CN104064491B - 片材粘贴装置及粘贴方法 - Google Patents

片材粘贴装置及粘贴方法 Download PDF

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CN104064491B
CN104064491B CN201410057304.1A CN201410057304A CN104064491B CN 104064491 B CN104064491 B CN 104064491B CN 201410057304 A CN201410057304 A CN 201410057304A CN 104064491 B CN104064491 B CN 104064491B
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中田干
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833Details of electrostatic chucks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/14Semiconductor wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes

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Abstract

一种片材粘贴装置及粘贴方法。本发明的片材粘贴装置(1)具有保持粘接片(AS)的保持单元(2)、将所述粘接片(AS)按压并粘贴到被粘接体(WF)上的按压单元(3),所述保持单元(2)具有可弹性变形的保持部件(21)、设于所述保持部件(21)内的电极(22),通过对所述电极(22)施加电压能够由所述保持部件(21)保持所述粘接片(AS),所述按压单元(3)使所述保持部件(21)弹性变形,能够由该保持部件(21)将所述粘接片(AS)按压到所述被粘接体(WF)上。

Description

片材粘贴装置及粘贴方法
技术领域
本发明涉及将粘接片粘贴到被粘接体上的片材粘贴装置以及粘贴方法。
背景技术
目前,在半导体制造工序中,公知有将粘接片粘贴到半导体晶片(以下,有时简称为晶片)的片材粘贴装置(例如,参照文献1:日本特开2008-66597号公报)、保持晶片的保持装置(例如,参照文献2:日本特开平05-013555号公报)。
文献1记载的片材粘贴装置构成为:具有支承晶片的工作台、在晶片上粘贴带状的粘接片的弹性部件、将粘接片切断的切断单元,由弹性变形了的弹性部件将粘接片按压并粘贴到被粘接体上,由切断单元将该粘接片沿被粘接体切断。
文献2记载的保持装置构成为:具有被基板和绝缘层夹持的电极,通过对该电极施加电压而在绝缘层与晶片之间产生静电引力,由该绝缘层静电地保持晶片。
在文献1记载的现有装置中,由于将切断产生的剩余片材废弃掉,将粘接片无效地浪费掉,故而期望由弹性部件保持与晶片相同形状的粘接片,由该弹性部件将粘接片粘贴到晶片上的片材粘贴装置。但是,若在文献1记载的片材粘贴装置上应用文献2记载的构成,在夹着弹性部件位于粘接片的保持面的相反侧配置有电极的情况下,具有距粘接片的距离变远,静电引力下降而不能够保持粘接片的不良情况。电极的静电引力(库仑力)与电极距粘接片的距离的平方成反比,该距离成为重要的因素。另一方面,在保持面设有电极的情况下,由于该电极直接与粘接片及晶片接触,故而产生电极破损,不能够保持粘接片的不良情况。
发明内容
本发明的目的在于提供一种能够防止由于静电引力下降或电极破损而不能保持粘接片的情况的片材粘贴装置以及粘贴方法。
本发明的片材粘贴装置具有:保持粘接片的保持单元;将所述粘接片按压并粘贴到被粘接体上的按压单元,所述保持单元具有可弹性变形的保持部件、设于所述保持部件内的电极,通过对所述电极施加电压而能够由所述保持部件保持所述粘接片,所述按压单元使所述保持部件弹性变形并能够由该保持部件将所述粘接片按压在所述被粘接体上。
本发明的片材粘贴方法实施如下的工序:对设于可弹性变形的保持部件内的电极施加电压,由所述保持部件保持粘接片;使所述保持部件弹性变形,由该保持部件将所述粘接片按压并粘贴到被粘接体上。
根据以上的本发明,由于电极设置在保持部件内,故而不仅能够适当地保持电极距粘接片的距离,而且由于该电极不直接接触粘接片及被粘接体,故而能够防止由于静电引力下降或电极破损而不能够保持粘接片的情况。
附图说明
图1是本发明一实施方式的片材粘贴装置的侧视图。
具体实施方式
以下,基于附图对本发明一实施方式进行说明。
另外,本说明书中的X轴、Y轴、Z轴为分别正交的关系,X轴及Y轴为水平面内的轴,Z轴为与水平面正交的轴。另外,在本实施方式中,在以从与Y轴平行的图1的跟前方向观察的情况为基准表示方向的情况下,“上”为Z轴的箭头方向,“下”为其反方向,“左”为X轴的箭头方向,“右”为其反方向,“前”为与Y轴的纸面正交的跟前方向,“后”为其反方向。
在图1中,片材粘贴装置1具有保持粘接片AS的保持单元2、将粘接片AS按压并粘贴到作为被粘接体的晶片WF的按压单元3。
保持单元2具有可弹性变形的保持部件21、设于保持部件21内的电极22。保持部件21将第一弹性部件23和第二弹性部件24层积而构成,所述第一弹性部件23形成为圆形形状并且由橡胶及树脂等弹性部件形成,所述第二弹性部件24形成为圆形形状并且由橡胶及树脂等弹性部件形成。电极22具备由具有导电性的弹性材料形成并且设于第一弹性部件23与第二弹性部件24之间的多个第一电极25以及多个第二电极26。第二弹性部件24以比第一弹性部件23低的硬度形成。第一电极25以及第二电极26在第一弹性部件23与第二弹性部件24之间交替地设置,以一方为正极、另一方为负极的方式与未图示的电压印加装置连接。
