JP7421950B2 - シート剥離方法およびシート剥離装置 - Google Patents
シート剥離方法およびシート剥離装置 Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
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- B65H41/00—Machines for separating superposed webs
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
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- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
- B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
また、気体供給工程を実施すれば、粘着シートを凸部形成面に引き付けた際、粘着シートと被着体支持手段との間に負圧が生じることで、粘着シートが被着体支持手段側に引っ張られることを抑制し、一体物から確実に粘着シートを剥離することができる。
なお、本実施形態におけるX軸、Y軸、Z軸は、それぞれが直交する関係にあり、X軸およびY軸は、所定平面内の軸とし、Z軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Y軸と平行な図1(A)の手前方向から観た場合を基準とし、方向を示した場合、「上」がZ軸の矢印方向で「下」がその逆方向、「左」がX軸の矢印方向で「右」がその逆方向、「前」がY軸と平行な図1(A)中手前方向で「後」がその逆方向とする。
保持部材12は、凸部形成面12Bと、内側に凸部形成面12Bを区画する環状の溝部12Dと、溝部12Dの外側に区画され、シール材、スポンジ、ゴム、樹脂等の封止部材で形成された環状の封止部12Eとを備えている。凸部形成面12Bにおける凸部12Aは、市松模様状に配置されるとともに、その先端が平面とされている。
支持テーブル21は、平面視で凸部形成面12Bの内径よりも小さい大きさとなっている。
先ず、図1(A)で示す初期位置に各部材が配置されたシート剥離装置EAに対し、当該シート剥離装置EAの使用者(以下、単に「使用者」という)、または、多関節ロボットやベルトコンベア等の図示しない搬送手段が、半導体ウエハ(以下、単に「ウエハ」ともいう)WFが貼付された粘着シートASを保持部材12と支持テーブル21との間の所定位置に搬送すると、離間手段50が直動モータ51および把持手段52を駆動し、把持手段52で粘着シートASを把持する。なお、ウエハWFは、レーザ照射装置や薬液付与装置等の脆弱化手段でウエハWFに物理的または化学的に脆弱層を形成したり、カッター刃等の切断手段でウエハWFをハーフカットして凹溝や切欠を形成したりして、複数のチップCPに個片化可能な状態にされている。次いで、離間手段50が直動モータ51を駆動し、図1(A)中二点鎖線で示すように、粘着シートASに張力を付与してウエハWFを複数のチップCPに分割することで、粘着シートASにチップCPが貼付された一体物UPを形成するとともに、当該複数のチップCPの相互間隔を広げる(離間工程)。
離間手段50は、本発明のシート剥離装置EAに備わっていてもよいし、備わっていなくてもよく、備わっていない場合、予め粘着シートASに相互間隔が広げられた状態で複数のチップCPが貼付された一体物UPを用いればよい。
フレーム部材は、リングフレーム以外に、環状でない(外周が繋がっていない)ものや、円形、楕円形、多角形、その他の形状であってもよい。
積層工程や回収工程は、実施してもよいし、実施しなくてもよい。
前記実施形態において、押圧ローラや押圧ヘッド等の押圧手段や押圧部材といった被押圧物を押圧するものが採用されている場合、上記で例示したものに代えてまたは併用して、ローラ、丸棒、ブレード材、ゴム、樹脂、スポンジ等の部材を採用したり、大気やガス等の気体の吹き付けにより押圧する構成を採用したりしてもよいし、押圧するものをゴムや樹脂等の変形可能な部材で構成してもよいし、変形しない部材で構成してもよいし、支持(保持)手段や支持(保持)部材等の被支持部材(被保持部材)を支持(保持)するものが採用されている場合、メカチャックやチャックシリンダ等の把持手段、クーロン力、接着剤(接着シート、接着テープ)、粘着剤(粘着シート、粘着テープ)、磁力、ベルヌーイ吸着、吸引吸着、駆動機器等で被支持部材を支持(保持)する構成を採用してもよいし、切断手段や切断部材等の被切断部材を切断または、被切断部材に切込や切断線を形成するものが採用されている場合、上記で例示したものに代えてまたは併用して、カッター刃、レーザカッタ、イオンビーム、火力、熱、水圧、電熱線、気体や液体等の吹付け等で切断するものを採用したり、適宜な駆動機器を組み合わせたもので切断するものを移動させて切断するようにしたりしてもよい。
10…シート当接手段
12A…凸部
12B…凸部形成面
12C…頂点
20…被着体支持手段
30…シート引付手段
AS…粘着シート
CP…半導体チップ(被着体)
UP…一体物
Claims (3)
- 粘着シートに複数の被着体が貼付された一体物から当該粘着シートを剥離するシート剥離方法であって、
複数の凸部が形成された凸部形成面を有するシート当接手段における当該複数の凸部の頂点を、前記一体物における前記粘着シートに当接させるシート当接工程と、
前記一体物における複数の前記被着体を被着体支持手段で支持し、前記粘着シートに前記複数の凸部の頂点を当接させた前記シート当接手段とで前記一体物を複数の前記被着体が挟み込まれるように挟み込む被着体支持工程と、
挟み込まれた前記一体物における前記粘着シートを前記凸部形成面に引き付けるシート引付工程とを実施することを特徴とするシート剥離方法。 - 前記シート当接手段と前記被着体支持手段とで前記一体物を挟み込んだ際、前記粘着シートと前記被着体支持手段との間に気体を供給する気体供給工程を実施することを特徴とする請求項1に記載のシート剥離方法。
- 粘着シートに複数の被着体が貼付された一体物から当該粘着シートを剥離するシート剥離装置であって、
