JP7390386B2 - 処理液ノズルおよび洗浄装置 - Google Patents
処理液ノズルおよび洗浄装置 Download PDFInfo
- Publication number
- JP7390386B2 JP7390386B2 JP2021548806A JP2021548806A JP7390386B2 JP 7390386 B2 JP7390386 B2 JP 7390386B2 JP 2021548806 A JP2021548806 A JP 2021548806A JP 2021548806 A JP2021548806 A JP 2021548806A JP 7390386 B2 JP7390386 B2 JP 7390386B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- flow path
- discharge
- discharge port
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims description 279
- 238000004140 cleaning Methods 0.000 title claims description 42
- 239000000758 substrate Substances 0.000 claims description 52
- 238000011144 upstream manufacturing Methods 0.000 claims description 13
- 238000005187 foaming Methods 0.000 claims description 12
- 238000007664 blowing Methods 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 73
- 238000000034 method Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 19
- 239000000203 mixture Substances 0.000 description 16
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000008367 deionised water Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000001629 suppression Effects 0.000 description 7
- 238000002604 ultrasonography Methods 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 238000011086 high cleaning Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0653—Details
- B05B17/0676—Feeding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/52—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter for removal of clogging particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/58—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter preventing deposits, drying-out or blockage by recirculating the fluid to be sprayed from upstream of the discharge opening back to the supplying means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0408—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing two or more liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/0018—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with devices for making foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/24—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device
- B05B7/2486—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device with means for supplying liquid or other fluent material to several discharge devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
最初に、図1を参照しながら、実施形態に係る基板処理システム1の概略構成について説明する。図1は、実施形態に係る基板処理システム1の概略構成を示す図である。なお、基板処理システム1は、洗浄装置の一例である。以下では、位置関係を明確にするために、互いに直交するX軸、Y軸およびZ軸を規定し、Z軸正方向を鉛直上向き方向とする。
次に、処理ユニット16の構成について、図2を参照しながら説明する。図2は、処理ユニット16の具体的な構成例を示す模式図である。図2に示すように、処理ユニット16は、チャンバ20と、基板処理部30と、液供給部40と、回収カップ50とを備える。
次に、実施形態に係る処理液ノズルの一例であるノズル41aの詳細について、図3を参照しながら説明する。図3は、実施形態に係る処理液ノズルの構成を示す図である。
つづいて、実施形態に係る各種液だれ抑制機構の詳細について、図8~図10を参照しながら説明する。図8は、実施形態に係るダミーディスペンスバス82の構成を示す図である。以下に説明するダミーディスペンスバス82は、液だれ抑制機構の一例である。
1 基板処理システム(洗浄装置の一例)
16 処理ユニット
18 制御部
30 基板処理部
41a ノズル(処理液ノズルの一例)
60 超音波付与部
61 振動子
62 振動体
71 第1供給流路
72 吐出流路
73 第2供給流路
74 吐出口
82 ダミーディスペンスバス
83 吸引ノズル
84 エアブロー部
Da、Db、Dc 内径
Dd 口径
L1 第1の液体
L2 第2の液体
La、Lb 長さ
Claims (16)
- 超音波を発生させる振動子と、前記振動子に接合される振動体とを有する超音波付与部と、
前記超音波付与部の前記振動体に接する位置に第1の液体を供給する第1供給流路と、
前記超音波付与部によって超音波が付与された前記第1の液体を吐出口に供給する吐出流路と、
前記吐出流路の前記超音波付与部よりも下流側に接続され、前記吐出流路に第2の液体を供給する第2供給流路と、
を備え、
前記第1の液体は、強酸性または強アルカリ性を有し、
前記第2の液体は、発泡性を有する
処理液ノズル。 - 前記吐出流路において、前記第1供給流路との接続部から前記第2供給流路との接続部までの長さは、前記吐出口の口径以上の長さである