按压单元3包括:下壳体31,其形成为上表面31A开口的箱状;上壳体32,其形成为下表面32A开口的箱状,经由圆筒状的基台32C由上表面部32B支承保持部件21并且由未图示的驱动设备可升降地支承;减压泵及真空喷射器等第一减压单元33以及加压泵及涡轮等第一加压单元34,其经由配管30A与由上表面部32B、基台32C以及保持部件21形成的第一空间V1连接;减压泵及真空喷射器等第二减压单元35以及加压泵及涡轮等第二加压单元36,其经由配管30B与由上壳体32及下壳体31形成的第二空间V2连接;工作台38,其设于下壳体31的底面部31B,设有与设于保持部件21的构成类似的电极、机械卡盘、粘接单元等未图示的支承单元。
在以上的片材粘贴装置1中,对将粘接片AS粘接在晶片WF上的顺序进行说明。
首先,如图1中双点划线所示,若以上壳体32向下壳体31的上方离开的状态,未图示的搬运单元将晶片WF载置于工作台38上,则按压单元3驱动未图示的支承单元,由工作台38支承晶片WF。另外,若未图示的供给单元将粘接片AS向保持部件21的保持面21A供给,则保持单元2驱动未图示的电压印加装置,对电极22施加规定的电压,产生静电引力而由保持面21A保持粘接片AS。
接着,按压单元3驱动未图示的驱动设备,使上壳体32下降,如图1中实线所示地形成第二空间V2。接着,按压单元3驱动第一及第二减压单元33、35,以第一及第二空间V1、V2成为相同压力的方式一边进行控制一边将各空间V1、V2减压。若由未图示的检测单元检测到第一及第二空间V1、V2被减压到规定的压力状态、即第一减压状态,则按压单元3将第一及第二减压单元33、35的驱动停止。之后,按压单元3驱动第二减压单元35以及第二加压单元36,一边进行将第二空间V2保持在第一减压状态的压力维持动作,一边驱动第一加压单元34并将第一空间V1加压到规定的压力状态、即第二减压状态。由此,保持单元2通过第一减压状态与第二减压状态的差压而发生弹性变形,以保持单元2的中心部最接近晶片WF的方式挠曲,如图1中双点划线所示,从晶片WF的中心部分开始向外缘侧逐渐粘贴粘接片AS。
若粘接片AS整个面粘接于晶片WF,则保持单元2停止未图示的电压印加装置的驱动。接着,按压单元3中止压力维持动作,驱动第二加压单元36,将第二空间V2加压到第二减压状态而使保持部件21的形状复原到图1中实线所示的形状之后,按压单元3驱动第一以及第二加压单元34、36,以第一及第二空间V1、V2成为相同的压力的方式一边进行控制一边将各空间V1、V2加压到大气压。而且,若由未图示的检测单元检测到第一及第二空间V1、V2被加压到大气压,则按压单元3驱动未图示的驱动设备,使上壳体32上升到图1中双点划线所示的位置。接着,粘接有粘接片AS的晶片WF被未图示的搬运单元搬运到下一工序,以后反复进行上述同样的动作。
根据以上那样的本实施方式,由于电极22设于保持部件21内,故而不仅能够适当地保持电极22距粘接片AS的距离,而且由于该电极22不直接接触粘接片AS及晶片WF,故而能够防止由于静电引力下降或电极22破损而不能够保持粘接片AS的情况。
如以上说明地,用于实施本发明的最佳构成、方法等在上述记载中进行了公开,但本发明不限于此。即,本发明虽然主要对特定的实施方式进行特别图示并进行说明,但在不脱离本发明的技术思想及目的的范围内,对以上说明的实施方式,在形状、材质、数量、其它详细的构成方面,本领域技术人员可进行各种变形。另外,对上述公开的形状、材质等进行了限定的记载是为了容易理解本发明而示例的记载,并不限定本发明,故而除了其形状、材质等限定的一部分或全部限定之外的部件的名称的记载包含在本发明中。
例如,保持部件21也可以由不同的材料形成,还可以由单一的弹性材料构成为一个部件。另外,第一弹性部件23和第二弹性部件24也可以具有相同的硬度,还可以是第一弹性部件23的硬度比第二弹性部件24低。
另外,电极22只要至少各具有一个第一电极25及第二电极26即可。
按压单元3也可以通过仅对第一空间V1加压,使保持部件21弹性变形而粘贴粘接片AS。另外,也可以通过驱动设备及气体喷附而使保持部件21弹性变形。
粘接片AS的材质、种类、形状等不作特别限定,例如也可以是仅粘接剂层的单层构成、在基材片材与粘接剂层之间具有中间层的构成、在基材片材的上表面具有覆盖层等三层以上的构成、进而能够将基材片材从粘接剂层剥离的所谓双面粘接片这样的构成,双面粘接片可以为单层或具有多层的中间层的构成、以及无中间层的单层或多层的构成。另外,作为被粘接体,例如能够为硅半导体晶片及化合物半导体晶片等半导体晶片、电路基板、光纤等信息记录基板、玻璃板、钢板、陶器、木板或树脂板等以任意形态的部件及物品等作为对象的部件。另外,能够将粘接片AS、例如信息记录用标签、装饰用标签、保护片材、切割带、芯片粘接膜、芯片接合带、记录层形成树脂片等任意形状的任意片材、薄膜、带等粘接到上述那样的任意的被粘接体上。
本发明的单元以及工序只要能够实现对这些单元以及工序进行了说明的动作、功能或工序则不作任何限定,而且,不完全限定于上述实施方式所示的简单的一实施方式的构成物及工序。例如,保持单元若为具有可弹性变形的保持部件、设于保持部件内的电极,通过对电极施加电压而能够由保持部件保持粘接片的构成,则对照本申请最初的技术常识,只要在该技术范围内则没有任何限定(省略对其他单元以及工序的说明)。
另外,所述实施方式中的驱动设备能够采用转动电机、直动电机、线性电机、单轴机械手、多关节机械手等电动设备、气缸、油压缸、无杆缸以及旋转缸等促动器等,而且也能够将其直接地或间接地组合(也具有与实施方式中示例的构成重复的构成)。