複数の凸部が形成された凸部形成面を有するシート当接手段と、
前記一体物における複数の前記被着体を支持し、前記粘着シートに前記複数の凸部の頂点を当接させた前記シート当接手段とで前記一体物を複数の前記被着体が挟み込まれるように挟み込む被着体支持手段と、
挟み込まれた前記一体物における前記粘着シートを前記凸部形成面に引き付けるシート引付手段とを備えていることを特徴とするシート剥離装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020029159A JP7421950B2 (ja) | 2020-02-25 | 2020-02-25 | シート剥離方法およびシート剥離装置 |
TW110104349A TW202145322A (zh) | 2020-02-25 | 2021-02-05 | 薄片剝離方法以及薄片剝離裝置 |
KR1020210022161A KR20210108320A (ko) | 2020-02-25 | 2021-02-18 | 시트 박리 방법 및 시트 박리 장치 |
CN202110207868.9A CN113380688A (zh) | 2020-02-25 | 2021-02-24 | 片材剥离方法以及片材剥离装置 |
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JP2020029159A JP7421950B2 (ja) | 2020-02-25 | 2020-02-25 | シート剥離方法およびシート剥離装置 |
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JP2021136257A JP2021136257A (ja) | 2021-09-13 |
JP7421950B2 true JP7421950B2 (ja) | 2024-01-25 |
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JP (1) | JP7421950B2 (ja) |
KR (1) | KR20210108320A (ja) |
CN (1) | CN113380688A (ja) |
TW (1) | TW202145322A (ja) |
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JP7542505B2 (ja) | 2021-09-22 | 2024-08-30 | 株式会社東芝 | 半導体製造装置及びその使用方法 |
DE102021125237A1 (de) | 2021-09-29 | 2023-03-30 | Infineon Technologies Ag | Wafer-chuck für eine laserstrahl-waferzerteilanlage |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319150A (ja) | 2005-05-13 | 2006-11-24 | Nec Corp | 半導体チップのピックアップ装置および半導体チップのピックアップ方法 |
JP2013191781A (ja) | 2012-03-14 | 2013-09-26 | Fuji Electric Co Ltd | 半導体製造装置および半導体製造装置の制御方法 |
JP2014011416A (ja) | 2012-07-03 | 2014-01-20 | Panasonic Corp | 半導体チップのピックアップ装置およびピックアップ方法 |
JP2017005222A (ja) | 2015-06-16 | 2017-01-05 | パイオニア株式会社 | ピックアップ装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04192348A (ja) | 1990-11-24 | 1992-07-10 | Fuji Electric Co Ltd | テープチップの剥離方法および装置 |
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- 2021-02-05 TW TW110104349A patent/TW202145322A/zh unknown
- 2021-02-18 KR KR1020210022161A patent/KR20210108320A/ko active Search and Examination
- 2021-02-24 CN CN202110207868.9A patent/CN113380688A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319150A (ja) | 2005-05-13 | 2006-11-24 | Nec Corp | 半導体チップのピックアップ装置および半導体チップのピックアップ方法 |
JP2013191781A (ja) | 2012-03-14 | 2013-09-26 | Fuji Electric Co Ltd | 半導体製造装置および半導体製造装置の制御方法 |
JP2014011416A (ja) | 2012-07-03 | 2014-01-20 | Panasonic Corp | 半導体チップのピックアップ装置およびピックアップ方法 |
JP2017005222A (ja) | 2015-06-16 | 2017-01-05 | パイオニア株式会社 | ピックアップ装置 |
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TW202145322A (zh) | 2021-12-01 |
JP2021136257A (ja) | 2021-09-13 |
KR20210108320A (ko) | 2021-09-02 |
CN113380688A (zh) | 2021-09-10 |
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