JP6096017B2 - シート貼付装置および貼付方法 - Google Patents
シート貼付装置および貼付方法 Download PDFInfo
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- JP6096017B2 JP6096017B2 JP2013056450A JP2013056450A JP6096017B2 JP 6096017 B2 JP6096017 B2 JP 6096017B2 JP 2013056450 A JP2013056450 A JP 2013056450A JP 2013056450 A JP2013056450 A JP 2013056450A JP 6096017 B2 JP6096017 B2 JP 6096017B2
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- adhesive sheet
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- 238000000034 method Methods 0.000 title claims description 9
- 239000000853 adhesive Substances 0.000 claims description 49
- 230000001070 adhesive effect Effects 0.000 claims description 49
- 238000003825 pressing Methods 0.000 claims description 21
- 239000010410 layer Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 230000006837 decompression Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Quality & Reliability (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
特許文献1に記載のシート貼付装置は、ウェハを支持するテーブルと、ウェハに帯状の接着シートを貼付する弾性部材と、接着シートを切断する切断手段とを備え、弾性変形させた弾性部材で被着体に接着シートを押圧して貼付し、当該接着シートを切断手段で被着体に沿って切断するように構成されている。
特許文献2に記載の保持装置は、基板と絶縁層とで挟まれた電極を備え、当該電極に電圧を印加することで絶縁層とウェハとの間に静電引力を発生させ、当該絶縁層でウェハを静電的に保持するように構成されている。
なお、本明細書におけるX軸、Y軸、Z軸は、それぞれが直交する関係にあり、X軸およびY軸は、水平面内の軸とし、Z軸は、水平面に直交する軸とする。さらに、本実施形態では、Y軸と平行な図1の手前方向から観た場合を基準とし、方向を示した場合、「上」がZ軸の矢印方向で「下」がその逆方向、「左」がX軸の矢印方向で「右」がその逆方向、「前」がY軸の紙面に直交する手前方向で「後」がその逆方向とする。
先ず、図1中二点鎖線で示すように、上ケース32が下ケース31の上方に離れた状態で、図示しない搬送手段がウェハWFをテーブル38上に載置すると、押圧手段3が図示しない支持手段を駆動し、テーブル38でウェハWFを支持する。また、図示しない供給手段が保持部材21の保持面21Aに接着シートASを供給すると、保持手段2が図示しない電圧印加装置を駆動し、電極22に所定の電圧を印加し、静電引力を発生させて接着シートASを保持面21Aで保持する。
また、電極22は、第1電極25および第2電極26を少なくとも1つずつ備えていればよい。
また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる(実施形態で例示したものと重複するものもある)。
2 保持手段
3 押圧手段
21 保持部材
22 電極
AS 接着シート
WF ウェハ(被着体)
Claims (2)
- 接着シートを保持する保持手段と、
前記接着シートを被着体に押圧して貼付する押圧手段とを備え、
前記保持手段は、弾性変形可能な保持部材と、前記保持部材内に当該保持部材とともに変形可能に設けられた電極とを備え、前記電極に電圧を印加することにより前記保持部材で前記接着シートを保持可能に設けられ、
前記押圧手段は、前記保持部材を弾性変形させるとともに前記保持部材内の電極を変形させ、前記接着シートを前記被着体に押圧可能に設けられていることを特徴とするシート貼付装置。 - 弾性変形可能な保持部材内に当該保持部材とともに変形可能に設けた電極に電圧を印加し、前記保持部材で接着シートを保持する工程と、
前記保持部材を弾性変形させるとともに前記保持部材内の電極を変形させ、前記接着シートを被着体に押圧して貼付する工程とを実施することを特徴とするシート貼付方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013056450A JP6096017B2 (ja) | 2013-03-19 | 2013-03-19 | シート貼付装置および貼付方法 |
TW102145771A TWI583555B (zh) | 2013-03-19 | 2013-12-12 | Sheet Adhesive Device and Paste Method |
CN201410057304.1A CN104064491B (zh) | 2013-03-19 | 2014-02-20 | 片材粘贴装置及粘贴方法 |
KR1020140030153A KR102124310B1 (ko) | 2013-03-19 | 2014-03-14 | 시트 부착 장치 및 부착 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013056450A JP6096017B2 (ja) | 2013-03-19 | 2013-03-19 | シート貼付装置および貼付方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014183169A JP2014183169A (ja) | 2014-09-29 |
JP6096017B2 true JP6096017B2 (ja) | 2017-03-15 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013056450A Active JP6096017B2 (ja) | 2013-03-19 | 2013-03-19 | シート貼付装置および貼付方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6096017B2 (ja) |
KR (1) | KR102124310B1 (ja) |
CN (1) | CN104064491B (ja) |
TW (1) | TWI583555B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101896384B1 (ko) * | 2016-10-04 | 2018-09-07 | 주식회사 대성엔지니어링 | 진공 라미네이터용 챔버장치 |
JP6880431B2 (ja) * | 2017-04-11 | 2021-06-02 | リンテック株式会社 | 離間装置および離間方法 |
KR101958827B1 (ko) * | 2018-09-16 | 2019-03-15 | 주식회사 지에스아이 | U 가이드를 갖는 비접촉식 필름부착장치 및 이를 이용한 필름부착방법 |
JP7132198B2 (ja) * | 2019-09-27 | 2022-09-06 | 芝浦メカトロニクス株式会社 | 成膜装置及び埋込処理装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4121216B2 (ja) * | 1999-05-20 | 2008-07-23 | 信越化学工業株式会社 | 弾性変形可能な静電チャック及びその製造方法 |
JP3599634B2 (ja) * | 2000-04-10 | 2004-12-08 | 信越化学工業株式会社 | イオン注入機用静電チャック |
KR100662497B1 (ko) * | 2002-11-18 | 2007-01-02 | 엘지.필립스 엘시디 주식회사 | 액정표시소자 제조 공정용 기판 합착 장치 |
JP4666519B2 (ja) * | 2006-09-08 | 2011-04-06 | リンテック株式会社 | シート貼付装置 |
JP4814284B2 (ja) * | 2008-06-12 | 2011-11-16 | 三菱電機株式会社 | テープ貼付装置 |
KR20100043478A (ko) * | 2008-10-20 | 2010-04-29 | 삼성전기주식회사 | 정전 척 및 이를 구비한 기판 접합 장치 |
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2013
- 2013-03-19 JP JP2013056450A patent/JP6096017B2/ja active Active
- 2013-12-12 TW TW102145771A patent/TWI583555B/zh active
-
2014
- 2014-02-20 CN CN201410057304.1A patent/CN104064491B/zh active Active
- 2014-03-14 KR KR1020140030153A patent/KR102124310B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN104064491B (zh) | 2018-02-13 |
KR20140114768A (ko) | 2014-09-29 |
TW201437028A (zh) | 2014-10-01 |
TWI583555B (zh) | 2017-05-21 |
CN104064491A (zh) | 2014-09-24 |
JP2014183169A (ja) | 2014-09-29 |
KR102124310B1 (ko) | 2020-06-18 |
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