KR102124310B1 - 시트 부착 장치 및 부착 방법 - Google Patents

시트 부착 장치 및 부착 방법 Download PDF

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Publication number
KR102124310B1
KR102124310B1 KR1020140030153A KR20140030153A KR102124310B1 KR 102124310 B1 KR102124310 B1 KR 102124310B1 KR 1020140030153 A KR1020140030153 A KR 1020140030153A KR 20140030153 A KR20140030153 A KR 20140030153A KR 102124310 B1 KR102124310 B1 KR 102124310B1
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KR
South Korea
Prior art keywords
holding
adhesive sheet
electrode
sheet
holding member
Prior art date
Application number
KR1020140030153A
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English (en)
Korean (ko)
Other versions
KR20140114768A (ko
Inventor
간 나카타
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20140114768A publication Critical patent/KR20140114768A/ko
Application granted granted Critical
Publication of KR102124310B1 publication Critical patent/KR102124310B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020140030153A 2013-03-19 2014-03-14 시트 부착 장치 및 부착 방법 KR102124310B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-056450 2013-03-19
JP2013056450A JP6096017B2 (ja) 2013-03-19 2013-03-19 シート貼付装置および貼付方法

Publications (2)

Publication Number Publication Date
KR20140114768A KR20140114768A (ko) 2014-09-29
KR102124310B1 true KR102124310B1 (ko) 2020-06-18

Family

ID=51552149

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140030153A KR102124310B1 (ko) 2013-03-19 2014-03-14 시트 부착 장치 및 부착 방법

Country Status (4)

Country Link
JP (1) JP6096017B2 (zh)
KR (1) KR102124310B1 (zh)
CN (1) CN104064491B (zh)
TW (1) TWI583555B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101896384B1 (ko) * 2016-10-04 2018-09-07 주식회사 대성엔지니어링 진공 라미네이터용 챔버장치
JP6880431B2 (ja) * 2017-04-11 2021-06-02 リンテック株式会社 離間装置および離間方法
KR101958827B1 (ko) * 2018-09-16 2019-03-15 주식회사 지에스아이 U 가이드를 갖는 비접촉식 필름부착장치 및 이를 이용한 필름부착방법
JP7132198B2 (ja) * 2019-09-27 2022-09-06 芝浦メカトロニクス株式会社 成膜装置及び埋込処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326170A (ja) 1999-05-20 2000-11-28 Shin Etsu Chem Co Ltd 弾性変形可能な静電チャック及びその製造方法
JP2001291680A (ja) 2000-04-10 2001-10-19 Shin Etsu Chem Co Ltd イオン注入機用静電チャック
JP2009302237A (ja) * 2008-06-12 2009-12-24 Mitsubishi Electric Corp テープ貼付装置
JP2010098289A (ja) * 2008-10-20 2010-04-30 Samsung Electro-Mechanics Co Ltd 静電チャック及びこれを備えた基板接合装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100662497B1 (ko) * 2002-11-18 2007-01-02 엘지.필립스 엘시디 주식회사 액정표시소자 제조 공정용 기판 합착 장치
JP4666519B2 (ja) * 2006-09-08 2011-04-06 リンテック株式会社 シート貼付装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326170A (ja) 1999-05-20 2000-11-28 Shin Etsu Chem Co Ltd 弾性変形可能な静電チャック及びその製造方法
JP2001291680A (ja) 2000-04-10 2001-10-19 Shin Etsu Chem Co Ltd イオン注入機用静電チャック
JP2009302237A (ja) * 2008-06-12 2009-12-24 Mitsubishi Electric Corp テープ貼付装置
JP2010098289A (ja) * 2008-10-20 2010-04-30 Samsung Electro-Mechanics Co Ltd 静電チャック及びこれを備えた基板接合装置

Also Published As

Publication number Publication date
CN104064491A (zh) 2014-09-24
KR20140114768A (ko) 2014-09-29
CN104064491B (zh) 2018-02-13
TWI583555B (zh) 2017-05-21
TW201437028A (zh) 2014-10-01
JP2014183169A (ja) 2014-09-29
JP6096017B2 (ja) 2017-03-15

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