TWI828741B - 用於顯示器和/或感測器裝置的塑膠膜組件的加工 - Google Patents

用於顯示器和/或感測器裝置的塑膠膜組件的加工 Download PDF

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TWI828741B
TWI828741B TW108130249A TW108130249A TWI828741B TW I828741 B TWI828741 B TW I828741B TW 108130249 A TW108130249 A TW 108130249A TW 108130249 A TW108130249 A TW 108130249A TW I828741 B TWI828741 B TW I828741B
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沙吉爾 西迪基
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Abstract

一種方法，包括：製備自撐式塑膠膜組件，所述自撐式塑膠膜組件包括至少支撐層的堆疊的塑膠支撐膜，所述堆疊限定像素電極的陣列和用於經由像素電極的所述陣列外部的導體對每一個像素電極進行獨立定址的電路系統；隨後將載體附接到所述塑膠膜組件；經由所述載體將所述塑膠膜組件安裝在支撐單元表面上，所述支撐單元表面限定連接到真空泵的多個開口；以及在操作所述真空泵的同時，對安裝於所述支撐單元表面上的所述塑膠膜組件進行加工；並且隨後從所述塑膠膜組件上釋放所述載體。

Description

用於顯示器和/或感測器裝置的塑膠膜組件的加工
發明領域 顯示器和感測器裝置的生產可涉及自撐式塑膠膜組件的生產，所述自撐式塑膠膜組件包括至少支撐導體、半導體和絕緣體層的堆疊的支撐膜，所述堆疊限定像素電極的陣列和用於經由像素電極的陣列外部的導體對每一個像素電極進行獨立定址的電路系統。
發明背景 塑膠膜組件的進一步加工可涉及將塑膠膜組件安裝於加工工具的支撐表面上。一些加工工具中使用了真空工件台，其目的在於將塑膠膜組件牢固地固定在適當的位置進行加工，同時使塑膠膜組件在加工完成之後能夠輕鬆自動地從加工工具中釋放。
本申請的發明人已觀察到在使用真空工件台來對用於例如包括像素電極的陣列的顯示器裝置或感測器裝置等裝置的塑膠膜組件進行加工時的加工缺陷；且發明人已經想到經由臨時附接到塑膠膜組件的臨時載體來將塑膠膜組件安裝在真空工件台上。
發明概要 在此提供一種方法，包括：製備自撐式塑膠膜組件，所述自撐式塑膠膜組件包括至少支撐層的堆疊的塑膠支撐膜，所述堆疊限定像素電極的陣列和用於經由像素電極的陣列外部的導體對每一個像素電極進行獨立定址的電路系統；隨後將載體附接到塑膠膜組件；經由載體將塑膠膜組件安裝在支撐單元表面上，所述支撐單元表面限定連接到真空泵的多個開口；以及在操作真空泵的同時，對安裝於支撐單元表面上的塑膠膜組件進行加工；並且隨後從塑膠膜組件上釋放載體。
根據一個實施例，製備塑膠膜組件包括通過包括以下操作的過程來形成塑膠膜組件的至少部分：經由至少一層黏附劑將支撐膜附接到另一載體；在所述另一載體上原位加工支撐膜；並且隨後從所述另一載體中去除支撐膜。
根據一個實施例，對塑膠膜組件進行加工包括將驅動器晶片單元鍵合到塑膠膜組件，從而在塑膠膜組件的導體陣列與驅動器晶片單元的對應導體陣列之間形成導電連接。
根據一個實施例，驅動器晶片單元包括支撐驅動器晶片單元的所述導體陣列的支撐膜，和鍵合到支撐膜的至少一個驅動器晶片，其中在驅動器晶片的終端與驅動器晶片單元的所述導體陣列之間形成導電連接。
根據一個實施例，載體的剛性大於塑膠膜組件。
根據一個實施例，載體包括一片玻璃。
