JP7106863B2 - 有機ｅｌ表示装置用感光性樹脂組成物 - Google Patents

有機ｅｌ表示装置用感光性樹脂組成物 Download PDF

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JP7106863B2
JP7106863B2 JP2017531409A JP2017531409A JP7106863B2 JP 7106863 B2 JP7106863 B2 JP 7106863B2 JP 2017531409 A JP2017531409 A JP 2017531409A JP 2017531409 A JP2017531409 A JP 2017531409A JP 7106863 B2 JP7106863 B2 JP 7106863B2
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resin composition
organic
group
photosensitive resin
mol
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JPWO2017217292A1 (ja
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悠佑 小森
聡 亀本
一登 三好
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Toray Industries Inc
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Toray Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2017531409A 2016-06-16 2017-06-07 有機ｅｌ表示装置用感光性樹脂組成物 Active JP7106863B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016119524 2016-06-16
JP2016119524 2016-06-16
PCT/JP2017/021093 WO2017217292A1 (ja) 2016-06-16 2017-06-07 感光性樹脂組成物、感光性シート、硬化膜、素子、有機ｅｌ表示装置、半導体電子部品、半導体装置および有機ｅｌ表示装置の製造方法

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JPWO2017217292A1 JPWO2017217292A1 (ja) 2019-04-04
JP7106863B2 true JP7106863B2 (ja) 2022-07-27

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JP (1) JP7106863B2 (ko)
KR (1) KR102360394B1 (ko)
TW (1) TWI734795B (ko)
WO (1) WO2017217292A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7210999B2 (ja) * 2018-10-22 2023-01-24 東レ株式会社 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置および表示装置
WO2020184326A1 (ja) 2019-03-14 2020-09-17 東レ株式会社 感光性樹脂組成物、感光性樹脂シート、硬化膜、硬化膜の製造方法、有機ｅｌ表示装置、および電子部品
CN113474380A (zh) * 2019-03-15 2021-10-01 日本化药株式会社 聚酰胺酸树脂、聚酰亚胺树脂及含有这些的树脂组合物
JP7329344B2 (ja) * 2019-03-22 2023-08-18 太陽ホールディングス株式会社 感光性樹脂組成物、ドライフィルム、硬化物、及び、電子部品
JP7390964B2 (ja) 2019-05-27 2023-12-04 信越化学工業株式会社 有機膜形成用材料、半導体装置製造用基板、及び有機膜の形成方法
CN115678005A (zh) * 2021-07-13 2023-02-03 上海邃铸科技有限公司 聚合物、树脂组合物、树脂膜以及半导体器件和发光器件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152590A (ja) 2002-10-30 2004-05-27 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子
JP2010139993A (ja) 2008-12-15 2010-06-24 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性エレメント
JP2011222787A (ja) 2010-04-09 2011-11-04 Dainippon Printing Co Ltd 薄膜トランジスタ基板
JP2011242531A (ja) 2010-05-17 2011-12-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた感光性フィルム
JP2011256242A (ja) 2010-06-07 2011-12-22 Asahi Kasei E-Materials Corp ポリイミド前駆体、感光性樹脂組成物及びテトラカルボン酸二無水物
JP2012234030A (ja) 2011-04-28 2012-11-29 Kaneka Corp ポジ型感光性樹脂組成物
JP2014111723A (ja) 2012-10-29 2014-06-19 Hitachi Chemical Dupont Microsystems Ltd 可溶性ポリイミド、該可溶性ポリイミドを用いたパターン硬化膜の製造方法及び電子部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777159B1 (en) 1999-05-31 2004-08-17 Pi R&D Co., Ltd. Method for forming polyimide pattern using photosensitive polyimide and composition for use therein
JP2007183388A (ja) 2006-01-06 2007-07-19 Toray Ind Inc 感光性樹脂組成物、耐熱性樹脂パターンの製造方法および有機電界発光素子
JP5201155B2 (ja) 2009-01-27 2013-06-05 新日本理化株式会社 ポリ（アミド酸―イミド）樹脂
TWI440656B (zh) 2009-11-16 2014-06-11 Asahi Kasei E Materials Corp A polyimide precursor and a photosensitive resin composition comprising the polyimide precursor
JP2011202059A (ja) 2010-03-26 2011-10-13 Toray Ind Inc 樹脂およびポジ型感光性樹脂組成物
JP2013533508A (ja) 2010-07-14 2013-08-22 エルジー・ケム・リミテッド ポジティブ型感光性樹脂組成物およびこれを含む有機発光素子ブラックバンク

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152590A (ja) 2002-10-30 2004-05-27 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子
JP2010139993A (ja) 2008-12-15 2010-06-24 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性エレメント
JP2011222787A (ja) 2010-04-09 2011-11-04 Dainippon Printing Co Ltd 薄膜トランジスタ基板
JP2011242531A (ja) 2010-05-17 2011-12-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた感光性フィルム
JP2011256242A (ja) 2010-06-07 2011-12-22 Asahi Kasei E-Materials Corp ポリイミド前駆体、感光性樹脂組成物及びテトラカルボン酸二無水物
JP2012234030A (ja) 2011-04-28 2012-11-29 Kaneka Corp ポジ型感光性樹脂組成物
JP2014111723A (ja) 2012-10-29 2014-06-19 Hitachi Chemical Dupont Microsystems Ltd 可溶性ポリイミド、該可溶性ポリイミドを用いたパターン硬化膜の製造方法及び電子部品

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JPWO2017217292A1 (ja) 2019-04-04
TW201821481A (zh) 2018-06-16
KR102360394B1 (ko) 2022-02-10
TWI734795B (zh) 2021-08-01
WO2017217292A1 (ja) 2017-12-21
KR20190020016A (ko) 2019-02-27

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