WO2022264715A1 - 熱伝導性ポリシロキサン組成物 - Google Patents
熱伝導性ポリシロキサン組成物 Download PDFInfo
- Publication number
- WO2022264715A1 WO2022264715A1 PCT/JP2022/019901 JP2022019901W WO2022264715A1 WO 2022264715 A1 WO2022264715 A1 WO 2022264715A1 JP 2022019901 W JP2022019901 W JP 2022019901W WO 2022264715 A1 WO2022264715 A1 WO 2022264715A1
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- WO
- WIPO (PCT)
- Prior art keywords
- component
- group
- polysiloxane composition
- thermally conductive
- silver powder
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 78
- -1 polysiloxane Polymers 0.000 title claims abstract description 70
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 59
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000002245 particle Substances 0.000 claims abstract description 28
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 15
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 12
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 4
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 20
- 239000011164 primary particle Substances 0.000 description 15
- 239000000047 product Substances 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011231 conductive filler Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 238000011049 filling Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007561 laser diffraction method Methods 0.000 description 4
- 238000000790 scattering method Methods 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000002683 reaction inhibitor Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000004438 BET method Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- KNVOCSQDAIHOPP-UHFFFAOYSA-N 2-ethynylcyclohexan-1-ol Chemical compound OC1CCCCC1C#C KNVOCSQDAIHOPP-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- QYXVDGZUXHFXTO-UHFFFAOYSA-L 3-oxobutanoate;platinum(2+) Chemical compound [Pt+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O QYXVDGZUXHFXTO-UHFFFAOYSA-L 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004799 bromophenyl group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004966 cyanoalkyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000004212 difluorophenyl group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001207 fluorophenyl group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000008282 halocarbons Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Definitions
- the present invention relates to a thermally conductive polysiloxane composition.
- Thermally conductive silicone compositions using silver powder with high thermal conductivity as a thermally conductive filler are known.
- a conductive silicone composition is disclosed, and it is shown that a silver powder having an aspect ratio of 2.0 or more and 150.0 or less can be suitably used (Patent Document 2).
- Patent Document 1 still had insufficient thermal conductivity.
- silicone compositions of Patent Literatures 2 and 3 exhibit a certain level of thermal conductivity, when the silver powder is highly filled, the viscosity of the composition rises, resulting in poor workability.
- the problem to be solved by the present invention is to provide a thermally conductive polysiloxane composition with excellent workability and high thermal conductivity due to its low viscosity, and a heat dissipation material using the same.
- the present inventors have focused on silver powder as a thermally conductive material, and as a result of intensive studies, a polysiloxane composition that uses two types of silver powder, each of which has a specific shape, has low viscosity and is easy to work.
- the present inventors have found that it is excellent in heat conductivity and thermal conductivity, and have completed the present invention.
- the gist of the present invention is as follows.
- a thermally conductive polysiloxane composition containing powder wherein the content of component (A-1) and component (A-2) in 100% by mass of the thermally conductive polysiloxane composition is 70 to 98% by mass.
- thermoly conductive polysiloxane composition with excellent workability due to its low viscosity and high thermal conductivity, and a heat dissipation material using the same.
- the thermally conductive polysiloxane composition of the present invention comprises (A) silver powder, (B) a polyorganosiloxane containing one or more aliphatic unsaturated groups in the molecule, and (C) a silicon atom bonded in the molecule. containing a polyorganohydrogensiloxane having two or more hydrogen atoms and (D) a platinum-based catalyst, and (A) component (A-1) having a tap density of 3.0 to 10.0 g/cm 3 , flaky silver powder having an average particle size of 1 to 20 ⁇ m, and (A-2) agglomerated silver powder having a tap density of 1.0 to 5.0 g/cm 3 and an average particle size of 1 to 10 ⁇ m. and the content of component (A-1) and component (A-2) in 100% by mass of the thermally conductive polysiloxane composition is 70 to 98% by mass.
- Component (A) is silver powder and is a component that imparts thermal conductivity to the polysiloxane composition.
- components (A) (A-1) flaky silver powder having a tap density of 3.0 to 10.0 g/cm 3 and an average particle size of 1 to 20 ⁇ m, and (A-2) a tap density of 1.0 to 5.0 g/cm 3 and an average particle size of 1 to 10 ⁇ m, the combined use of the agglomerated silver powder results in a low viscosity even when the component (A) is highly filled in the polysiloxane composition. can be maintained and high thermal conductivity can be obtained.
- Component (A-1) is flaky silver powder having a tap density of 3.0 to 10.0 g/cm 3 and an average particle size of 1 to 20 ⁇ m.
- the silver powder of component (A-1) can significantly improve thermal conductivity.
- the flaky silver powder refers to silver powder having a substantially flat surface (XY plane) and a substantially uniform thickness (Z).
- the tap density of component (A-1) is 3.0 to 10.0 g/cm 3 .
- the tap density of component (A-1) is preferably 3.5 to 8.0 g/cm 3 , more preferably 3.5 to 7.0 g/cm 3 , still more preferably 3.7 to 6 0 g/cm 3 .
