JP7129793B2 - 接合装置 - Google Patents

接合装置 Download PDF

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Publication number
JP7129793B2
JP7129793B2 JP2018040056A JP2018040056A JP7129793B2 JP 7129793 B2 JP7129793 B2 JP 7129793B2 JP 2018040056 A JP2018040056 A JP 2018040056A JP 2018040056 A JP2018040056 A JP 2018040056A JP 7129793 B2 JP7129793 B2 JP 7129793B2
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Japan
Prior art keywords
chip
bonding
cleaning
section
joining
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JP2018040056A
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English (en)
Japanese (ja)
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JP2019153761A (ja
JP2019153761A5 (enExample
Inventor
勝次 井口
真澄 前川
敬一 澤井
浩由 東坂
孝信 松尾
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Sharp Corp
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Sharp Corp
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Priority to JP2018040056A priority Critical patent/JP7129793B2/ja
Priority to TW108106928A priority patent/TWI727271B/zh
Priority to CN201910163642.6A priority patent/CN110233121B/zh
Priority to US16/294,167 priority patent/US11145618B2/en
Publication of JP2019153761A publication Critical patent/JP2019153761A/ja
Publication of JP2019153761A5 publication Critical patent/JP2019153761A5/ja
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Publication of JP7129793B2 publication Critical patent/JP7129793B2/ja
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    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2018040056A 2018-03-06 2018-03-06 接合装置 Active JP7129793B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018040056A JP7129793B2 (ja) 2018-03-06 2018-03-06 接合装置
TW108106928A TWI727271B (zh) 2018-03-06 2019-02-27 接合裝置
CN201910163642.6A CN110233121B (zh) 2018-03-06 2019-03-05 接合装置
US16/294,167 US11145618B2 (en) 2018-03-06 2019-03-06 Bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018040056A JP7129793B2 (ja) 2018-03-06 2018-03-06 接合装置

Publications (3)

Publication Number Publication Date
JP2019153761A JP2019153761A (ja) 2019-09-12
JP2019153761A5 JP2019153761A5 (enExample) 2020-12-03
JP7129793B2 true JP7129793B2 (ja) 2022-09-02

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JP2018040056A Active JP7129793B2 (ja) 2018-03-06 2018-03-06 接合装置

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US (1) US11145618B2 (enExample)
JP (1) JP7129793B2 (enExample)
CN (1) CN110233121B (enExample)
TW (1) TWI727271B (enExample)

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Publication number Priority date Publication date Assignee Title
US11205633B2 (en) * 2019-01-09 2021-12-21 Kulicke And Soffa Industries, Inc. Methods of bonding of semiconductor elements to substrates, and related bonding systems
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
US11935771B2 (en) 2021-02-17 2024-03-19 Applied Materials, Inc. Modular mainframe layout for supporting multiple semiconductor process modules or chambers
US11935770B2 (en) 2021-02-17 2024-03-19 Applied Materials, Inc. Modular mainframe layout for supporting multiple semiconductor process modules or chambers
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