請求項1に記載の処理液ノズル。 - 前記吐出流路において、前記第2供給流路との接続部から前記吐出口までの長さは、前記吐出口の口径以上の長さである
請求項1または2に記載の処理液ノズル。 - 前記吐出流路の内径は、前記吐出口の口径と等しい
請求項1~3のいずれか一つに記載の処理液ノズル。 - 前記吐出流路における前記第2供給流路との接続部よりも上流側の内径は、前記吐出口の口径よりも大きい
請求項1~3のいずれか一つに記載の処理液ノズル。 - 前記第1の液体の粘度が前記第2の液体の粘度よりも大きい場合、前記吐出流路における前記第2供給流路との接続部から前記吐出口までの長さは、前記吐出流路における前記第1供給流路との接続部から前記第2供給流路との接続部までの長さよりも長い
請求項1~5のいずれか一つに記載の処理液ノズル。 - 前記第1の液体の流量が前記第2の液体の流量よりも小さい場合、前記吐出流路における前記第1供給流路との接続部から前記第2供給流路との接続部までの長さは、前記吐出流路における前記第2供給流路との接続部から前記吐出口までの長さよりも長い
請求項1~5のいずれか一つに記載の処理液ノズル。 - 前記第1の液体の供給圧力は、前記第2の液体の供給圧力よりも大きい
請求項1~7のいずれか一つに記載の処理液ノズル。 - 前記第1の液体と前記第2の液体とを混合すると反応熱が発生する場合、前記吐出流路における前記第1供給流路との接続部から前記第2供給流路との接続部までの長さは、前記吐出流路における前記第2供給流路との接続部から前記吐出口までの長さよりも長い
請求項1~8のいずれか一つに記載の処理液ノズル。 - 前記第1供給流路、または前記吐出流路における前記第2供給流路との接続部よりも上流側に接続され、第3の液体を供給する第3供給流路をさらに備える
請求項1~9のいずれか一つに記載の処理液ノズル。 - 前記吐出口から吐出される混合液を除電する除電部をさらに備える
請求項1~10のいずれか一つに記載の処理液ノズル。 - 請求項1~11のいずれか一つに記載の処理液ノズルと、
基板を保持して回転させる基板処理部と、
を備える洗浄装置。 - 前記処理液ノズルの待機位置に設けられるダミーディスペンスバスをさらに備え、
前記ダミーディスペンスバスは、前記吐出口に付着する液体を吸引する吸引ノズルを有する
請求項12に記載の洗浄装置。 - 各部を制御する制御部をさらに備え、
前記制御部は、前記基板を前記基板処理部で処理する前に、前記ダミーディスペンスバスで待機する前記処理液ノズルの前記吐出口に付着する液体を前記吸引ノズルで吸引する
請求項13に記載の洗浄装置。 - 前記処理液ノズルの待機位置に設けられるダミーディスペンスバスをさらに備え、
前記ダミーディスペンスバスは、前記吐出口に付着する液体をエアブローするエアブロー部を有する
請求項12に記載の洗浄装置。 - 各部を制御する制御部をさらに備え、
前記制御部は、前記基板を前記基板処理部で処理する前に、前記ダミーディスペンスバスで待機する前記処理液ノズルの前記吐出口に付着する液体を前記エアブロー部でエアブローする
請求項15に記載の洗浄装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019174136 | 2019-09-25 | ||
JP2019174136 | 2019-09-25 | ||
PCT/JP2020/034618 WO2021060036A1 (ja) | 2019-09-25 | 2020-09-14 | 処理液ノズルおよび洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021060036A1 JPWO2021060036A1 (ja) | 2021-04-01 |
JP7390386B2 true JP7390386B2 (ja) | 2023-12-01 |
Family
ID=75166635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021548806A Active JP7390386B2 (ja) | 2019-09-25 | 2020-09-14 | 処理液ノズルおよび洗浄装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220371041A1 (ja) |
JP (1) | JP7390386B2 (ja) |
KR (1) | KR20220066909A (ja) |
CN (1) | CN114401801B (ja) |
WO (1) | WO2021060036A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001096243A (ja) | 1999-10-01 | 2001-04-10 | Toshiba Corp | 超音波ノズルユニットとそれを用いた超音波処理装置及び超音波処理方法 |
JP2003100688A (ja) | 2001-09-25 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2007214347A (ja) | 2006-02-09 | 2007-08-23 | Matsushita Electric Ind Co Ltd | 電子デバイスの洗浄装置及び電子デバイスの洗浄方法 |
WO2007132609A1 (ja) | 2006-05-15 | 2007-11-22 | Tokyo Electron Limited | 基板処理方法、基板処理装置および記録媒体 |
JP2017069403A (ja) | 2015-09-30 | 2017-04-06 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法 |
JP2017073467A (ja) | 2015-10-07 | 2017-04-13 | 株式会社Screenホールディングス | 基板処理方法 |
JP2017183553A (ja) | 2016-03-30 | 2017-10-05 | 株式会社荏原製作所 | 基板洗浄装置及び基板処理装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2653511B2 (ja) * | 1989-03-30 | 1997-09-17 | 株式会社東芝 | 半導体装置の洗浄方法及びその洗浄装置 |
JP3415670B2 (ja) * | 1994-03-03 | 2003-06-09 | 三菱電機株式会社 | ウエハ洗浄装置 |
JP3369418B2 (ja) * | 1996-11-25 | 2003-01-20 | 大日本スクリーン製造株式会社 | 超音波振動子、超音波洗浄ノズル、超音波洗浄装置、基板洗浄装置、基板洗浄処理システムおよび超音波洗浄ノズル製造方法 |
JPH10223589A (ja) * | 1997-02-06 | 1998-08-21 | Dainippon Screen Mfg Co Ltd | 処理液吐出管、超音波洗浄ノズル、及び基板処理装置 |
JP2005074241A (ja) * | 2003-08-29 | 2005-03-24 | Toshiba Corp | 超音波処理装置および基板処理方法 |
JP4583216B2 (ja) * | 2005-03-29 | 2010-11-17 | 大日本スクリーン製造株式会社 | 基板処理方法 |
JP2007027270A (ja) * | 2005-07-13 | 2007-02-01 | Sony Corp | 洗浄装置及び洗浄方法 |
JP4915090B2 (ja) * | 2005-12-20 | 2012-04-11 | ソニー株式会社 | 薬液処理装置 |