- the tap density was measured by weighing 100 g of silver powder, gently dropping it into a 100 ml graduated cylinder with a funnel, placing the graduated cylinder on the tap density measuring instrument, and dropping it 600 times at a speed of 60 times/minute at a drop distance of 20 mm. It is a value calculated from the volume of the compressed silver powder.
- the average particle size of component (A-1) is 1 to 20 ⁇ m.
- the component (A-1) has a particle size distribution peak in the range of 1 to 20 ⁇ m.
- the average particle size of component (A-1) is more preferably 2 to 15 ⁇ m, particularly preferably 3 to 10 ⁇ m.
- the measured value of the average particle diameter of component (A-1) is the median diameter (d50) measured by the laser diffraction/scattering method.
- the median diameter (d50) by the laser diffraction/scattering method can be measured using, for example, SALD-2300 manufactured by Shimadzu Corporation.
- the specific surface area of the component (A-1) by the BET method is 0.05 to 2.0 m. 3 /g, more preferably 0.06 to 1.0 m 3 /g, still more preferably 0.08 to 0.5 m 3 /g.
- the aspect ratio of the component (A-1) is preferably 2.0 to 150.0, more preferably 3.0 to It is in the range of 100.0, more preferably in the range of 3.0 to 50.0.
- the aspect ratio refers to the case where the flaky silver powder is observed using a scanning electron microscope (SEM), the maximum diameter in the XY plane is the major axis, and the thickness (Z) is the minor axis. , is calculated as the ratio of major diameter/minor diameter. As used herein, the aspect ratio is the average value of the major axis/minor axis ratio of 100 flaky silver powders.
- the method for producing the silver powder is not particularly limited, but examples include electrolysis, pulverization, heat treatment, atomization, and reduction.
- the silver powder may be hydrophobized by a known method. As long as the silver powder of the component (A-1) has a flaky form, the silver powder produced by the above method may be used as it is, or it may be pulverized so as to satisfy the above numerical range. good.
- the device is not particularly limited, and examples thereof include known devices such as stamp mills, ball mills, vibration mills, hammer mills, rolling rollers, and mortars.
- the silver powder of component (A-1) is commercially available, for example, Silcoat (registered trademark) AgC-2190H and AgC-221A manufactured by Fukuda Metal Foil & Powder Co., Ltd., Silvest (registered trademark) manufactured by Tokuriki Honten Co., Ltd. TC-466, FA-D-3 manufactured by DOWA Electronics Co., Ltd., etc. can be used.
- the component (A-1) may be used alone or in combination of two or more.
- Component (A-2) is an agglomerated silver powder having a tap density of 1.0 to 5.0 g/cm 3 and an average particle size of 1 to 10 ⁇ m.
- agglomerated silver powder refers to silver particles formed by agglomeration of two or more primary particles having a primary particle size of 0.1 to 5.0 ⁇ m.
- the primary particle size is preferably in the range of 0.2-2.0 ⁇ m, more preferably in the range of 0.5-1.0 ⁇ m.
- the number of primary particles in the aggregated silver powder is preferably 5 or more, more preferably 10 or more. Although the upper limit of the number of primary particles is not particularly limited, it is, for example, 1000 or less.
- the agglomerated silver powder may be agglomerated with primary particles having a primary particle size outside the range of 0.1 to 5.0 ⁇ m.
- the number of primary particles having a primary particle size of 0.1 to 5.0 ⁇ m is preferably 50% or more, more preferably 70% or more, of the total number of primary particles constituting the aggregated silver powder. It is preferably 80% or more, and more preferably 80% or more.
- the upper limit of the number of primary particles having a primary particle size of 0.1 to 5.0 ⁇ m with respect to the total number of primary particles constituting the aggregated silver powder is 100%.
- the particle size of the primary particles forming the aggregated silver powder can be obtained by observing the aggregated silver powder using a scanning electron microscope (SEM) and calculating the equivalent circle diameter of the observed primary particles. .
- the thermal conductivity of the cured product is still insufficient.
- the present inventors have made intensive studies in order to increase the filling efficiency of the silver powder. It was found that a composition can be obtained and a higher thermal conductivity can be achieved than a composition using the component (A-1) alone.
- the contact area between the silver particles increases compared to the case where the flaky silver powder contacts each other or the flaky silver powder and the single-particulate silver powder contact each other. , it is considered that high thermal conductivity can be obtained.
- the tap density of component (A-2) is 1.0 to 5.0 g/cm 3 .
- the tap density of component (A-2) is preferably 1.3 to 4.0 g/cm 3 , more preferably 1.5 to 3.0 g/cm 3 .
- the method for measuring the tap density is the same as for the component (A-1).
- the average particle size of component (A-2) is 1 to 10 ⁇ m.
- the component (A-2) has a particle size distribution peak in the range of 1 to 10 ⁇ m.