Claims (2)

1.一种片材粘贴装置,其特征在于,具有:
保持粘接片的保持单元;
将所述粘接片按压并粘贴到被粘接体上的按压单元,
所述保持单元具有可弹性变形的保持部件、能够与该保持部件一起变形地设于所述保持部件内的电极,通过对所述电极施加电压而能够由所述保持部件保持所述粘接片,
所述按压单元设置为使所述保持部件弹性变形且使所述保持部件内的电极变形,而能够将所述粘接片按压在所述被粘接体上。
2.一种片材粘贴方法,其特征在于,实施如下的工序:
对设于可弹性变形的保持部件内且能够与该保持部件一起变形的电极施加电压,由所述保持部件保持粘接片;
使所述保持部件弹性变形且使所述保持部件内的电极变形,将所述粘接片按压并粘贴到被粘接体上。
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KR101896384B1 (ko) * 2016-10-04 2018-09-07 주식회사 대성엔지니어링 진공 라미네이터용 챔버장치
JP6880431B2 (ja) * 2017-04-11 2021-06-02 リンテック株式会社 離間装置および離間方法
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501147A (zh) * 2002-11-18 2004-06-02 Lg.������Lcd��ʽ���� 制造液晶显示装置的基板粘合设备
CN101140855A (zh) * 2006-09-08 2008-03-12 琳得科株式会社 薄片粘贴装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4121216B2 (ja) * 1999-05-20 2008-07-23 信越化学工業株式会社 弾性変形可能な静電チャック及びその製造方法
JP3599634B2 (ja) * 2000-04-10 2004-12-08 信越化学工業株式会社 イオン注入機用静電チャック
JP4814284B2 (ja) * 2008-06-12 2011-11-16 三菱電機株式会社 テープ貼付装置
KR20100043478A (ko) * 2008-10-20 2010-04-29 삼성전기주식회사 정전 척 및 이를 구비한 기판 접합 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501147A (zh) * 2002-11-18 2004-06-02 Lg.������Lcd��ʽ���� 制造液晶显示装置的基板粘合设备
CN101140855A (zh) * 2006-09-08 2008-03-12 琳得科株式会社 薄片粘贴装置

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KR20140114768A (ko) 2014-09-29
CN104064491A (zh) 2014-09-24
JP2014183169A (ja) 2014-09-29
TWI583555B (zh) 2017-05-21
KR102124310B1 (ko) 2020-06-18
TW201437028A (zh) 2014-10-01

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