JP7071279B2 - 接着剤組成物、封止シート、及び封止体 - Google Patents
接着剤組成物、封止シート、及び封止体 Download PDFInfo
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- JP7071279B2 JP7071279B2 JP2018551660A JP2018551660A JP7071279B2 JP 7071279 B2 JP7071279 B2 JP 7071279B2 JP 2018551660 A JP2018551660 A JP 2018551660A JP 2018551660 A JP2018551660 A JP 2018551660A JP 7071279 B2 JP7071279 B2 JP 7071279B2
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- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- WBTPGJPZNDJHFG-UHFFFAOYSA-N triethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCCCCCOCC1CO1 WBTPGJPZNDJHFG-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- MDCWDBMBZLORER-UHFFFAOYSA-N triphenyl borate Chemical compound C=1C=CC=CC=1OB(OC=1C=CC=CC=1)OC1=CC=CC=C1 MDCWDBMBZLORER-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016225402 | 2016-11-18 | ||
| JP2016225402 | 2016-11-18 | ||
| PCT/JP2017/041074 WO2018092800A1 (ja) | 2016-11-18 | 2017-11-15 | 接着剤組成物、封止シート、及び封止体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2018092800A1 JPWO2018092800A1 (ja) | 2019-10-17 |
| JP7071279B2 true JP7071279B2 (ja) | 2022-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2018551660A Active JP7071279B2 (ja) | 2016-11-18 | 2017-11-15 | 接着剤組成物、封止シート、及び封止体 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7071279B2 (zh) |
| KR (1) | KR102380827B1 (zh) |
| CN (1) | CN109890926B (zh) |
| TW (1) | TWI781964B (zh) |
| WO (1) | WO2018092800A1 (zh) |
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| TWI757498B (zh) * | 2017-05-31 | 2022-03-11 | 日商琳得科股份有限公司 | 黏著薄片及密封體 |
| JP7138406B2 (ja) * | 2017-05-31 | 2022-09-16 | リンテック株式会社 | 接着剤組成物、接着シート、及び封止体 |
| TWI827620B (zh) * | 2018-06-15 | 2024-01-01 | 日商琳得科股份有限公司 | 樹脂組合物、密封片及密封體 |
| WO2020261682A1 (ja) * | 2019-06-28 | 2020-12-30 | 綜研化学株式会社 | 封止用樹脂組成物、封止シートおよび有機ｅｌ素子封止構造体 |
| JPWO2023008350A1 (zh) * | 2021-07-26 | 2023-02-02 |
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| JP2000007861A (ja) | 1998-06-23 | 2000-01-11 | Sekisui Chem Co Ltd | 硬化性樹脂組成物 |
| JP2002037963A (ja) | 2000-07-25 | 2002-02-06 | Mitsui Chemicals Inc | ゴム組成物 |
| WO2004024843A1 (ja) | 2002-08-30 | 2004-03-25 | Asahi Glass Company, Limited | 接着剤組成物および熱可塑性エラストマ製モールディング付きガラス板 |
| JP2008163344A (ja) | 2008-01-22 | 2008-07-17 | Nitto Denko Corp | 電子部品固定用反応性接着剤組成物及びその接着シート |
| WO2011062167A1 (ja) | 2009-11-18 | 2011-05-26 | 味の素株式会社 | 樹脂組成物 |
| JP2015059198A (ja) | 2013-09-20 | 2015-03-30 | Dic株式会社 | ラミネート積層体用接着剤組成物、これを使用した積層体、および二次電池 |
| JP2016040369A (ja) | 2014-08-12 | 2016-03-24 | ユニチカ株式会社 | ポリオレフィン樹脂水性分散体、およびそれを用いた接着剤、太陽電池バックシート、太陽電池モジュール |