- the average particle size of component (A-2) is more preferably 1 to 8 ⁇ m, still more preferably 1 to 6 ⁇ m, particularly preferably 2 to 6 ⁇ m.
- the measured value of the average particle diameter of component (A-2) is the median diameter (d50) measured by the air permeation method.
- the median diameter (d50) by the air permeation method can be measured using, for example, Subsieve AutoSizer manufactured by Micromeritics Japan LLC.
- the specific surface area of the component (A-2) by the BET method is preferably 0.05 to 2.0 m 3 /g, and more It is preferably 0.06 to 1.0 m 3 /g, more preferably 0.08 to 0.8 m 3 /g.
- the method for producing the silver powder of component (A-2) is not particularly limited, but examples thereof include electrolytic method, pulverization method, heat treatment method, atomization method, reduction method and the like.
- the silver powder may be hydrophobized by a known method.
- the (A-2) component silver powder is commercially available, and for example, Silcoat (registered trademark) AgC-74SE, AgC-131, AgC-101H, etc. manufactured by Fukuda Metal Foil & Powder Co., Ltd. can be used.
- the component (A-2) may be used alone or in combination of two or more.
- the content of components (A-1) and (A-2) in 100% by mass of the thermally conductive polysiloxane composition is 70 to 98% by mass.
- the content of components (A-1) and (A-2) in 100% by mass of the thermally conductive polysiloxane composition is preferably 80 to 98% by mass, more preferably 85 to 97% by mass. more preferred.
- the (A) component may contain silver powder other than the (A-1) component and the (A-2) component within a range that does not impair the effects of the present invention.
- the total content of components (A-1) and (A-2) in 100% by mass of component (A) is preferably 80% by mass or more, more preferably 85% by mass or more, and further Preferably, it is 90% by mass or more.
- the upper limit of the total content of components (A-1) and (A-2) in 100% by mass of component (A) is 100% by mass.
- the mass ratio of component (A-1)/component (A-2) is preferably 0.3 to 1.0. If the mass ratio of component (A-1)/component (A-2) is less than 0.3, the viscosity of the composition increases and the workability tends to be poor when the silver powder is highly filled. If it is greater than 0, the thermal conductivity of the cured product tends to be poor.
- the mass ratio of component (A-1)/component (A-2) is more preferably 0.4 to 0.9, even more preferably 0.5 to 0.8.
- (B) component Polyorganosiloxane containing one or more aliphatic unsaturated groups in the molecule is a component that serves as a base polymer in the composition.
- Component (B) has at least one aliphatic unsaturated group bonded to a silicon atom in one molecule and is capable of undergoing an addition reaction with the hydrosilyl group (Si—H group) of component (C). is not particularly limited.
- the polyorganosiloxane containing one or more aliphatic unsaturated groups in the molecule of component (B) those represented by the following average compositional formula (I) can be used.
- R 41 is an aliphatic unsaturated group
- R 42 is a substituted or unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturated bond
- j and k are 0 ⁇ j ⁇ is a positive number that satisfies 3, 0 ⁇ k ⁇ 3, and 1 ⁇ j+k ⁇ 3.
- the aliphatic unsaturated group for R 41 preferably has 2 to 8 carbon atoms, and examples thereof include vinyl, allyl, propenyl, 1-butenyl, and 1-hexenyl groups. , preferably a vinyl group.
- One or more, preferably two or more, aliphatic unsaturated groups are contained in one molecule.
- the aliphatic unsaturated group may be bonded to a silicon atom at the end of the molecular chain, to a silicon atom in the middle of the molecular chain, or to both.
- R 42 examples include alkyl groups such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group and tert-butyl group; cycloalkyl groups such as cyclopentyl group, cyclohexyl group and cyclobutyl group; phenyl group.
- j and k are preferably numbers satisfying 0.0005 ⁇ j ⁇ 1, 1.5 ⁇ k ⁇ 2.4, and 1.5 ⁇ j+k ⁇ 2.5, more preferably 0.001 ⁇ j ⁇ 0.5, 1.8 ⁇ k ⁇ 2.1, and 1.8 ⁇ j+k ⁇ 2.2.
- component (B) can be linear, branched or cyclic, with linear or branched being preferred.
- component (B) is particularly preferably a straight-chain polyorganosiloxane whose both ends are blocked with Mvi units (dimethylvinylsiloxane units) and whose intermediate units consist only of D units (dimethylsiloxane units).
- the viscosity of component (B) at 23° C. is preferably 10 to 100,000 mPa ⁇ s. More preferably, it is 20 to 10,000 mPa ⁇ s.
- component (B) with respect to 100 parts by mass of component (A) is preferably 1.5 to 35 parts by mass, more preferably 1.5 to 30 parts by mass, and even more preferably 1.5 to 28 parts by mass. parts, particularly preferably 1.5 to 15 parts by mass.
- the component (B) may be used alone or in combination of two or more.
- component (C) A polyorganohydrogensiloxane having two or more silicon-bonded hydrogen atoms in its molecule is a cross-linking agent for component (B).