根據一個實施例，將塑膠膜組件安裝在真空工件台上包括將塑膠膜組件安裝成使其邊緣部分延伸超出真空工件台的側邊緣；並且加工包括對塑膠膜組件的所述邊緣部分進行加工。
較佳實施例之詳細說明 參考圖1，根據本發明的實施例的過程的實例涉及將用於顯示器裝置和/或感測器裝置的塑膠膜組件4安裝在真空工件台1上。真空工件台的內部包括一個或多個管道2，所述管道在真空工件台的上部安裝表面處的開口5中封端並且連接到一個或多個埠3，真空泵連接到所述一個或多個埠3。
舉例來說，塑膠膜組件4可具有不超過約100微米的厚度。
在此實例中，塑膠膜組件4安裝於真空工件台1的安裝表面上以便覆蓋開口5，且具有延伸超出真空工件台1的邊緣的待加工邊緣部分。在此實例中，塑膠膜組件包括至少一個塑膠支撐膜，所述塑膠支撐膜將對齊標記支撐在支撐膜的上表面上（即，遠離真空工件台的安裝表面的支撐膜表面），所述對齊標記可以通過支撐膜從下方檢測到。檢測器8定位於塑膠膜組件4的這個邊緣部分下方以檢測對齊標記的位置，且經由檢測器檢測到的對齊標記的X-Y位置用以控制塑膠膜組件4的邊緣部分的加工。
將塑膠膜組件4安裝在真空工件台上涉及首先將塑膠膜組件4附接到臨時載體6，接著將塑膠膜組件4和臨時載體6的組合安裝到真空工件台，其中臨時載體6在塑膠膜組件4與真空工件台1之間。舉例來說，臨時載體6可包括單件式載體(例如單片玻璃)或多件式載體，例如鍵合到玻璃片的塑膠薄片。在一個實例中，臨時載體的剛性大於塑膠膜組件。在一個實例中，臨時載體包括厚度超過約0.1 mm或超過約0.5 mm的玻璃片。
將塑膠膜組件4附接到臨時載體6的過程將取決於對塑膠膜組件4進行的加工的狀況。在塑膠膜組件4的加工期間，塑膠膜組件4相對於臨時載體6保持在固定位置是足夠的。對於一些類型的加工，以下情況可能就足夠了：僅由塑膠膜組件4與臨時載體6之間的物理黏附力(范德華鍵)產生附接，而不需要臨時載體6與塑膠膜組件4之間的化學鍵；以及臨時載體可設置有上表面塗層7，所述上表面塗層在載體6與塑膠膜組件4之間產生更佳的物理黏附力。
在下文所描述的其中加工包括ACF鍵合的實例中，塑膠膜組件4與臨時載體6之間的附接是使用黏附帶，所述黏附帶在塑膠膜組件4與臨時載體6之間包括一層矽壓力敏感黏附劑。在壓力敏感帶的剝離黏附的標準試驗方法ASTM D3330中，黏附帶呈現約0.06N的剝離強度，所述標準試驗方法涉及測量在最初25mm(1英寸)的剝離後的在50mm(2英寸)長度的剝離上的平均力值。
舉例來說，邊緣部分的加工可包括例如COF(覆晶薄膜)單元的導體之間或晶片終端到塑膠膜組件4的導體陣列之間的ACF鍵合，所述導體陣列相對於塑膠膜組件的上文所提到的對齊標記處於預定位置。然而，所述技術同樣適用於其它種類的加工。
在加工完成之後，臨時載體6從塑膠膜組件4中釋放。在一個實例中，塑膠膜組件4包括LC盒，且臨時載體6被另一塑膠膜組件4替代，所述另一塑膠膜組件4在LC盒的相對側上提供兩個偏振濾光器中的一個。
本申請的發明人已注意到在塑膠膜組件4與真空工件台1之間使用臨時載體6時的加工良率有改善。本申請的發明人將這個加工良率的改善歸因於塑膠膜組件4的邊緣部分(延伸超出真空工件台的邊緣)偏離平行於真空工件台的安裝表面的X-Y平面的量的減小，其中基於所檢測到的對齊標記的X-Y位置來控制加工的假設前提是塑膠膜組件的邊緣部分平行於真空工件台1的安裝表面。
圖2示出使用上文所描述的方法進行加工的塑膠膜組件的一個實例，但所述技術同樣適用於其它種類的顯示器和/或感測器裝置用塑膠膜組件。圖3示出在使用上文所描述的方法進行加工之後圖2的塑膠膜組件。
