JP6873324B2 - 締結構造体および締結構造体を用いた電力変換装置 - Google Patents
締結構造体および締結構造体を用いた電力変換装置 Download PDFInfo
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- JP6873324B2 JP6873324B2 JP2020517649A JP2020517649A JP6873324B2 JP 6873324 B2 JP6873324 B2 JP 6873324B2 JP 2020517649 A JP2020517649 A JP 2020517649A JP 2020517649 A JP2020517649 A JP 2020517649A JP 6873324 B2 JP6873324 B2 JP 6873324B2
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- shaped spring
- fastening structure
- spring member
- plate
- support
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- 238000006243 chemical reaction Methods 0.000 title claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000005452 bending Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図1は実施の形態1による締結構造体を示す分解斜視図である。図2は実施の形態1による締結構造体における押え用板状ばね部材を被固定部材側から見た正面図である。
図3は実施の形態2による締結構造体の要部を示す要部拡大斜視図である。図4は実施の形態2による締結構造体を示す側面図である。図5は実施の形態2による締結構造体を示す斜視図である
図6は実施の形態3による締結構造体の要部を示す要部拡大側面図である。図7は実施の形態3による締結構造体の要部を下方向から見た図である。
従って、例示されていない無数の変形例が、本願明細書に開示される技術の範囲内において想定される。例えば、少なくとも1つの構成要素を変形する場合、追加する場合または省略する場合、さらには、少なくとも1つの構成要素を抽出し、他の実施の形態の構成要素と組み合わせる場合が含まれるものとする。
Claims (10)
- 一方側に被固定部材が載置される被締結部材と、前記被固定部材の反被締結部材側に配置される押え用板状ばね部材と、前記押え用板状ばね部材の長手方向中心部の端部外方に伸張するとともに貫通穴が形成された支持体と、前記支持体に設けられ、前記被締結部材側に折曲された支柱体と、前記被締結部材に設けられ、前記支持体の前記貫通穴の位置と同一軸心状に配置された固定用ねじ穴と、前記支持体の前記貫通穴に挿通され、前記固定用ねじ穴に螺着された固定用ねじとを備えたことを特徴とする締結構造体。
- 前記支柱体は、前記支持体の前記貫通穴の周囲に配置され、折曲された先端部は前記被締結部材に当接されることを特徴とする請求項1に記載の締結構造体。
- 前記押え用板状ばね部材の前記支持体は、前記被締結部材との位置決めを行う位置決め用突起体が設けられ、前記被締結部材に前記位置決め用突起体が係合する係合穴が設けられることを特徴とする請求項1または請求項2に記載の締結構造体。
- 前記押え用板状ばね部材は、前記押え用板状ばね部材の反被固定部材側に前記押え用板状ばね部材の長手方向中心部の端部間に凸形状のリブが設けられていることを特徴とする請求項1から請求項3のいずれか1項に記載の締結構造体。
- 前記押え用板状ばね部材は、ステンレス材で構成されていることを特徴とする請求項1から請求項4のいずれか1項に記載の締結構造体。
- 前記被固定部材は、長手方向に直列に複数配置され、前記押え用板状ばね部材と前記支持体は、長手方向に直列に複数配置されることを特徴とする請求項1に記載の締結構造体。
- 前記押え用板状ばね部材および前記支持体は長手方向に直列に一体化されていることを特徴とする請求項6に記載の締結構造体。
- 前記被固定部材は、半導体素子が樹脂封止された半導体モジュールであることを特徴とする請求項1から請求項7のいずれか1項に記載の締結構造体。
- 前記被締結部材は、ヒートシンクであることを特徴とする請求項1から請求項8のいずれか1項に記載の締結構造体。
- 請求項1から請求項9のいずれか1項に記載の締結構造体を用いることを特徴とする電力変換装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/017729 WO2019215805A1 (ja) | 2018-05-08 | 2018-05-08 | 締結構造体および締結構造体を用いた電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019215805A1 JPWO2019215805A1 (ja) | 2021-01-14 |
JP6873324B2 true JP6873324B2 (ja) | 2021-05-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020517649A Active JP6873324B2 (ja) | 2018-05-08 | 2018-05-08 | 締結構造体および締結構造体を用いた電力変換装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11430713B2 (ja) |
JP (1) | JP6873324B2 (ja) |
CN (1) | CN112074948B (ja) |
DE (1) | DE112018007572T5 (ja) |
WO (1) | WO2019215805A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7392430B2 (ja) * | 2019-11-29 | 2023-12-06 | Tdk株式会社 | 支持構造、及び支持具のセット |