- Component (C) has two or more, preferably three or more silicon-bonded hydrogen atoms in one molecule. This hydrogen atom may be bonded to a silicon atom at the end of the molecular chain, to a silicon atom in the middle of the molecular chain, or to both.
- Polyorganohydrogensiloxanes having hydrogen atoms bonded only to silicon atoms at both ends can also be used.
- the molecular structure of component (C) may be linear, branched, cyclic, or three-dimensional network, and may be used alone or in combination of two or more.
- R 51 m H n SiO [4 ⁇ (m+n)]/2 (II) ( In the formula, R51 is a substituted or unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturation; m and n are 0.5 ⁇ m ⁇ 2, 0 ⁇ n ⁇ 2, and 0 .5 ⁇ m+n ⁇ 3.)
- R 51 include the groups exemplified for R 42 in the average composition formula (I). Among these, an alkyl group is preferred, and a methyl group is more preferred, from the viewpoints of ease of synthesis and cost.
- n and n are preferably numbers satisfying 0.6 ⁇ m ⁇ 1.9, 0.01 ⁇ n ⁇ 1.0, and 0.6 ⁇ m+n ⁇ 2.8.
- the viscosity of component (C) at 23°C is preferably 10 to 500 mPa ⁇ s.
- a linear polymethylhydrogensiloxane whose both ends are blocked with M units (trimethylsiloxane units) and whose intermediate units consist only of DH units (methylhydrogensiloxane units); block with units (trimethylsiloxane units), intermediate units consist of only D units (dimethylsiloxane units) and DH units (methylhydrogensiloxane units), and methylhydrogensiloxane units per 1 mol of dimethylsiloxane units 0.1 to 2.0 mol of linear polymethylhydrogensiloxane: or polymethylhydrogensiloxane consisting exclusively of M H units (dimethylhydrogensiloxane units) and Q units (SiO 4/2 units), in particular preferable.
- the amount of component (C) is 0.1 to 20 silicon-bonded hydrogen atoms in component (C) per one silicon-bonded aliphatic unsaturated group in component (B). and more preferably 0.2 to 15.
- the amount of component (C) is within the above range, the thermally conductive polysiloxane composition has good stability over time, and when cured, the degree of cross-linking tends to be sufficient, and a cured product with an appropriate hardness can be obtained.
- Cheap is 0.1 to 20 silicon-bonded hydrogen atoms in component (C) per one silicon-bonded aliphatic unsaturated group in component (B). and more preferably 0.2 to 15.
- the platinum-based catalyst is a component that accelerates curing after mixing components (B) and (C).
- component (D) well-known catalysts used for hydrosilylation reactions can be used. For example, platinum black, platinum chloride, chloroplatinic acid, reaction product of chloroplatinic acid and monohydric alcohol, complex of chloroplatinic acid and olefins or vinylsiloxane, platinum-vinyl tetramer complex, platinum bisacetoacetate, etc. can be mentioned.
- the amount of component (D) can be appropriately adjusted according to the desired curing speed and the like. .1 to 1,000 ppm is preferred.
- Component (D) may be used alone or in combination of two or more.
- reaction inhibitors for platinum group metals include acetylene alcohols such as 2-methyl-3-butyn-2-ol and 1-ethynyl-2-cyclohexanol, and diallyl maleate.
- the thermally conductive polysiloxane composition contains (E) one or more dialkoxysilyl groups or trialkoxysilyl groups in the molecule.
- a compound containing Component (E) has at least the following general formula in one molecule: —SiR 11 3-z (OR 12 ) z (III)
- R 11 is an alkyl group having 1 to 6 carbon atoms, preferably a methyl group
- R 12 is an alkyl group having 1 to 6 carbon atoms, preferably a methyl group
- z is 2 or 3.
- a compound having an alkoxysilyl group represented by is preferable, and a compound represented by the following general formula (1) is particularly preferable.
- the unit containing R 1 , the unit containing R 2 , and the unit represented by SiR 3 2 O need not be arranged as shown in general formula (1). , for example, a unit represented by SiR 3 2 O may be present between the unit containing R 1 and the unit containing R 2 .
- R 1 a group having an alkoxysilyl group having 1 to 4 carbon atoms
- R 2 the following general formula (2): (wherein R 4 is each independently a monovalent hydrocarbon group having 1 to 12 carbon atoms; Y is a group selected from the group consisting of R 1 , R 4 and an aliphatic unsaturated group; and d is an integer of 2 to 500, preferably an integer of 4 to 400, more preferably an integer of 10 to 200, particularly preferably an integer of 10 to 60) or a group having 6 carbon atoms ⁇ 18 monovalent hydrocarbon groups, X: each independently a divalent hydrocarbon group having 2 to 10 carbon atoms, a and b: each independently an integer of 1 or more; c: an integer of 0 or more, a + b + c: an integer of 4 or more, R 3 : each independently a monovalent hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom; )
- preferred examples of the compound represented by general formula (1) include compounds represented by the following structural formulas.