| WO2016042837A1 (ja) | 2014-09-17 | 2016-03-24 | Dic株式会社 | ラミネート用接着剤、それを用いた積層体、及び二次電池 |
| WO2017094591A1 (ja) | 2015-12-01 | 2017-06-08 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
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| KR100734496B1 (ko) * | 2000-07-25 | 2007-07-03 | 미쓰이 가가쿠 가부시키가이샤 | 경화성 조성물 및 그 용도 |
| JPWO2015068805A1 (ja) * | 2013-11-08 | 2017-03-09 | 日本化薬株式会社 | 封止用樹脂組成物 |
| JP2015137333A (ja) | 2014-01-23 | 2015-07-30 | 三井化学株式会社 | シート状封止材、及びこれを含む封止用シート |
| JP5700166B1 (ja) * | 2014-08-01 | 2015-04-15 | 東洋インキＳｃホールディングス株式会社 | 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス |
| JP6718148B2 (ja) * | 2014-09-24 | 2020-07-08 | 東亞合成株式会社 | 接着剤組成物及びこれを用いた接着剤層付き積層体 |
| TWI729034B (zh) * | 2015-12-01 | 2021-06-01 | 日商琳得科股份有限公司 | 接著劑組成物、封密用板片以及封密體 |
| WO2018047919A1 (ja) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
| KR102272537B1 (ko) * | 2016-09-07 | 2021-07-02 | 린텍 가부시키가이샤 | 접착제 조성물, 봉지 시트, 및 봉지체 |
| CN109790427B (zh) * | 2016-09-07 | 2021-08-20 | 琳得科株式会社 | 粘接剂组合物、密封片、以及密封体 |
-
2017
- 2017-11-15 KR KR1020197012919A patent/KR102380827B1/ko active IP Right Grant
- 2017-11-15 WO PCT/JP2017/041074 patent/WO2018092800A1/ja active Application Filing
- 2017-11-15 CN CN201780068688.9A patent/CN109890926B/zh active Active
- 2017-11-15 JP JP2018551660A patent/JP7071279B2/ja active Active
- 2017-11-16 TW TW106139671A patent/TWI781964B/zh active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000007861A (ja) | 1998-06-23 | 2000-01-11 | Sekisui Chem Co Ltd | 硬化性樹脂組成物 |
| JP2002037963A (ja) | 2000-07-25 | 2002-02-06 | Mitsui Chemicals Inc | ゴム組成物 |
| WO2004024843A1 (ja) | 2002-08-30 | 2004-03-25 | Asahi Glass Company, Limited | 接着剤組成物および熱可塑性エラストマ製モールディング付きガラス板 |
| JP2008163344A (ja) | 2008-01-22 | 2008-07-17 | Nitto Denko Corp | 電子部品固定用反応性接着剤組成物及びその接着シート |
| WO2011062167A1 (ja) | 2009-11-18 | 2011-05-26 | 味の素株式会社 | 樹脂組成物 |
| JP2015059198A (ja) | 2013-09-20 | 2015-03-30 | Dic株式会社 | ラミネート積層体用接着剤組成物、これを使用した積層体、および二次電池 |
| JP2016040369A (ja) | 2014-08-12 | 2016-03-24 | ユニチカ株式会社 | ポリオレフィン樹脂水性分散体、およびそれを用いた接着剤、太陽電池バックシート、太陽電池モジュール |
| WO2016042837A1 (ja) | 2014-09-17 | 2016-03-24 | Dic株式会社 | ラミネート用接着剤、それを用いた積層体、及び二次電池 |
| WO2017094591A1 (ja) | 2015-12-01 | 2017-06-08 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI781964B (zh) | 2022-11-01 |
| TW201831634A (zh) | 2018-09-01 |
| WO2018092800A1 (ja) | 2018-05-24 |
| CN109890926A (zh) | 2019-06-14 |
| JPWO2018092800A1 (ja) | 2019-10-17 |
| KR20190084962A (ko) | 2019-07-17 |
| KR102380827B1 (ko) | 2022-03-30 |
| CN109890926B (zh) | 2021-12-28 |
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