN102044344A (zh) * 2009-10-13 2011-05-04 东莞市长凌电子材料有限公司 贴片电容
KR20110067509A (ko) * 2009-12-14 2011-06-22 삼성전기주식회사 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
WO2012111479A1 (ja) * 2011-02-16 2012-08-23 株式会社 村田製作所 導電性ペースト、太陽電池、及び太陽電池の製造方法
KR20130005518A (ko) * 2011-07-06 2013-01-16 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR20140012322A (ko) * 2012-07-19 2014-02-03 삼성전기주식회사 적층 세라믹 전자 부품 및 그 제조 방법
JP2015109411A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
JP2015046644A (ja) * 2014-12-11 2015-03-12 株式会社村田製作所 積層セラミック電子部品
JP2018098327A (ja) 2016-12-13 2018-06-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터
JP6787364B2 (ja) * 2018-05-16 2020-11-18 株式会社村田製作所 導電性ペースト

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180233289A1 (en) * 2017-01-25 2018-08-16 Holy Stone Enterprise Co., Ltd. Multilayer ceramic capacitor

Also Published As

Publication number Publication date
US12243689B2 (en) 2025-03-04
CN113614866B (zh) 2023-06-27
US20210375545A1 (en) 2021-12-02
JP7136334B2 (ja) 2022-09-13
WO2020195523A1 (ja) 2020-10-01
US12278050B2 (en) 2025-04-15
JPWO2020195523A1 (https=) 2020-10-01
KR20210114531A (ko) 2021-09-23
US20240266112A1 (en) 2024-08-08
KR20230107899A (ko) 2023-07-18
KR102678767B1 (ko) 2024-06-26
CN113614866A (zh) 2021-11-05

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