- the content of component (E) in the thermally conductive polysiloxane composition is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass per 100 parts by mass of component (A). parts, particularly preferably 0.5 to 5 parts by mass.
- the (E) component may be used alone or in combination of two or more.
- the thermally conductive polysiloxane composition further optionally contains a flame retardant agent, a heat resistance improver, a plasticizer, a coloring agent, an adhesion agent, a diluent, and an organic or inorganic thermal conductor.
- thermally conductive fillers other than component (A); polyorganosiloxanes other than components (B), (C) and (E); can be contained in
- Thermally conductive fillers other than component (A) include, for example, metal oxides such as alumina, zinc oxide, magnesium oxide and silica; nitrides such as aluminum nitride and boron nitride; metals such as aluminum, copper and gold; Metal/metal oxide core-shell particles and the like can be used.
- the thermally conductive polysiloxane composition can be obtained by mixing components (A) to (D), and optionally (E) and other components in a mixer such as a planetary mixer. At the time of mixing, if necessary, the mixture may be mixed while being heated in the range of 50 to 150°C. Furthermore, for uniform finishing, it is preferable to perform the kneading operation under high shear force.
- a kneading device there are a three-roll mill, a colloid mill, a sand grinder, etc. Among them, a method using three rolls is preferable.
- Methods for curing the thermally conductive polysiloxane composition include, for example, a method of applying the composition to an adherend requiring heat dissipation and then leaving the composition at room temperature, a method of heating at a temperature of 50 to 200°C. etc. From the viewpoint of rapid curing, it is preferable to employ a heating method.
- the heat-dissipating material containing the cured product of the thermally conductive polysiloxane composition has a thermal conductivity of 2.0 W/(m ⁇ K) or more at 23° C. measured by the hot wire method.
- the thermal conductivity is preferably 8 W/(m ⁇ K) or more, more preferably 10 W/(m ⁇ K) or more.
- the content of component (A) in the composition is preferably 70% by mass or more, more preferably 80% by mass or more, and still more preferably 85% by mass. % by mass or more, and the content of component (A) can be increased according to the required thermal conductivity.
- Heat dissipation materials include PCs/servers, power modules, super LSIs, and electronic devices equipped with optical components (optical pickups, LEDs, etc.); home appliances (DVD/HDD recorders (or players ), BD/DVD/HDD recorder (or player), AV equipment such as FPD, etc.); PC peripherals; home game consoles; automobiles; can.
- A-1 Component: Flake-shaped silver powder Silcoat (registered trademark) AgC-2190H manufactured by Fukuda Metal Foil & Powder Co., Ltd. (tap density: 4.35 g/cm 3 , apparent density: 2.64 g/ cm 3 , median diameter (d50) measured by laser diffraction/scattering method: 6.8 ⁇ m, BET specific surface area: 0.36 m 2 /g, aspect ratio: 12)
- A-2) Component: Agglomerated silver powder Silcoat (registered trademark) AgC-74SE manufactured by Fukuda Metal Foil & Powder Co., Ltd.
- thermophysical property measuring device TPS 1500, manufactured by Kyoto Electronics Industry Co., Ltd.
- Examples 1-2 and Comparative Examples 1-3 Components (A), (B) and (E) shown in Table 1 were charged in a plastic container, respectively, and stirred and mixed at room temperature for 5 minutes in a rotation/revolution mixer to obtain a mixture. After that, components (C), (D) and (D-2) were added to and mixed with the mixture to obtain thermally conductive polysiloxane compositions of Examples 1 and 2 and Comparative Examples 1 and 3. The viscosity of the composition thus obtained was measured. Table 1 shows the results.
- thermally conductive polysiloxane compositions of Examples 1 and 2 and Comparative Examples 1 and 3 were cured by heating in a mold at 150° C. for 1 hour to obtain cured products of thermally conductive polysiloxane compositions having a thickness of 6 mm. got The thermal conductivity of the cured product thus obtained was measured. Table 1 shows the results.
- the component (A) consists of (A-1) flaky silver powder having a tap density of 3.0 to 10.0 g/cm 3 and an average particle diameter of 1 to 20 ⁇ m, and (A-2) a tap density of 1.0 to 5.0 g/cm 3 and containing agglomerated silver powder having an average particle size of 1 to 10 ⁇ m, the component (A-1) and (A
- Comparative Example 1 in which only (A-1) flaky silver powder was used as the (A) component, resulted in poor thermal conductivity of the cured product.
- Comparative Example 2 in which only (A-2) agglomerated silver powder was used as component (A), each component separated when component (A-2) was mixed with components (B) and (E). A homogeneous mixture was not obtained.
- Comparative Example 3 in which the component (A-1) and the single-particulate silver powder (A') were used in combination, the thermal conductivity of the cured product was greatly reduced.
- the thermally conductive polysiloxane composition of the present invention can be used as a heat-dissipating material for various devices having heat-generating sites, such as electronic devices such as personal computers.
