TWI727271B - 接合裝置 - Google Patents

接合裝置 Download PDF

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Publication number
TWI727271B
TWI727271B TW108106928A TW108106928A TWI727271B TW I727271 B TWI727271 B TW I727271B TW 108106928 A TW108106928 A TW 108106928A TW 108106928 A TW108106928 A TW 108106928A TW I727271 B TWI727271 B TW I727271B
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Taiwan
Prior art keywords
wafer
bonding
cleaning
substrate
head
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TW108106928A
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English (en)
Chinese (zh)
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TW201939629A (zh
Inventor
井口勝次
前川真澄
澤井敬一
東坂浩由
松尾孝信
Original Assignee
日商夏普股份有限公司
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Publication of TW201939629A publication Critical patent/TW201939629A/zh
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Publication of TWI727271B publication Critical patent/TWI727271B/zh

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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW108106928A 2018-03-06 2019-02-27 接合裝置 TWI727271B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-040056 2018-03-06
JP2018040056A JP7129793B2 (ja) 2018-03-06 2018-03-06 接合装置

Publications (2)

Publication Number Publication Date
TW201939629A TW201939629A (zh) 2019-10-01
TWI727271B true TWI727271B (zh) 2021-05-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108106928A TWI727271B (zh) 2018-03-06 2019-02-27 接合裝置

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US (1) US11145618B2 (enExample)
JP (1) JP7129793B2 (enExample)
CN (1) CN110233121B (enExample)
TW (1) TWI727271B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11205633B2 (en) * 2019-01-09 2021-12-21 Kulicke And Soffa Industries, Inc. Methods of bonding of semiconductor elements to substrates, and related bonding systems
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
US11935771B2 (en) 2021-02-17 2024-03-19 Applied Materials, Inc. Modular mainframe layout for supporting multiple semiconductor process modules or chambers
US11935770B2 (en) 2021-02-17 2024-03-19 Applied Materials, Inc. Modular mainframe layout for supporting multiple semiconductor process modules or chambers
JP2023068932A (ja) * 2021-11-04 2023-05-18 信越ポリマー株式会社 粘着性保持治具の洗浄方法

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TW353137B (en) * 1996-03-28 1999-02-21 Matsushita Electric Industrial Co Ltd Manufacturing apparatus with cleaning mechanism and cleaning method
TW201316442A (zh) * 2011-07-15 2013-04-16 Tokyo Electron Ltd 接合系統、基板處理系統、接合方法、及電腦記憶媒體
TW201735203A (zh) * 2016-01-06 2017-10-01 Shinkawa Kk 電子零件構裝裝置

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JP2002252251A (ja) * 2001-02-22 2002-09-06 Sony Corp 半導体チップの実装装置及び実装方法
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