JP6950833B2 - 積層セラミック電子部品の外部電極形成用の導電性ペースト - Google Patents

積層セラミック電子部品の外部電極形成用の導電性ペースト Download PDF

Info

Publication number
JP6950833B2
JP6950833B2 JP2020538406A JP2020538406A JP6950833B2 JP 6950833 B2 JP6950833 B2 JP 6950833B2 JP 2020538406 A JP2020538406 A JP 2020538406A JP 2020538406 A JP2020538406 A JP 2020538406A JP 6950833 B2 JP6950833 B2 JP 6950833B2
Authority
JP
Japan
Prior art keywords
conductive paste
metal powder
sulfur
less
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020538406A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020040138A1 (ja
Inventor
聡一郎 江崎
聡一郎 江崎
隼人 立野
隼人 立野
信夫 西岡
信夫 西岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Publication of JPWO2020040138A1 publication Critical patent/JPWO2020040138A1/ja
Application granted granted Critical
Publication of JP6950833B2 publication Critical patent/JP6950833B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2020538406A 2018-08-23 2019-08-20 積層セラミック電子部品の外部電極形成用の導電性ペースト Active JP6950833B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018156627 2018-08-23
JP2018156627 2018-08-23
PCT/JP2019/032446 WO2020040138A1 (ja) 2018-08-23 2019-08-20 導電性ペースト

Publications (2)

Publication Number Publication Date
JPWO2020040138A1 JPWO2020040138A1 (ja) 2021-06-03
JP6950833B2 true JP6950833B2 (ja) 2021-10-13

Family

ID=69593293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020538406A Active JP6950833B2 (ja) 2018-08-23 2019-08-20 積層セラミック電子部品の外部電極形成用の導電性ペースト

Country Status (6)

Country Link
JP (1) JP6950833B2 (zh)
KR (1) KR102441705B1 (zh)
CN (1) CN112602158B (zh)
MY (1) MY193375A (zh)
TW (1) TWI772671B (zh)
WO (1) WO2020040138A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102545056B1 (ko) * 2021-07-13 2023-06-21 (주)창성 가지형 분말을 적용한 구리페이스트 조성물 및 이를 이용한 세라믹제품
JP7434407B2 (ja) * 2022-04-25 2024-02-20 株式会社ノリタケカンパニーリミテド 外部電極用ペースト
WO2024203522A1 (ja) * 2023-03-30 2024-10-03 株式会社村田製作所 積層セラミック電子部品

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308803A (ja) * 1987-01-09 1988-12-16 Hitachi Ltd 導電ペーストおよびそれを用いた電子回路部品並びにその製法
JPH05242725A (ja) * 1992-02-27 1993-09-21 Taiyo Yuden Co Ltd 導電性ペースト
JP3206496B2 (ja) * 1997-06-02 2001-09-10 昭栄化学工業株式会社 金属粉末及びその製造方法
JP4789392B2 (ja) * 2002-11-22 2011-10-12 京セラ株式会社 セラミック積層体の製法
JP4291857B2 (ja) * 2007-01-24 2009-07-08 三ツ星ベルト株式会社 銅導体ペースト、導体回路板及び電子部品
JP4807581B2 (ja) * 2007-03-12 2011-11-02 昭栄化学工業株式会社 ニッケル粉末、その製造方法、導体ペーストおよびそれを用いた積層セラミック電子部品
TWI421882B (zh) * 2009-06-08 2014-01-01 Daiken Chemical Co Ltd Barium titanate powder, nickel paste, preparation method and laminated ceramic capacitors
WO2013018408A1 (ja) * 2011-07-29 2013-02-07 株式会社ノリタケカンパニーリミテド 太陽電池用導電性ペースト組成物
JP2013072091A (ja) * 2011-09-26 2013-04-22 Hitachi Cable Ltd 金属微粒子およびその製造方法、金属微粒子を含む金属ペースト、並びに金属ペーストから形成される金属被膜
JP5958749B2 (ja) 2012-06-22 2016-08-02 株式会社村田製作所 金属粉末の製造方法
JP5937904B2 (ja) * 2012-06-26 2016-06-22 株式会社ノリタケカンパニーリミテド 太陽電池電極用ペースト組成物
JP6324253B2 (ja) 2014-07-30 2018-05-16 Jx金属株式会社 導電性ペースト及びその製造方法
JP2016115448A (ja) * 2014-12-11 2016-06-23 株式会社村田製作所 導電性ペーストおよびセラミック電子部品
EP3357878B1 (en) * 2015-10-01 2020-05-06 Shoei Chemical Inc. Conductive paste and terminal electrode forming method for laminated ceramic part
CN106024095B (zh) * 2016-05-25 2018-05-15 苏州晶银新材料股份有限公司 一种太阳能电池无氧玻璃导电浆料

Also Published As

Publication number Publication date
TWI772671B (zh) 2022-08-01
JPWO2020040138A1 (ja) 2021-06-03
KR20210048503A (ko) 2021-05-03
TW202020895A (zh) 2020-06-01
CN112602158A (zh) 2021-04-02
KR102441705B1 (ko) 2022-09-07
WO2020040138A1 (ja) 2020-02-27
CN112602158B (zh) 2023-11-28
MY193375A (en) 2022-10-07

Similar Documents

Publication Publication Date Title
JP4647224B2 (ja) 積層セラミック電子部品端子電極用導体ペースト
JP6950833B2 (ja) 積層セラミック電子部品の外部電極形成用の導電性ペースト
KR101172723B1 (ko) 동 도체 페이스트, 도체 회로판 및 전자부품
JP5488282B2 (ja) 導電性ペースト
CN109564793B (zh) 导电性糊剂
WO2014061765A1 (ja) 導電性ペースト
JP2006196421A (ja) 被覆導体粉末および導体ペースト
JP4456612B2 (ja) 銅導体ペースト、導体回路板及び電子部品
JP5641216B2 (ja) セラミック電子部品の製造方法、及びセラミック電子部品
JP6968524B2 (ja) 厚膜導電ペーストおよびセラミック多層積層電子部品の製造方法
JP3297531B2 (ja) 導電性ペースト
JP6737506B2 (ja) 導電性ペースト、チップ電子部品及びその製造方法
JP5556518B2 (ja) 導電性ペースト
JP6769208B2 (ja) 鉛フリー導電ペースト
JP4495740B2 (ja) 銅導体ペースト、導体回路板及び電子部品
JP2004228093A (ja) 多層セラミックキャパシタ用端子電極組成物
JP2015210902A (ja) 厚膜導体形成用組成物及びそれを用いて得られる厚膜導体
JP2009187695A (ja) ディスプレイ用導体ペースト組成物
JP2006066475A (ja) 厚膜抵抗体形成用組成物、厚膜抵抗体の形成方法及び厚膜抵抗体
JP4341428B2 (ja) 導電性ペーストおよびこれを用いたセラミック電子部品
JP2023161393A (ja) 外部電極用ペースト
JP2019110105A5 (zh)
JP2008053138A (ja) 厚膜導体形成用組成物、それを用いた厚膜導体の形成方法、および得られる厚膜導体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210201

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210201

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20210201

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20210329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210406

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210531

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210824

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210906

R150 Certificate of patent or registration of utility model

Ref document number: 6950833

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250