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Abstract
Description
本発明の要旨は以下の通りである。
[2](A-1)成分/(A-2)成分の質量比が0.3~1.0である、[1]に記載の熱伝導性ポリシロキサン組成物。
[3]さらに、(E)分子中に1個以上のジアルコキシシリル基又はトリアルコキシシリル基を含む化合物を含有する、[1]又は[2]に記載の熱伝導性ポリシロキサン組成物。
[4](E)成分が、下記一般式(1)で示される化合物である、[3]に記載の熱伝導性ポリシロキサン組成物。
(式中、
R1を含む単位、R2を含む単位、SiR3 2Oで表される単位は、一般式(1)で示されるとおりに配列している必要はなく、その配列の順番は任意であり、
R1:炭素数1~4のアルコキシシリル基を有する基、
R2:下記一般式(2):
(式中、R4は、それぞれ独立して炭素数1~12の1価の炭化水素基であり、Yは、R1、R4及び脂肪族不飽和基からなる群より選択される基であり、dは2~500の整数である)で示されるシロキサン単位を有する基又は炭素数6~18の1価の炭化水素基、
X:それぞれ独立して炭素数2~10の2価の炭化水素基、
a及びb:それぞれ独立して1以上の整数、
c:0以上の整数、
a+b+c:4以上の整数、
R3:それぞれ独立して、炭素数1~6の1価の炭化水素基又は水素原子
である。)
[5][1]~[4]のいずれか一つに記載の熱伝導性ポリシロキサン組成物の硬化物を含む放熱材料。
(A)成分は、銀粉末であり、ポリシロキサン組成物に熱伝導性を付与する成分である。(A)成分として、(A-1)タップ密度が3.0~10.0g/cm3であり、平均粒径が1~20μmであるフレーク状銀粉末、及び(A-2)タップ密度が1.0~5.0g/cm3であり、平均粒径が1~10μmである凝集状銀粉末を併用することにより、(A)成分をポリシロキサン組成物中に高充填させても低粘度を維持し、高い熱伝導性を得ることができる。
(A-1)成分は、タップ密度が3.0~10.0g/cm3であり、平均粒径が1~20μmであるフレーク状銀粉末である。(A-1)成分の銀粉末は、熱伝導率を優位に向上させることができる。本発明において、フレーク状銀粉末とは、略平坦な面(X-Y平面)を有し、かつ、厚さ(Z)が略均一である銀粉末を指す。
(A-2)成分は、タップ密度が1.0~5.0g/cm3であり、平均粒径が1~10μmである凝集状銀粉末である。本発明において、凝集状銀粉末とは、一次粒径が0.1~5.0μmの一次粒子が2個以上凝集して形成された銀粒子を指す。一次粒径は、0.2~2.0μmの範囲であることが好ましく、0.5~1.0μmの範囲であることがより好ましい。凝集状銀粉末中の一次粒子の数は、5個以上であることが好ましく、より好ましくは10個以上である。一次粒子の数の上限は、特に限定されないが、例えば、1000個以下である。
凝集状銀粉末は、一次粒径が0.1~5.0μmの範囲外の一次粒子が凝集していてもよい。凝集状銀粉末を構成する全一次粒子の個数に対する、一次粒径が0.1~5.0μmである一次粒子の個数は、50%以上であることが好ましく、70%以上であることがより好ましく、80%以上であることがさらに好ましい。なお、凝集状銀粉末を構成する全一次粒子の個数に対する、一次粒径が0.1~5.0μmである一次粒子の個数の上限は100%である。
本発明において、凝集状銀粉末を形成する一次粒子の粒径は、凝集状銀粉末について走査型電子顕微鏡(SEM)を用いて観察し、観察された一次粒子の円相当径により求めることができる。
熱伝導性ポリシロキサン組成物100質量%中の(A-1)成分及び(A-2)成分の含有割合は、70~98質量%である。(A-1)成分及び(A-2)成分の含有割合を上記範囲とすることで、熱伝導性に優れた熱伝導性ポリシロキサン組成物とすることができる。熱伝導性ポリシロキサン組成物100質量%中の(A-1)成分及び(A-2)成分の含有割合は、80~98質量%であることが好ましく、85~97質量%であることがより好ましい。
(B)分子中に1個以上の脂肪族不飽和基を含有するポリオルガノシロキサンは、組成物において、ベースポリマーとなる成分である。(B)成分は、ケイ素原子に結合した脂肪族不飽和基を一分子中に1個以上有し、(C)成分のヒドロシリル基(Si-H基)と付加反応することができるものであれば、特に限定されない。(B)成分の分子中に1個以上の脂肪族不飽和基を含有するポリオルガノシロキサンとしては、下記平均組成式(I)で表されるものを使用することができる。
R41 jR42 kSiO[4-(j+k)]/2 (I)
(式中、R41は、脂肪族不飽和基であり、R42は、脂肪族不飽和結合を含まない置換又は非置換の1価炭化水素基である。j及びkは、0<j<3、0<k<3、及び1<j+k<3を満足する正数である。)
