JP6983602B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP6983602B2
JP6983602B2 JP2017185312A JP2017185312A JP6983602B2 JP 6983602 B2 JP6983602 B2 JP 6983602B2 JP 2017185312 A JP2017185312 A JP 2017185312A JP 2017185312 A JP2017185312 A JP 2017185312A JP 6983602 B2 JP6983602 B2 JP 6983602B2
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JP
Japan
Prior art keywords
cup body
substrate
treatment liquid
liquid
rotating
Prior art date
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Active
Application number
JP2017185312A
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English (en)
Japanese (ja)
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JP2019062075A5 (https=
JP2019062075A (ja
Inventor
正明 古矢
克弘 山崎
秀樹 森
航之介 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2017185312A priority Critical patent/JP6983602B2/ja
Priority to TW107131482A priority patent/TWI687266B/zh
Priority to KR1020180113166A priority patent/KR102221337B1/ko
Priority to CN201811120882.XA priority patent/CN109560018B/zh
Publication of JP2019062075A publication Critical patent/JP2019062075A/ja
Publication of JP2019062075A5 publication Critical patent/JP2019062075A5/ja
Application granted granted Critical
Publication of JP6983602B2 publication Critical patent/JP6983602B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017185312A 2017-09-26 2017-09-26 基板処理装置及び基板処理方法 Active JP6983602B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017185312A JP6983602B2 (ja) 2017-09-26 2017-09-26 基板処理装置及び基板処理方法
TW107131482A TWI687266B (zh) 2017-09-26 2018-09-07 基板處理裝置及基板處理方法
KR1020180113166A KR102221337B1 (ko) 2017-09-26 2018-09-20 기판 처리 장치 및 기판 처리 방법
CN201811120882.XA CN109560018B (zh) 2017-09-26 2018-09-26 基板处理装置和基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017185312A JP6983602B2 (ja) 2017-09-26 2017-09-26 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2019062075A JP2019062075A (ja) 2019-04-18
JP2019062075A5 JP2019062075A5 (https=) 2020-12-17
JP6983602B2 true JP6983602B2 (ja) 2021-12-17

Family

ID=65864708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017185312A Active JP6983602B2 (ja) 2017-09-26 2017-09-26 基板処理装置及び基板処理方法

Country Status (4)

Country Link
JP (1) JP6983602B2 (https=)
KR (1) KR102221337B1 (https=)
CN (1) CN109560018B (https=)
TW (1) TWI687266B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102271566B1 (ko) * 2019-10-28 2021-07-01 세메스 주식회사 기판 처리 장치
JP7364460B2 (ja) * 2019-12-25 2023-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI711491B (zh) * 2020-01-03 2020-12-01 弘塑科技股份有限公司 基板濕處理設備及回收環
TWI755122B (zh) * 2020-10-28 2022-02-11 辛耘企業股份有限公司 晶圓蝕刻機

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533339Y2 (ja) 1991-06-28 1997-04-23 大日本スクリーン製造株式会社 基板の回転処理装置
JPH09115873A (ja) * 1995-10-20 1997-05-02 Mitsubishi Electric Corp 半導体の製造装置および半導体の製造方法
JP3691227B2 (ja) * 1996-10-07 2005-09-07 東京エレクトロン株式会社 液処理方法及びその装置
JP4571299B2 (ja) * 2000-11-29 2010-10-27 芝浦メカトロニクス株式会社 スピン処理装置及び飛散防止用カップ
JP2002329705A (ja) * 2001-04-26 2002-11-15 Shibaura Mechatronics Corp スピン処理装置
CN100466190C (zh) * 2004-03-12 2009-03-04 禧沛股份有限公司 基片处理装置
EP1879216B1 (en) * 2006-06-16 2009-02-25 Tokyo Electron Limited Liquid processing apparatus and method
JP4723001B2 (ja) * 2006-10-05 2011-07-13 東京エレクトロン株式会社 基板処理装置、基板処理方法、および排液カップの洗浄方法
JP2008153521A (ja) * 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd 回収カップ洗浄方法および基板処理装置
JP5084639B2 (ja) * 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
JP4949338B2 (ja) * 2008-08-06 2012-06-06 東京エレクトロン株式会社 液処理装置
KR101592058B1 (ko) * 2010-06-03 2016-02-05 도쿄엘렉트론가부시키가이샤 기판 액처리 장치
JP5844681B2 (ja) * 2011-07-06 2016-01-20 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP5387636B2 (ja) * 2011-08-31 2014-01-15 東京エレクトロン株式会社 液処理装置
JP6020271B2 (ja) * 2013-03-18 2016-11-02 東京エレクトロン株式会社 液処理装置
US20150262848A1 (en) * 2014-03-11 2015-09-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method for discharge of processing liquid from nozzle

Also Published As

Publication number Publication date
TWI687266B (zh) 2020-03-11
CN109560018B (zh) 2022-10-18
TW201929965A (zh) 2019-08-01
CN109560018A (zh) 2019-04-02
KR20190035549A (ko) 2019-04-03
KR102221337B1 (ko) 2021-03-02
JP2019062075A (ja) 2019-04-18

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