在此實例中，塑膠膜組件4包括用於在將偏振濾光器施加到LC盒的相對側之前進行加工的液晶(LC)盒。參考圖2，在塑膠支撐膜16上原位形成導體、半導體和絕緣體層的堆疊14。堆疊14限定像素電極的陣列18和用於經由像素電極的陣列外部的導體對每一個像素電極進行獨立控制的電路系統。舉例來說，堆疊可限定薄膜電晶體(例如包括有機半導體溝道的OTFT)的主動式矩陣陣列，包含：柵極導體的陣列，每個柵極導體為TFT的相應行提供柵極電極並且延伸到像素電極的陣列外部；以及源極導體的陣列，每個源極導體為TFT的相應列提供源極電極並且延伸到像素電極的陣列外部。每一個像素電極與相應TFT相關聯，且每個TFT與柵極和源極導體的唯一組合相關聯，其中每一個像素電極可以獨立於所有其它像素進行定址。在像素電極的陣列18與對立組件22之間包含厚度大體上均勻的液晶材料20，所述對立組件包括支撐在另一塑膠支撐膜上的濾色器陣列。
在此實例中，使用上文所描述的真空工件台安裝方法進行加工可包括將覆晶薄膜(COF)單元24鍵合到像素電極的陣列外部的支撐膜16的邊緣部分，從而在(i)由像素電極的陣列外部的區中的堆疊限定的導體陣列(例如，源極和柵極定址導體)與(ii)COF單元24的對應導體陣列之間形成導電連接，所述COF單元24連接到形成COF單元24的部分的一個或多個驅動器晶片26的終端。
LC盒包含在LC材料兩側上的對齊層(例如，摩擦的聚醯亞胺層)以在像素電極與對立電極之間的電勢差所產生的電場不存在的情況下控制LC指向矢的定向。對立電極可在液晶材料的與像素電極相同的側上(例如在邊緣場開關(FFS)裝置的狀況下)，或可在液晶材料的與像素電極相反的側上(在此狀況下，它可由導體層構成，所述導體層形成包含CFA陣列的對立組件22的部分)。
在此實例中，塑膠膜組件4是通過對較大面積塑膠膜進行加工且接著將加工後的塑膠膜分割成多個單獨塑膠膜組件來製備的一組塑膠膜組件中的一個。參考圖4，大面積塑膠支撐膜100經由黏附單元108安裝于臨時載體106上，且在臨時載體106上原位加工。如上文所論述，加工可包括在大面積塑膠支撐膜上形成層的堆疊，所述堆疊限定上文描述的像素電極陣列18和用於一組顯示器/感測器裝置的定址電路。第二大面積塑膠支撐膜(圖中未示)也經由黏附單元(圖中未示)安裝于第二臨時載體(圖中未示)上，且在臨時載體上原位加工以在大面積塑膠膜組件內限定用於顯示器/感測器裝置的一組對立組件22。接著將這兩個加工後的大面積塑膠膜組件放在一起以便在它們之間至少在像素電極陣列22的區域中包含LC材料。所得組合件接著從兩個臨時載體中釋放，且通過例如鐳射或機械切割而分割成單獨塑膠膜組件(具有相對較小的剖面104)。用於上文所描述的真空工件台安裝中的臨時載體是與用於從大面積塑膠膜中製備塑膠膜組件4的臨時載體分開的；單獨塑膠膜組件4在安裝在上文所描述的分開的臨時載體6上以在真空工件台1上進行加工之前，從用於從大面積塑膠膜中製備塑膠膜組件4的臨時載體中釋放。
除了上文明確提及的任何修改之外，本領域技術人員還將清楚，可以在本發明的範圍內對描述的實施例進行各種其它修改。
申請人在此單獨公開本文描述的每一個體特徵及兩個或更多個此類特徵的任意組合，以本領域技術人員的普通知識，能夠總體上基於本說明書實行此類特徵或組合，而不考慮此類特徵或特徵的組合是否能解決本文所公開的任何問題；且不對申請專利範圍的範圍造成限制。申請人指示本發明的各方面可由任何此類個別特徵或特徵的組合組成。
1:真空工件台 2:管道 3:埠 4:塑膠膜組件 5:開口 6:臨時載體 7:上表面塗層 8:檢測器 14:堆疊 16:塑膠支撐膜 18:像素電極陣列 20:液晶材料 22:對立組件 24:覆晶薄膜單元 26:驅動器晶片 100:塑膠支撐膜 104:剖面 106:臨時載體 108:黏附單元
圖1說明根據本發明的實施例的真空工件台安裝過程； 圖2說明使用圖1所示的真空工件台安裝過程進行加工的塑膠膜組件的一個實例； 圖3說明在加工之後圖2的塑膠膜組件的一個實例；以及 圖4說明從較大面積單元的加工中製備多個單獨塑膠膜組件。
1:真空工作台
2:管道
3:埠
4:塑膠膜組件
5:開口
6:臨時載體
7:上表面塗層
8:檢測器