(B)成分の23℃における粘度は、10~100,000mPa・sであることが好ましい。より好ましくは20~10,000mPa・sである。
(C)分子中にケイ素原子に結合した水素原子を2個以上有するポリオルガノハイドロジェンシロキサンは、(B)成分の架橋剤となる成分である。(C)成分は、1分子中にケイ素原子に結合した水素原子を2個以上、好ましくは3個以上有するものである。この水素原子は、分子鎖末端のケイ素原子に結合していても、分子鎖途中のケイ素原子に結合していても、両方に結合していてもよい。また、両末端のケイ素原子にのみ結合した水素原子を有するポリオルガノハイドロジェンシロキサンを使用することもできる。(C)成分の分子構造は、直鎖状、分岐鎖状、環状あるいは三次元網目状のいずれでもよく、単独でも、二種以上を併用してもよい。
R51 mHnSiO[4-(m+n)]/2 (II)
(式中、R51は、脂肪族不飽和結合を含まない置換又は非置換の1価炭化水素基である。m及びnは、0.5≦m≦2、0<n≦2、及び0.5<m+n≦3を満足する数である。)
(D)白金系触媒は、(B)成分と(C)成分との混合後、硬化を促進させる成分である。(D)成分としては、ヒドロシリル化反応に用いられる周知の触媒を用いることができる。例えば、白金黒、塩化第二白金、塩化白金酸、塩化白金酸と一価アルコールとの反応物、塩化白金酸とオレフィン類又はビニルシロキサンとの錯体、白金-ビニルテトラマー錯体、白金ビスアセトアセテート等を挙げることができる。(D)成分の配合量は、所望の硬化速度等に応じて適宜調整することができるものであり、(B)成分と(C)成分との合計量に対し、白金元素に換算して0.1~1,000ppmの範囲とすることが好ましい。(D)成分は、単独でも、二種以上を併用してもよい。
熱伝導性ポリシロキサン組成物の粘度をさらに低下させ、作業性を向上させる観点から、熱伝導性ポリシロキサン組成物は、(E)分子中に1個以上のジアルコキシシリル基又はトリアルコキシシリル基を含む化合物を含有することが好ましい。(E)成分としては、1分子中に少なくとも次の一般式:
-SiR11 3-z(OR12)z (III)
(式中、R11は炭素数1~6のアルキル基、好ましくはメチル基であり、R12は炭素数1~6のアルキル基、好ましくはメチル基であり、zは2又は3である)で表されるアルコキシシリル基を有する化合物が好ましく、下記一般式(1)で示される化合物であることが特に好ましい。
(式中、
R1:炭素数1~4のアルコキシシリル基を有する基、
R2:下記一般式(2):
(式中、R4は、それぞれ独立して炭素数1~12の1価の炭化水素基であり、Yは、R1、R4及び脂肪族不飽和基からなる群より選択される基であり、dは2~500の整数、好ましくは4~400の整数、より好ましくは10~200の整数、特に好ましくは10~60の整数である)で示されるシロキサン単位を有する基又は炭素数6~18の1価の炭化水素基、
X:それぞれ独立して炭素数2~10の2価の炭化水素基、
a及びb:それぞれ独立して1以上の整数、
c:0以上の整数、
a+b+c:4以上の整数、
R3:それぞれ独立して、炭素数1~6の1価の炭化水素基又は水素原子
である。)
熱伝導性ポリシロキサン組成物は、更に必要に応じて、難燃性付与剤、耐熱性向上剤、可塑剤、着色剤、接着性付与材、希釈剤、有機又は無機の熱伝導性を有さない顔料、(A)成分以外の熱伝導性充填剤;(B)、(C)及び(E)成分以外のポリオルガノシロキサン;(D)成分以外の触媒等を本発明の目的を損なわない範囲で含有することができる。
熱伝導性ポリシロキサン組成物は、(A)~(D)成分、更に必要に応じて(E)及びその他の成分をプラネタリー型ミキサー等の混合機で混合することにより得ることができる。混合時には、必要に応じて50~150℃の範囲で加熱しながら混合してもよい。更に均一仕上げのためには、高剪断力下で混練操作を行うことが好ましい。混練装置としては、3本ロール、コロイドミル、サンドグラインダー等があるが、中でも3本ロールによる方法が好ましい。
熱伝導性ポリシロキサン組成物を硬化させる方法としては、例えば、放熱を要する被着体に該組成物を塗布後、該組成物を室温で放置する方法、50~200℃の温度で加熱する方法等が挙げられる。迅速に硬化させる観点から、加熱する方法を採ることが好ましい。
熱伝導性ポリシロキサン組成物の硬化物を含む放熱材料は、熱線法で測定した23℃における熱伝導率が2.0W/(m・K)以上のものである。熱伝導率は、8W/(m・K)以上であることが好ましく、より好ましくは10W/(m・K)以上ある。前記熱伝導率を調整して放熱効果を高めるためには、組成物中の(A)成分の含有割合が70質量%以上であることが好ましく、より好ましくは80質量%以上、さらに好ましくは85質量%以上であり、要求される熱伝導率に応じて(A)成分の含有割合を増加させることができる。
