M349083 八、新型說明： 【新型所屬之技術領域】 本創作涉及-種電連翻組合，尤其是—種用以t性連接晶片模組至電路 板之電連接^5組合。 【先前技術】 CPU連接器、已廣泛地應用在個人電腦上。美國專利第5,722，⑽號即揭露出 一種用在桌上型電腦之連接器。這種CPU連接器亦稱做零插入力你01脱咖 F_)連接ϋ。它包括了—個基體，其上設置有多數個端子槽，每—端子槽内 • t容置有-根端子。在基體上’另滑動地設置有一蓋體，蓋體上設置有多“M349083 VIII. New Description: [New Technology Field] This creation involves a combination of electrical connection, especially a combination of electrical connections for the t-connection of the chip module to the circuit board. [Prior Art] The CPU connector has been widely used in personal computers. U.S. Patent No. 5,722, (10) discloses a connector for use in a desktop computer. This kind of CPU connector is also called zero insertion force. You 01 off coffee F_) connection ϋ. It includes a base body on which a plurality of terminal slots are provided, and each of the terminal slots has a - terminal. On the base body, a cover body is slidably disposed, and the cover body is provided with a plurality of "
牙孔，分別與每一端子槽對齊。在基體之一個側邊位置處，尚設置有一個驅動 几件’以駆動蓋體在基體上飾。鶴元件是—個凸輪結構，同時連接有—授 作桿。當操作桿位於垂直位置時，CPU之插腳可以不受任何力之情況下穿過^ 體上之孔洞，再進人到端子槽内。之後，操作桿旋轉下移， P 讀動，朗物财絲上㈣。驗餘MUCPU這糾 之進而與端子槽内之端子完成了電連接。以上介紹之是桌上型電腦用 ^ =記«腦所使狀CPU連接器，其基本架構亦與前述之專利大致相同， 二於筆記型電腦之空間’前述之操作桿則改成了水平式之驅動片。而1 工作〔、操作原理亦與桌上型電腦相同，故不再多述。 /、 』國專，肌戰則揭露了另—種電連接器。這種連接器_般被通稱 出也隨Lr 刪連接器。主要是由於cpu之效能愈來愈高，其輸入/輸 :、“口。®此然法再使用原來之插腳式，而必須改成接觸片（Pad)式。如 °以&加更多之空間來容置接觸片。而相對於cpu之改變， 子結構，也隨著改變。苴中端子接 。。上之知 cpu之接__ I嫌綱似面，以直接與 動裝=Γ，197號專^及到之電連接器沒有蓋體，也沒有驅動蓋體之驅 I用了-種被簡柄-爲上、下鐵片之結構。其中電連接器是组裝在下 M349083 鐵片之中央，而上鐵片則是可轉動地樞接在下鐵片之—側，而在下鐵片之另 側’則樞接有一壓桿。當CPU置於連接器上後，上鐵片便蓋了下來，最後再使 用壓桿把上鐵片壓扣在下鐵片上，以確保CPU與連接器接觸面之1^八端子電4接 觸0 這種LGA態樣之連接器，使用在桌上型電腦時，由於空間足夠，、Λ有4和 問;¢1，但使用在筆記型電腦上時，就沒法使用搖桿式之壓垣社娃7 此外，還有另-個問題要考慮之，就是CPU之基本架構。°cpu是由一個基 板(Substrate)及形成在其上之晶元模組(Die)所構成。晶元模組是凸出在基板土 上。因此，當把CPUS向連接器時，必須要把下壓力均勻地分佈在晶元模址以 •及關之基板上。因爲單獨地下壓晶元模组或基板，則都有可能會因爲受力 平均而造成CPU變形翹曲，最後影響到電氣連接特性。 B ’、、又 鑒於此’針對上述問題有必要提供一種改進之電連接器組合，卩克服上述 電連接器組合之不足。 【新型内容】 本創作之目的是提供-種設有具有畴框之電連驗合，制持框設有釣 部與絕緣本體配合可使電連接缝合更平穩地絲至電路板。 本創作採壯下技術转··—觀連接驗合，可電 ’包括容設有導電端子之絕緣本體、平放於晶片模組The perforations are aligned with each terminal slot. At one of the side positions of the base body, a drive piece is provided to slant the cover body to the base body. The crane component is a cam structure with a coupling lever. When the lever is in the vertical position, the pins of the CPU can pass through the holes in the body without any force and then enter the terminal slot. After that, the operating lever rotates down, P reads, and the object is on the wire (4). This correction by the MUCPU is then electrically connected to the terminals in the terminal slot. The above is the desktop computer with ^ = remember « brain made CPU connector, its basic structure is similar to the aforementioned patent, two in the notebook computer space 'the aforementioned operating rod is changed to horizontal The driving piece. The 1 work [, the operating principle is the same as the desktop computer, so it will not be repeated. /, 』 National Academy, muscle warfare revealed another kind of electrical connector. This type of connector is generally referred to