JP6880431B2 - 離間装置および離間方法 - Google Patents

離間装置および離間方法 Download PDF

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Publication number
JP6880431B2
JP6880431B2 JP2017078141A JP2017078141A JP6880431B2 JP 6880431 B2 JP6880431 B2 JP 6880431B2 JP 2017078141 A JP2017078141 A JP 2017078141A JP 2017078141 A JP2017078141 A JP 2017078141A JP 6880431 B2 JP6880431 B2 JP 6880431B2
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holding
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attaching
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JP2017078141A
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English (en)
Japanese (ja)
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JP2018182018A (ja
Inventor
芳昭 杉下
芳昭 杉下
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Lintec Corp
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Lintec Corp
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Priority to JP2017078141A priority Critical patent/JP6880431B2/ja
Priority to TW107106129A priority patent/TWI771376B/zh
Priority to CN201810193547.6A priority patent/CN108695196B/zh
Priority to KR1020180027911A priority patent/KR102457844B1/ko
Publication of JP2018182018A publication Critical patent/JP2018182018A/ja
Application granted granted Critical
Publication of JP6880431B2 publication Critical patent/JP6880431B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
JP2017078141A 2017-04-11 2017-04-11 離間装置および離間方法 Active JP6880431B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017078141A JP6880431B2 (ja) 2017-04-11 2017-04-11 離間装置および離間方法
TW107106129A TWI771376B (zh) 2017-04-11 2018-02-23 分離裝置及分離方法
CN201810193547.6A CN108695196B (zh) 2017-04-11 2018-03-09 分离装置及分离方法
KR1020180027911A KR102457844B1 (ko) 2017-04-11 2018-03-09 이간 장치 및 이간 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017078141A JP6880431B2 (ja) 2017-04-11 2017-04-11 離間装置および離間方法

Publications (2)

Publication Number Publication Date
JP2018182018A JP2018182018A (ja) 2018-11-15
JP6880431B2 true JP6880431B2 (ja) 2021-06-02

Family

ID=63844449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017078141A Active JP6880431B2 (ja) 2017-04-11 2017-04-11 離間装置および離間方法

Country Status (4)

Country Link
JP (1) JP6880431B2 (zh)
KR (1) KR102457844B1 (zh)
CN (1) CN108695196B (zh)
TW (1) TWI771376B (zh)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209829A (ja) * 2004-01-22 2005-08-04 Taiyo Yuden Co Ltd 半導体ウェハ固定方法及び装置、並びに半導体ウェハが固定された構造体
JP2006013000A (ja) * 2004-06-23 2006-01-12 Sekisui Chem Co Ltd Ｉｃチップの製造方法
JP2006054246A (ja) * 2004-08-10 2006-02-23 Disco Abrasive Syst Ltd ウエーハの分離方法
JP4772559B2 (ja) * 2006-03-31 2011-09-14 株式会社ディスコ チップ間隔維持方法及びチップ間隔維持装置
JP2008140874A (ja) 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2008192910A (ja) * 2007-02-06 2008-08-21 Joyo Kogaku Kk ダイシング用粘着シートおよびダイシング方法
CN101850538B (zh) * 2009-04-01 2012-10-10 日月光半导体制造股份有限公司 晶圆的支撑治具与研磨、输送及切割晶圆的方法
JP2011166002A (ja) * 2010-02-12 2011-08-25 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5961047B2 (ja) * 2012-06-22 2016-08-02 株式会社ディスコ ウエーハの加工方法
JP6045837B2 (ja) * 2012-07-26 2016-12-14 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JP5992277B2 (ja) * 2012-09-20 2016-09-14 株式会社ディスコ 加工方法
JP6132502B2 (ja) * 2012-09-27 2017-05-24 株式会社ディスコ ウェーハの加工方法
JP5991335B2 (ja) * 2013-03-07 2016-09-14 住友ベークライト株式会社 接着フィルム、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、バックグラインドテープ兼ダイシングシート一体型接着フィルム、積層体、積層体の硬化物、および半導体装置、並び半導体装置の製造方法
JP6096017B2 (ja) * 2013-03-19 2017-03-15 リンテック株式会社 シート貼付装置および貼付方法
JP2016092207A (ja) * 2014-11-05 2016-05-23 株式会社ディスコ フレームユニットの製造方法
JP6393596B2 (ja) * 2014-11-19 2018-09-19 リンテック株式会社 整列装置および整列方法
JP6408366B2 (ja) * 2014-12-05 2018-10-17 リンテック株式会社 離間装置および離間方法
JP6417236B2 (ja) * 2015-02-26 2018-10-31 株式会社ディスコ ウエーハの分割方法及びチャックテーブル
TWI603393B (zh) * 2015-05-26 2017-10-21 台虹科技股份有限公司 半導體裝置的製造方法
JP6559013B2 (ja) * 2015-08-20 2019-08-14 リンテック株式会社 シート貼付装置および貼付方法

Also Published As

Publication number Publication date
KR102457844B1 (ko) 2022-10-21
TW201838003A (zh) 2018-10-16
CN108695196B (zh) 2023-03-24
TWI771376B (zh) 2022-07-21
JP2018182018A (ja) 2018-11-15
KR20180114832A (ko) 2018-10-19
CN108695196A (zh) 2018-10-23

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