(A)成分
(A-1)成分:フレーク状銀粉末
福田金属箔粉工業株式会社製、シルコート(登録商標)AgC-2190H(タップ密度:4.35g/cm3、見かけ密度:2.64g/cm3、レーザー回折・散乱法により測定したメジアン径(d50):6.8μm、BET比表面積:0.36m2/g、アスペクト比:12)
(A-2)成分:凝集状銀粉末
福田金属箔粉工業株式会社製、シルコート(登録商標)AgC-74SE(タップ密度:1.89g/cm3、見かけ密度:1.02g/cm3、空気透過法により測定したメジアン径(d50):4.6μm、BET比表面積:0.19m2/g)
(A’)成分:単一粒子状銀粉末
福田金属箔粉工業株式会社製、シルコート(登録商標)AgC-161(タップ密度:3.33g/cm3、見かけ密度:1.64g/cm3、レーザー回折・散乱法により測定したメジアン径(d50):4,6μm、BET比表面積:0.79m2/g)
両末端ビニル基ジメチルポリシロキサン(粘度:3Pa・s、ビニル基濃度:0.08mmol/g)
ポリメチルハイドロジェンシロキサン:MD20DH 20M(粘度:0.03Pa・s、H濃度:7.3mmol/g)
白金系触媒:白金量1.8質量%、白金-ビニルシロキサン錯体
反応抑制剤:マレイン酸ジアリル
[粘度]
JIS K6249に準拠。23℃における組成物の粘度を、回転粘度計ローターNo.7、回転数20rpm、1分値として測定した。
23℃において、Hot disk法に従い、ホットディスク法 熱物性測定装置(京都電子工業社製、TPS 1500)を用いて測定した。
表1に示す(A)、(B)及び(E)成分をそれぞれプラスチック容器に仕込み、自転公転ミキサーで室温にて5分間撹拌混合して混合物を得た。その後、前記混合物にそれぞれ(C)、(D)及び(D-2)成分を添加・混合して、実施例1~2及び比較例1~3の熱伝導性ポリシロキサン組成物を得た。こうして得た組成物の粘度を測定した。結果を表1に示す。
Claims (5)
- (A)銀粉末、(B)分子中に1個以上の脂肪族不飽和基を含有するポリオルガノシロキサン、(C)分子中にケイ素原子に結合した水素原子を2個以上有するポリオルガノハイドロジェンシロキサン及び(D)白金系触媒を含有する熱伝導性ポリシロキサン組成物であって、
(A)成分が、(A-1)タップ密度が3.0~10.0g/cm3であり、平均粒径が1~20μmであるフレーク状銀粉末、及び(A-2)タップ密度が1.0~5.0g/cm3であり、平均粒径が1~10μmである凝集状銀粉末を含み、
熱伝導性ポリシロキサン組成物100質量%中の(A-1)成分及び(A-2)成分の含有割合が70~98質量%である、熱伝導性ポリシロキサン組成物。 - (A-1)成分/(A-2)成分の質量比が0.3~1.0である、請求項1に記載の熱伝導性ポリシロキサン組成物。
- さらに、(E)分子中に1個以上のジアルコキシシリル基又はトリアルコキシシリル基を含む化合物を含有する、請求項1又は2に記載の熱伝導性ポリシロキサン組成物。
- (E)成分が、下記一般式(1)で示される化合物である、請求項3に記載の熱伝導性ポリシロキサン組成物。
(式中、
R1を含む単位、R2を含む単位、SiR3 2Oで表される単位は、一般式(1)で示されるとおりに配列している必要はなく、その配列の順番は任意であり、
R1:炭素数1~4のアルコキシシリル基を有する基、
R2:下記一般式(2):
(式中、R4は、それぞれ独立して炭素数1~12の1価の炭化水素基であり、Yは、R1、R4及び脂肪族不飽和基からなる群より選択される基であり、dは2~500の整数である)で示されるシロキサン単位を有する基又は炭素数6~18の1価の炭化水素基、
X:それぞれ独立して炭素数2~10の2価の炭化水素基、
a及びb:それぞれ独立して1以上の整数、
c:0以上の整数、
a+b+c:4以上の整数、
R3:それぞれ独立して、炭素数1~6の1価の炭化水素基又は水素原子
である。) - 請求項1又は2に記載の熱伝導性ポリシロキサン組成物の硬化物を含む放熱材料。
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JPH08208993A (ja) * | 1995-11-27 | 1996-08-13 | Toshiba Silicone Co Ltd | 熱伝導性シリコーン組成物 |
JP2002003831A (ja) | 2000-06-26 | 2002-01-09 | Shin Etsu Chem Co Ltd | 放熱用部材 |
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