Claims (7)

  1. 一種用於加工塑膠膜組件的方法，其特徵在於，包括：製備塑膠膜組件，所述塑膠膜組件包括至少支撐層的堆疊的塑膠支撐膜，所述堆疊限定像素電極的陣列和用於經由像素電極的所述陣列外部的導體對每一個像素電極進行獨立定址的電路系統；其中所述塑膠膜組件沒有任何臨時載體；隨後將載體附接到所述塑膠膜組件；經由所述載體將所述塑膠膜組件安裝在支撐單元表面上，所述支撐單元表面限定連接到真空泵的多個開口，其中所述載體在所述塑膠膜組件與所述支撐單元表面之間；以及在操作所述真空泵的同時，對安裝於所述支撐單元表面上的所述塑膠膜組件進行加工；並且隨後從所述塑膠膜組件上釋放所述載體。
  2. 如請求項1所述用於加工塑膠膜組件的方法，其中，製備所述塑膠膜組件包括通過包括以下操作的過程來形成所述塑膠膜組件的至少部分：經由至少一層黏附劑將所述支撐膜附接到另一載體；在所述另一載體上原位加工所述支撐膜；並且隨後從所述另一載體中去除所述支撐膜。
  3. 如請求項1或2所述用於加工塑膠膜組件的方法，其中，對所述塑膠膜組件進行加工包括將驅動器晶片單元鍵合到所述塑膠膜組件，從而在所述塑膠膜組件的導體陣列與所述驅動器晶片單元的對應導體陣列之間形成導電連接。
  4. 如請求項3所述用於加工塑膠膜組件的方法，其中，所述驅動器晶片單元包括支撐所述驅動器晶片單元的所述導體陣列的支撐膜，和鍵合到所述支撐膜的至少一個驅動器晶片，其中在所述驅動器晶片的終端與所述驅動器晶片單元的所述導體陣列之間形成導電連接。
  5. 如請求項1或2所述用於加工塑膠膜組件的方法，其中，所述載體的剛性大於所述塑膠膜組件。
  6. 如請求項1或2所述用於加工塑膠膜組件的方法，其中，所述載體包括一片玻璃。
  7. 如請求項1或2所述用於加工塑膠膜組件的方法，其中，將所述塑膠膜組件安裝在真空工件台上包括將所述塑膠膜組件安裝成使其邊緣部分延伸超出所述真空工件台的側邊緣；並且所述加工包括對所述塑膠膜組件的所述邊緣部分進行加工。
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