CN111225544B (zh) * | 2019-12-06 | 2021-11-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | 用于电子元件的散热装置 |
EP4128499A4 (en) * | 2020-04-01 | 2024-05-29 | Atlas Copco (Wuxi) Compressor Co., Ltd. | DRIVE UNIT |
US12020972B2 (en) * | 2020-04-29 | 2024-06-25 | Semiconductor Components Industries, Llc | Curved semiconductor die systems and related methods |
DE102020209923B3 (de) | 2020-08-06 | 2022-01-20 | Vitesco Technologies GmbH | Schaltungsträgeranordnung und Verfahren zum Herstellen einer solchen Schaltungsträgeranordnung |
JP7452373B2 (ja) * | 2020-10-19 | 2024-03-19 | 株式会社デンソー | 電力変換装置 |
JP7567696B2 (ja) | 2021-07-08 | 2024-10-16 | 株式会社豊田自動織機 | 電動圧縮機 |
WO2024070581A1 (ja) * | 2022-09-26 | 2024-04-04 | ローム株式会社 | 電力変換ユニット |
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JPH01145193U (ja) * | 1988-03-28 | 1989-10-05 | ||
JPH02104697U (ja) * | 1989-02-07 | 1990-08-20 | ||
JPH0511451U (ja) * | 1991-07-19 | 1993-02-12 | 菊水電子工業株式会社 | 強制空冷形放熱器 |
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US7274572B2 (en) * | 2005-04-26 | 2007-09-25 | Inventec Corporation | Supporting plate |
JP5014016B2 (ja) * | 2007-08-08 | 2012-08-29 | 三菱電機株式会社 | 半導体装置 |
TWM349083U (en) | 2008-06-10 | 2009-01-11 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly |
JP5020409B2 (ja) * | 2009-03-31 | 2012-09-05 | 三菱電機株式会社 | 基板固定構造 |
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JP2012182224A (ja) * | 2011-02-28 | 2012-09-20 | Tdk Corp | 電子部品の固定用ばね具及び放熱構造体 |
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JP5832215B2 (ja) * | 2011-09-28 | 2015-12-16 | 株式会社ケーヒン | 半導体制御装置 |
KR200484015Y1 (ko) * | 2013-09-12 | 2017-07-20 | 엘에스산전 주식회사 | 전력 변환 장치 |
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JP6303952B2 (ja) * | 2014-09-22 | 2018-04-04 | Tdk株式会社 | 基板実装構造及び電源装置 |
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JP6633433B2 (ja) * | 2016-03-16 | 2020-01-22 | 京セラ株式会社 | 電力変換装置 |
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2018
- 2018-05-08 JP JP2020517649A patent/JP6873324B2/ja active Active
- 2018-05-08 DE DE112018007572.9T patent/DE112018007572T5/de active Pending
- 2018-05-08 CN CN201880093097.1A patent/CN112074948B/zh active Active
- 2018-05-08 WO PCT/JP2018/017729 patent/WO2019215805A1/ja active Application Filing
- 2018-05-08 US US16/960,794 patent/US11430713B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2019215805A1 (ja) | 2019-11-14 |
DE112018007572T5 (de) | 2021-01-21 |
JPWO2019215805A1 (ja) | 2021-01-14 |
US20210066161A1 (en) | 2021-03-04 |
CN112074948A (zh) | 2020-12-11 |
CN112074948B (zh) | 2024-09-24 |
US11430713B2 (en) | 2022-08-30 |
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