JP2019153761A5 - - Google Patents
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- Publication number
- JP2019153761A5 JP2019153761A5 JP2018040056A JP2018040056A JP2019153761A5 JP 2019153761 A5 JP2019153761 A5 JP 2019153761A5 JP 2018040056 A JP2018040056 A JP 2018040056A JP 2018040056 A JP2018040056 A JP 2018040056A JP 2019153761 A5 JP2019153761 A5 JP 2019153761A5
- Authority
- JP
- Japan
- Prior art keywords
- chip
- joining
- cleaning
- joining device
- laminar flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 36
- 239000000428 dust Substances 0.000 claims description 12
- 241000309551 Arthraxon hispidus Species 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 239000012459 cleaning agent Substances 0.000 claims description 4
- 230000007723 transport mechanism Effects 0.000 claims 5
- 238000005406 washing Methods 0.000 claims 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 1
- 235000011089 carbon dioxide Nutrition 0.000 claims 1
- 239000003599 detergent Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018040056A JP7129793B2 (ja) | 2018-03-06 | 2018-03-06 | 接合装置 |
| TW108106928A TWI727271B (zh) | 2018-03-06 | 2019-02-27 | 接合裝置 |
| CN201910163642.6A CN110233121B (zh) | 2018-03-06 | 2019-03-05 | 接合装置 |
| US16/294,167 US11145618B2 (en) | 2018-03-06 | 2019-03-06 | Bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018040056A JP7129793B2 (ja) | 2018-03-06 | 2018-03-06 | 接合装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019153761A JP2019153761A (ja) | 2019-09-12 |
| JP2019153761A5 true JP2019153761A5 (enExample) | 2020-12-03 |
| JP7129793B2 JP7129793B2 (ja) | 2022-09-02 |
Family
ID=67843465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018040056A Active JP7129793B2 (ja) | 2018-03-06 | 2018-03-06 | 接合装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11145618B2 (enExample) |
| JP (1) | JP7129793B2 (enExample) |
| CN (1) | CN110233121B (enExample) |
| TW (1) | TWI727271B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11205633B2 (en) * | 2019-01-09 | 2021-12-21 | Kulicke And Soffa Industries, Inc. | Methods of bonding of semiconductor elements to substrates, and related bonding systems |
| TWI797461B (zh) * | 2019-07-26 | 2023-04-01 | 日商新川股份有限公司 | 封裝裝置 |
| US11935771B2 (en) | 2021-02-17 | 2024-03-19 | Applied Materials, Inc. | Modular mainframe layout for supporting multiple semiconductor process modules or chambers |
| US11935770B2 (en) | 2021-02-17 | 2024-03-19 | Applied Materials, Inc. | Modular mainframe layout for supporting multiple semiconductor process modules or chambers |
| JP2023068932A (ja) * | 2021-11-04 | 2023-05-18 | 信越ポリマー株式会社 | 粘着性保持治具の洗浄方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW353137B (en) * | 1996-03-28 | 1999-02-21 | Matsushita Electric Industrial Co Ltd | Manufacturing apparatus with cleaning mechanism and cleaning method |
| JP2002252251A (ja) * | 2001-02-22 | 2002-09-06 | Sony Corp | 半導体チップの実装装置及び実装方法 |
| KR20050047123A (ko) * | 2002-09-26 | 2005-05-19 | 토레이 엔지니어링 컴퍼니, 리미티드 | 접합 장치 |
| CN100470767C (zh) * | 2004-03-26 | 2009-03-18 | 富士胶片株式会社 | 接合衬底的装置及方法 |
| JP4243573B2 (ja) * | 2004-09-17 | 2009-03-25 | パナソニック株式会社 | ボンディング装置及び方法、並びに電子部品洗浄装置 |
| JP4505378B2 (ja) * | 2005-04-27 | 2010-07-21 | パナソニック株式会社 | ボンディング装置及び方法 |
| CN101542705B (zh) | 2006-11-28 | 2011-10-12 | 松下电器产业株式会社 | 电子部件安装结构体及其制造方法 |
| JP4896899B2 (ja) | 2007-01-31 | 2012-03-14 | 東京エレクトロン株式会社 | 基板処理装置およびパーティクル付着防止方法 |
| US8387674B2 (en) * | 2007-11-30 | 2013-03-05 | Taiwan Semiconductor Manufacturing Comany, Ltd. | Chip on wafer bonder |
| JP5478565B2 (ja) * | 2011-07-15 | 2014-04-23 | 東京エレクトロン株式会社 | 接合システム |
| US9142532B2 (en) | 2012-04-24 | 2015-09-22 | Bondtech Co., Ltd. | Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer |
| CN105637626A (zh) * | 2013-08-14 | 2016-06-01 | 豪锐恩科技私人有限公司 | 用于将多个半导体芯片结合到基板上的装置和方法 |
| JP6367672B2 (ja) * | 2014-09-29 | 2018-08-01 | ファスフォードテクノロジ株式会社 | 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 |
| JP6573289B2 (ja) | 2016-01-06 | 2019-09-11 | ヤマハモーターロボティクスホールディングス株式会社 | 電子部品実装装置 |
| JP6389988B2 (ja) * | 2016-06-14 | 2018-09-19 | 株式会社新川 | 異物除去装置 |
-
2018
- 2018-03-06 JP JP2018040056A patent/JP7129793B2/ja active Active
-
2019
- 2019-02-27 TW TW108106928A patent/TWI727271B/zh not_active IP Right Cessation
- 2019-03-05 CN CN201910163642.6A patent/CN110233121B/zh not_active Expired - Fee Related
- 2019-03-06 US US16/294,167 patent/US11145618B2/en not_active Expired - Fee Related
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