JP4955586B2 (ja) | 2008-02-22 | 2012-06-20 | 大日本スクリーン製造株式会社 | 基板洗浄装置および基板洗浄方法 |
JP5874514B2 (ja) * | 2012-04-26 | 2016-03-02 | 東京エレクトロン株式会社 | 液処理装置、液処理方法および記憶媒体 |
CN105914167B (zh) * | 2015-02-25 | 2018-09-04 | 株式会社思可林集团 | 基板处理装置 |
JP2018110186A (ja) * | 2017-01-04 | 2018-07-12 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
JP2018129476A (ja) * | 2017-02-10 | 2018-08-16 | 東京エレクトロン株式会社 | 基板処理装置 |
KR102012207B1 (ko) * | 2017-09-21 | 2019-08-21 | 세메스 주식회사 | 액 공급 유닛 및 이를 가지는 기판 처리 장치 |
-
2020
- 2020-09-14 JP JP2021548806A patent/JP7390386B2/ja active Active
- 2020-09-14 KR KR1020227012194A patent/KR20220066909A/ko not_active Application Discontinuation
- 2020-09-14 US US17/763,371 patent/US20220371041A1/en active Pending
- 2020-09-14 WO PCT/JP2020/034618 patent/WO2021060036A1/ja active Application Filing
- 2020-09-14 CN CN202080064746.2A patent/CN114401801B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001096243A (ja) | 1999-10-01 | 2001-04-10 | Toshiba Corp | 超音波ノズルユニットとそれを用いた超音波処理装置及び超音波処理方法 |
JP2003100688A (ja) | 2001-09-25 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2007214347A (ja) | 2006-02-09 | 2007-08-23 | Matsushita Electric Ind Co Ltd | 電子デバイスの洗浄装置及び電子デバイスの洗浄方法 |
WO2007132609A1 (ja) | 2006-05-15 | 2007-11-22 | Tokyo Electron Limited | 基板処理方法、基板処理装置および記録媒体 |
JP2017069403A (ja) | 2015-09-30 | 2017-04-06 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法 |
JP2017073467A (ja) | 2015-10-07 | 2017-04-13 | 株式会社Screenホールディングス | 基板処理方法 |
JP2017183553A (ja) | 2016-03-30 | 2017-10-05 | 株式会社荏原製作所 | 基板洗浄装置及び基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN114401801A (zh) | 2022-04-26 |
WO2021060036A1 (ja) | 2021-04-01 |
KR20220066909A (ko) | 2022-05-24 |
JPWO2021060036A1 (ja) | 2021-04-01 |
US20220371041A1 (en) | 2022-11-24 |
CN114401801B (zh) | 2023-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5016351B2 (ja) | 基板処理システム及び基板洗浄装置 | |
CN108780746B (zh) | 基板清洗装置、基板清洗方法、基板处理装置以及基板干燥装置 | |
US10090189B2 (en) | Substrate cleaning apparatus comprising a second jet nozzle surrounding a first jet nozzle | |
TWI558476B (zh) | 基板清潔方法及基板清潔裝置 | |
CN104941948B (zh) | 基板清洗方法及基板清洗装置 | |
JP5712061B2 (ja) | 基板処理方法及び基板処理ユニット | |
JP2004515053A (ja) | ウェーハ洗浄方法及び装置 | |
CN102349135B (zh) | 移除颗粒污染物的方法 | |
US20150318183A1 (en) | Substrate liquid processing apparatus and substrate liquid processing method | |
JP2000147787A (ja) | 現像方法及び現像装置 | |
JP7390386B2 (ja) | 処理液ノズルおよび洗浄装置 | |
KR102264352B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
JP4036815B2 (ja) | 洗浄装置 | |
JP6282850B2 (ja) | 基板洗浄装置および基板処理装置 | |
JP4279008B2 (ja) | 基板処理装置および基板処理方法 | |
TW202228864A (zh) | 基板清洗裝置及基板的清洗方法 | |
JP2002159922A (ja) | 超音波洗浄装置 | |
JPH1064868A (ja) | 基板洗浄装置および基板洗浄方法 | |
JP7437499B2 (ja) | 基板の洗浄方法及び洗浄装置 | |
JP2017163017A (ja) | 基板処理装置 | |
KR102461262B1 (ko) | 기판 세정 장치 | |
JP2001104897A (ja) | 超音波洗浄装置及び洗浄方法 | |
US12100586B2 (en) | Substrate cleaning method and apparatus | |
JP2024014249A (ja) | 基板処理方法および基板処理装置 | |
JP2021061362A (ja) | 洗浄装置、基板処理装置および異常判断方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230323 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230711 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230721 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231024 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231120 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7390386 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |