JP6883596B2 - 接合基板および接合基板の製造方法 - Google Patents
接合基板および接合基板の製造方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 233
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000010949 copper Substances 0.000 claims description 140
- 229910052802 copper Inorganic materials 0.000 claims description 125
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 120
- 239000000919 ceramic Substances 0.000 claims description 77
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 40
- 238000005219 brazing Methods 0.000 claims description 34
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 150000004767 nitrides Chemical class 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 claims description 12
- 238000005304 joining Methods 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 229910000905 alloy phase Inorganic materials 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 26
- 239000004065 semiconductor Substances 0.000 description 18
- 238000009826 distribution Methods 0.000 description 12
- 230000008646 thermal stress Effects 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 8
- 239000011800 void material Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000013507 mapping Methods 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004453 electron probe microanalysis Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910017945 Cu—Ti Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
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- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000003921 oil Substances 0.000 description 1
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- 238000012827 research and development Methods 0.000 description 1
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Description
また、本発明の第2の態様では、窒化物セラミックス基板の一方もしくは両方の主面に銅板が接合されてなる接合基板において、TiNを主成分としかつAg−Cu層を含まない接合層が前記窒化物セラミックス基板と前記銅板との間に介在するとともに少なくとも前記銅板と直接に接しており、前記銅板内に、Ag原子が拡散してなり、前記Ag原子の存在比率が15at%以下であるAg拡散領域が存在する、ようにした。
図1は、本発明の実施の形態に係る接合基板10(10A、10B)の断面構成を模式的に示す図である。接合基板10は、例えばスイッチング素子、IGBT、MOSFETなどの図示しないパワー半導体を含むパワー半導体モジュールにおいて、該パワー半導体が実装される基板である。
図2および図3は、本実施の形態に係る接合基板10(10A、10B)の接合層2と銅板3との界面領域における微細構造を模式的に示す断面図である。
上述のように、本実施の形態に係る接合基板10(10A、10B)は、セラミックス基板1と銅板3とをAg、Tiを含むろう材を用いて加熱加圧接合することによって得られる。加熱加圧接合については公知の技術を適用することが可能であるが、少なくともAg−Cu層6が形成されない接合条件(接合雰囲気、接合温度、接合圧力、ろう材の塗布量)にて接合を行う必要がある。加えて、接合層2と銅板3との界面I2がボイドレスな構造と接合条件にて接合を行うことが好ましい。
上述の実施の形態においてはセラミックス基板1の一方主面側に銅板3が接合されることで接合基板が構成されていたが、他方主面側にも上述の実施の形態と同様の態様にて銅板3が接合されることで接合基板が構成されてもよい。つまりはセラミックス基板1の両方の主面に銅板3が接合されることで接合基板が構成されてもよい。
実施例1〜実施例6として、セラミックス基板1の材質および厚みと銅板(Cu板)3の厚みとの組み合わせを種々に違えた6水準の接合基板10Aを、加熱加圧接合により作製した。
実施例1〜実施例12および比較例1〜比較例12に係る接合基板のそれぞれについて、冷熱サイクル試験を行った。それぞれの実施例及び比較例において、試験サンプル数は5とした。試験は、各サンプルに対し−55℃(15分)/150℃(15分)の冷熱サイクルを3000cyc(サイクル)与えることにより行い、途中100cyc毎に(つまりは全30回)、実体顕微鏡による外観確認と超音波探傷とによって、接合部の剥がれおよびセラミックス基板におけるクラックの有無(以下、これらをまとめて「破壊」と総称する)について確認した。
実施例1〜実施例12および比較例1〜比較例12に係る接合基板のそれぞれを対象に、熱抵抗測定を行った。評価用のサンプルとして、平面サイズが21mm×21mmのセラミックス基板の両面に平面サイズが20mm×20mmの銅板を各実施例もしくは比較例に係る条件で接合した接合基板を用意した。
実施例1〜実施例12に係る接合基板のそれぞれを対象に、絶縁耐圧(絶縁破壊電圧)の測定を行った。それぞれの実施例において、試験サンプル数は10とした。測定は、絶縁油中において接合基板の回路面である銅板の非接合面と、放熱面であるセラミックス基板の非接合面との間に、交流電圧を印加することにより行った。
Claims (4)
- 窒化物セラミックス基板の一方もしくは両方の主面に銅板が接合されてなる接合基板を製造する方法であって、
前記窒化物セラミックス基板の一方もしくは両方の主面に、AgとTiとを含むろう材を塗布する塗布工程と、
前記窒化物セラミックス基板の前記ろう材の被塗布面に対して前記銅板を重ね合わせた状態で、前記窒化物セラミックス基板と前記銅板とを真空もしくはAr雰囲気下で850℃〜1000℃の接合温度かつ5MPa〜25MPaの接合圧力で加熱加圧し、0.1μm〜5μmの範囲で場所により厚みが異なる接合層を形成する接合工程と、
を備えることを特徴とする、接合基板の製造方法。 - 窒化物セラミックス基板の一方もしくは両方の主面に銅板が接合されてなる接合基板であって、
TiNを主成分としかつAg−Cu層を含まない接合層が前記窒化物セラミックス基板と前記銅板との間に介在するとともに少なくとも前記銅板と直接に接しており、
前記銅板内に、Ag原子が拡散してなり、前記Ag原子の存在比率が15at%以下であるAg拡散領域が存在する、
ことを特徴とする接合基板。 - 請求項2に記載の接合基板であって、
前記接合層と前記銅板との界面に、Agの存在比率が60at%を超え100at%以下である、AgリッチなAg−Cu合金相またはAg金属相であるAgリッチ相が、離散的に存在する、
ことを特徴とする接合基板。 - 請求項2または請求項3に記載の接合基板であって、
前記Ag拡散領域が、前記銅板内において少なくとも前記接合層との界面近傍に存在する、
ことを特徴とする接合基板。
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