JP7012454B2 - 静電吸着チャックの製造方法並びに半導体装置の製造方法 - Google Patents

静電吸着チャックの製造方法並びに半導体装置の製造方法 Download PDF

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Publication number
JP7012454B2
JP7012454B2 JP2017088042A JP2017088042A JP7012454B2 JP 7012454 B2 JP7012454 B2 JP 7012454B2 JP 2017088042 A JP2017088042 A JP 2017088042A JP 2017088042 A JP2017088042 A JP 2017088042A JP 7012454 B2 JP7012454 B2 JP 7012454B2
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Prior art keywords
semiconductor wafer
electrostatic
grinding
manufacturing
electrostatic adsorption
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JP2017088042A
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Japanese (ja)
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JP2018186217A5 (enExample
JP2018186217A (ja
Inventor
栄一 山本
欣浩 寺久保
貴彦 三井
利洋 伊東
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Okamoto Machine Tool Works Ltd
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Okamoto Machine Tool Works Ltd
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Publication date
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Priority to JP2017088042A priority Critical patent/JP7012454B2/ja
Priority to US15/960,790 priority patent/US10964576B2/en
Priority to KR1020180047846A priority patent/KR102541126B1/ko
Priority to CN201810385554.6A priority patent/CN108807257B/zh
Priority to TW107114251A priority patent/TWI788347B/zh
Publication of JP2018186217A publication Critical patent/JP2018186217A/ja
Publication of JP2018186217A5 publication Critical patent/JP2018186217A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)
JP2017088042A 2017-04-27 2017-04-27 静電吸着チャックの製造方法並びに半導体装置の製造方法 Active JP7012454B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017088042A JP7012454B2 (ja) 2017-04-27 2017-04-27 静電吸着チャックの製造方法並びに半導体装置の製造方法
US15/960,790 US10964576B2 (en) 2017-04-27 2018-04-24 Electrostatic attachment chuck, method for manufacturing the same, and semiconductor device manufacturing method
KR1020180047846A KR102541126B1 (ko) 2017-04-27 2018-04-25 정전 흡착 척, 그 제조 방법 및 반도체 장치의 제조 방법
CN201810385554.6A CN108807257B (zh) 2017-04-27 2018-04-26 静电吸附夹盘及其制造方法、以及半导体装置的制造方法
TW107114251A TWI788347B (zh) 2017-04-27 2018-04-26 靜電吸附夾盤的製造方法、以及半導體裝置的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017088042A JP7012454B2 (ja) 2017-04-27 2017-04-27 静電吸着チャックの製造方法並びに半導体装置の製造方法

Publications (3)

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JP2018186217A JP2018186217A (ja) 2018-11-22
JP2018186217A5 JP2018186217A5 (enExample) 2020-05-28
JP7012454B2 true JP7012454B2 (ja) 2022-01-28

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Country Status (5)

Country Link
US (1) US10964576B2 (enExample)
JP (1) JP7012454B2 (enExample)
KR (1) KR102541126B1 (enExample)
CN (1) CN108807257B (enExample)
TW (1) TWI788347B (enExample)

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* Cited by examiner, † Cited by third party
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WO2018183309A1 (en) * 2017-03-28 2018-10-04 Sri International Production of very small or thin dies
JP7115850B2 (ja) * 2017-12-28 2022-08-09 株式会社ディスコ 被加工物の加工方法および加工装置
JP7224138B2 (ja) * 2018-10-23 2023-02-17 株式会社ダイセル 半導体装置製造方法
JP7201386B2 (ja) 2018-10-23 2023-01-10 株式会社ダイセル 半導体装置製造方法
JP7350006B2 (ja) * 2018-10-23 2023-09-25 株式会社ダイセル 半導体装置製造方法
JP7270373B2 (ja) * 2018-12-20 2023-05-10 株式会社岡本工作機械製作所 樹脂を含む複合基板の研削方法及び研削装置
CN114026672B (zh) * 2019-06-13 2025-03-11 住友电气工业株式会社 碳化硅衬底和碳化硅衬底的制造方法
JP7292163B2 (ja) * 2019-09-19 2023-06-16 株式会社ディスコ 被加工物の加工方法
CN111421487A (zh) * 2020-05-26 2020-07-17 苏州京浜光电科技股份有限公司 一种超薄树脂片镀膜专用夹具

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JP2015090945A (ja) 2013-11-07 2015-05-11 株式会社岡本工作機械製作所 再生半導体ウエハの製造方法
JP2016051836A (ja) 2014-09-01 2016-04-11 株式会社ディスコ 静電支持プレート及び静電支持プレートの製造方法
JP2016183067A (ja) 2015-03-26 2016-10-20 日本碍子株式会社 アルミナ焼結体の製法及びアルミナ焼結体
JP2017030071A (ja) 2015-07-30 2017-02-09 株式会社ディスコ 研削装置
WO2017057273A1 (ja) 2015-09-30 2017-04-06 日本碍子株式会社 静電チャック

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Also Published As

Publication number Publication date
US20180315635A1 (en) 2018-11-01
CN108807257A (zh) 2018-11-13
TWI788347B (zh) 2023-01-01
KR102541126B1 (ko) 2023-06-07
JP2018186217A (ja) 2018-11-22
TW201839900A (zh) 2018-11-01
KR20180120601A (ko) 2018-11-06
CN108807257B (zh) 2022-10-28
US10964576B2 (en) 2021-03-30

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