JP7076400B2 - 熱伝導性シリコーン組成物、半導体装置及びその製造方法 - Google Patents

熱伝導性シリコーン組成物、半導体装置及びその製造方法 Download PDF

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JP7076400B2
JP7076400B2 JP2019098441A JP2019098441A JP7076400B2 JP 7076400 B2 JP7076400 B2 JP 7076400B2 JP 2019098441 A JP2019098441 A JP 2019098441A JP 2019098441 A JP2019098441 A JP 2019098441A JP 7076400 B2 JP7076400 B2 JP 7076400B2
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JP2020193250A (ja
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翔太 秋場
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Shin Etsu Chemical Co Ltd
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Priority to EP20813307.4A priority patent/EP3979314A4/en
Priority to CN202080037748.2A priority patent/CN113853676A/zh
Priority to PCT/JP2020/015462 priority patent/WO2020241054A1/ja
Priority to KR1020217037727A priority patent/KR20220012850A/ko
Priority to US17/607,133 priority patent/US12060517B2/en
Priority to TW109111940A priority patent/TWI834860B/zh
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    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
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    • C09K5/14—Solid materials, e.g. powdery or granular
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H01L2224/29191—The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene

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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2019098441A 2019-05-27 2019-05-27 熱伝導性シリコーン組成物、半導体装置及びその製造方法 Active JP7076400B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019098441A JP7076400B2 (ja) 2019-05-27 2019-05-27 熱伝導性シリコーン組成物、半導体装置及びその製造方法
CN202080037748.2A CN113853676A (zh) 2019-05-27 2020-04-06 导热性有机硅组合物、半导体装置及其制造方法
PCT/JP2020/015462 WO2020241054A1 (ja) 2019-05-27 2020-04-06 熱伝導性シリコーン組成物、半導体装置及びその製造方法
KR1020217037727A KR20220012850A (ko) 2019-05-27 2020-04-06 열전도성 실리콘 조성물, 반도체 장치 및 그의 제조방법
EP20813307.4A EP3979314A4 (en) 2019-05-27 2020-04-06 HEAT-CONDUCTING SILICONE COMPOSITION, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
US17/607,133 US12060517B2 (en) 2019-05-27 2020-04-06 Thermal conductive silicone composition, semiconductor device, and method for manufacturing the same
TW109111940A TWI834860B (zh) 2019-05-27 2020-04-09 熱傳導性矽氧組成物、半導體裝置及其製造方法

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JP2019098441A JP7076400B2 (ja) 2019-05-27 2019-05-27 熱伝導性シリコーン組成物、半導体装置及びその製造方法

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JP2020193250A5 JP2020193250A5 (enExample) 2022-01-06
JP7076400B2 true JP7076400B2 (ja) 2022-05-27

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EP (1) EP3979314A4 (enExample)
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KR (1) KR20220012850A (enExample)
CN (1) CN113853676A (enExample)
TW (1) TWI834860B (enExample)
WO (1) WO2020241054A1 (enExample)

Families Citing this family (2)

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KR102318181B1 (ko) 2017-02-08 2021-10-27 엘켐 실리콘즈 유에스에이 코포레이션 열 관리가 개선된 이차 배터리 팩
WO2023276846A1 (ja) * 2021-07-02 2023-01-05 信越化学工業株式会社 熱伝導性シリコーン組成物、半導体装置及びその製造方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2002299534A (ja) 2001-04-02 2002-10-11 Denso Corp 放熱材およびその製造方法
WO2017159252A1 (ja) 2016-03-18 2017-09-21 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置

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JPH0639591B2 (ja) 1988-12-05 1994-05-25 信越化学工業株式会社 シリコーングリース組成物
US5011870A (en) 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
JP3130193B2 (ja) 1993-10-06 2001-01-31 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴム用銀粉末、その製造方法、およびシリコーンゴム組成物
JP3142800B2 (ja) 1996-08-09 2001-03-07 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース
JP2930298B1 (ja) 1998-08-18 1999-08-03 信越化学工業株式会社 熱伝導性グリース組成物
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP3677671B2 (ja) 1999-04-30 2005-08-03 東レ・ダウコーニング株式会社 シリコーンゴム用銀粉末の製造方法
JP2002030217A (ja) 2000-07-17 2002-01-31 Fujitsu Ltd 熱伝導性シリコーン組成物
JP2004111253A (ja) * 2002-09-19 2004-04-08 Noda Screen:Kk 電子デバイスの電気的接続用導電性組成物および電子デバイス
JP4551074B2 (ja) * 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP3130193U (ja) 2006-12-28 2007-03-15 ライオン株式会社 エアゾール缶用押しボタン
JP2008222776A (ja) 2007-03-09 2008-09-25 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP6318137B2 (ja) 2015-09-30 2018-04-25 Ｄｏｗａエレクトロニクス株式会社 導電性ペースト及び導電膜
EP3150672B1 (en) 2015-10-02 2018-05-09 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition and semiconductor device
JP2017159252A (ja) 2016-03-10 2017-09-14 株式会社キャタラー 排ガス浄化用触媒
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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2002299534A (ja) 2001-04-02 2002-10-11 Denso Corp 放熱材およびその製造方法
WO2017159252A1 (ja) 2016-03-18 2017-09-21 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置

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EP3979314A4 (en) 2023-08-09
TW202106810A (zh) 2021-02-16
CN113853676A (zh) 2021-12-28
WO2020241054A1 (ja) 2020-12-03
TWI834860B (zh) 2024-03-11
EP3979314A1 (en) 2022-04-06
KR20220012850A (ko) 2022-02-04
US12060517B2 (en) 2024-08-13
JP2020193250A (ja) 2020-12-03
US20220213370A1 (en) 2022-07-07

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