TWI687266B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI687266B
TWI687266B TW107131482A TW107131482A TWI687266B TW I687266 B TWI687266 B TW I687266B TW 107131482 A TW107131482 A TW 107131482A TW 107131482 A TW107131482 A TW 107131482A TW I687266 B TWI687266 B TW I687266B
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TW
Taiwan
Prior art keywords
substrate
cup
processing liquid
liquid
processing
Prior art date
Application number
TW107131482A
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English (en)
Chinese (zh)
Other versions
TW201929965A (zh
Inventor
古矢正明
山崎克弘
森秀樹
林航之介
Original Assignee
日商芝浦機械電子裝置股份有限公司
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Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW201929965A publication Critical patent/TW201929965A/zh
Application granted granted Critical
Publication of TWI687266B publication Critical patent/TWI687266B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW107131482A 2017-09-26 2018-09-07 基板處理裝置及基板處理方法 TWI687266B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-185312 2017-09-26
JP2017185312A JP6983602B2 (ja) 2017-09-26 2017-09-26 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201929965A TW201929965A (zh) 2019-08-01
TWI687266B true TWI687266B (zh) 2020-03-11

Family

ID=65864708

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107131482A TWI687266B (zh) 2017-09-26 2018-09-07 基板處理裝置及基板處理方法

Country Status (4)

Country Link
JP (1) JP6983602B2 (https=)
KR (1) KR102221337B1 (https=)
CN (1) CN109560018B (https=)
TW (1) TWI687266B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102271566B1 (ko) * 2019-10-28 2021-07-01 세메스 주식회사 기판 처리 장치
JP7364460B2 (ja) * 2019-12-25 2023-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI711491B (zh) * 2020-01-03 2020-12-01 弘塑科技股份有限公司 基板濕處理設備及回收環
TWI755122B (zh) * 2020-10-28 2022-02-11 辛耘企業股份有限公司 晶圓蝕刻機

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201506993A (zh) * 2013-03-18 2015-02-16 東京威力科創股份有限公司 液體處理裝置
TW201538231A (zh) * 2014-03-11 2015-10-16 斯克林集團公司 基板處理裝置及基板處理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533339Y2 (ja) 1991-06-28 1997-04-23 大日本スクリーン製造株式会社 基板の回転処理装置
JPH09115873A (ja) * 1995-10-20 1997-05-02 Mitsubishi Electric Corp 半導体の製造装置および半導体の製造方法
JP3691227B2 (ja) * 1996-10-07 2005-09-07 東京エレクトロン株式会社 液処理方法及びその装置
JP4571299B2 (ja) * 2000-11-29 2010-10-27 芝浦メカトロニクス株式会社 スピン処理装置及び飛散防止用カップ
JP2002329705A (ja) * 2001-04-26 2002-11-15 Shibaura Mechatronics Corp スピン処理装置
CN100466190C (zh) * 2004-03-12 2009-03-04 禧沛股份有限公司 基片处理装置
EP1879216B1 (en) * 2006-06-16 2009-02-25 Tokyo Electron Limited Liquid processing apparatus and method
JP4723001B2 (ja) * 2006-10-05 2011-07-13 東京エレクトロン株式会社 基板処理装置、基板処理方法、および排液カップの洗浄方法
JP2008153521A (ja) * 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd 回収カップ洗浄方法および基板処理装置
JP5084639B2 (ja) * 2008-06-30 2012-11-28 芝浦メカトロニクス株式会社 スピン処理装置
JP4949338B2 (ja) * 2008-08-06 2012-06-06 東京エレクトロン株式会社 液処理装置
KR101592058B1 (ko) * 2010-06-03 2016-02-05 도쿄엘렉트론가부시키가이샤 기판 액처리 장치
JP5844681B2 (ja) * 2011-07-06 2016-01-20 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP5387636B2 (ja) * 2011-08-31 2014-01-15 東京エレクトロン株式会社 液処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201506993A (zh) * 2013-03-18 2015-02-16 東京威力科創股份有限公司 液體處理裝置
TW201538231A (zh) * 2014-03-11 2015-10-16 斯克林集團公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
CN109560018B (zh) 2022-10-18
JP6983602B2 (ja) 2021-12-17
TW201929965A (zh) 2019-08-01
CN109560018A (zh) 2019-04-02
KR20190035549A (ko) 2019-04-03
KR102221337B1 (ko) 2021-03-02
JP2019062075A (ja) 2019-04-18

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