CN110233121B - 接合装置 - Google Patents

接合装置 Download PDF

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Publication number
CN110233121B
CN110233121B CN201910163642.6A CN201910163642A CN110233121B CN 110233121 B CN110233121 B CN 110233121B CN 201910163642 A CN201910163642 A CN 201910163642A CN 110233121 B CN110233121 B CN 110233121B
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China
Prior art keywords
chip
bonding
cleaning
unit
substrate
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Expired - Fee Related
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CN201910163642.6A
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English (en)
Chinese (zh)
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CN110233121A (zh
Inventor
井口胜次
前川真澄
泽井敬一
东坂浩由
松尾孝信
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Sharp Corp
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Sharp Corp
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    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN201910163642.6A 2018-03-06 2019-03-05 接合装置 Expired - Fee Related CN110233121B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018040056A JP7129793B2 (ja) 2018-03-06 2018-03-06 接合装置
JP2018-040056 2018-03-06

Publications (2)

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CN110233121A CN110233121A (zh) 2019-09-13
CN110233121B true CN110233121B (zh) 2023-04-07

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US (1) US11145618B2 (enExample)
JP (1) JP7129793B2 (enExample)
CN (1) CN110233121B (enExample)
TW (1) TWI727271B (enExample)

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Publication number Priority date Publication date Assignee Title
US11205633B2 (en) * 2019-01-09 2021-12-21 Kulicke And Soffa Industries, Inc. Methods of bonding of semiconductor elements to substrates, and related bonding systems
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
US11935771B2 (en) * 2021-02-17 2024-03-19 Applied Materials, Inc. Modular mainframe layout for supporting multiple semiconductor process modules or chambers
US11935770B2 (en) 2021-02-17 2024-03-19 Applied Materials, Inc. Modular mainframe layout for supporting multiple semiconductor process modules or chambers
JP2023068932A (ja) * 2021-11-04 2023-05-18 信越ポリマー株式会社 粘着性保持治具の洗浄方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1685491A (zh) * 2002-09-26 2005-10-19 东丽工程株式会社 接合装置
JP2006086418A (ja) * 2004-09-17 2006-03-30 Matsushita Electric Ind Co Ltd ボンディング装置及び方法、並びに電子部品洗浄装置
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