as a connector with Lr. Mainly because the performance of the cpu is getting higher and higher, its input/transmission: "mouth." This method uses the original pin type, but must be changed to the contact type (Pad). For example, add & add more The space to accommodate the contact piece. Compared with the change of the cpu, the sub-structure is also changed. The terminal is connected. The upper part knows the cpu connection __ I suspected the surface, directly with the mobile device = Γ , No. 197 special and the electrical connector does not have a cover body, and there is no drive cover for the drive I - a simple handle - the structure of the upper and lower iron pieces. The electrical connector is assembled under the M349083 iron In the center of the piece, the upper iron piece is rotatably pivoted on the side of the lower iron piece, and the other side of the lower iron piece is pivotally connected with a pressing rod. When the CPU is placed on the connector, the upper iron piece is attached. Cover it, and finally use the pressure bar to press the upper iron piece on the lower iron piece to ensure that the CPU and the connector contact surface of the 1^8 terminal electric 4 contact 0. This LGA state connector is used in the desktop type. When the computer is full, there is enough space, there are 4 and Q; ¢ 1, but when used on a notebook computer, there is no way to use the rocker type 垣 垣 7 7 There is another problem to be considered, that is, the basic structure of the CPU. °cpu is composed of a substrate (Substrate) and a die element module (Die) formed thereon. The die element module is convex at On the substrate soil, therefore, when the CPUS is connected to the connector, it is necessary to evenly distribute the downforce on the substrate of the wafer die and the substrate. Because the die element module or substrate is pressed underground, it is possible The CPU will be warped due to the average force, which will affect the electrical connection characteristics. B ', and in view of this, it is necessary to provide an improved electrical connector combination to overcome the above-mentioned shortcomings of the electrical connector combination. [New content] The purpose of this creation is to provide a type of electrical connection with a domain frame, and the holding frame is provided with a fishing part and an insulating body to make the electrical connection suture more smoothly to the circuit board. Adopting the technology to turn on the connection and checking the connection, the electricity can include the insulating body with the conductive terminals and the flat module.
爲實現前述之目的， 性連接晶片模組至電路板 之上之導糾’持晶輸她㈣抑上之咖、纖固持框之 上並可通過連接件連接至電路板之彈性扣片、安置於輯框上之散熱管以及連 /、雜向下延伸α麵部，縣本體設有與瓣對應之配合槽，因 此在將彈性扣版敍魏板時，可起而帶綠触果不好 題。 相對於習知技術，本創作 電連接器組合可解決如下技術問題 •’在將彈性扣 M349083 片組接至電路板時，可防止固持框以及晶片模峰起而帶來組接效果不好之問 題’從而可能影響到電連接器組合之電氣穩定性。 【實施方式】 如第-圖以及第二圖所示爲本創作電連接器組合（未標號）與晶片模組 50、電路板70、背板80之兩個不同視角之立體分解圖，電連接器組合包括容設 有導電端子9〇之絕緣本體1〇、平放於晶片模組5〇之上之導熱片1〇〇、可固持晶 •片模、、且5〇並抵罪於‘熱片1〇〇上之固持框20、按壓於固持框2〇之上並可通過連 接件60連接至電路板7〇之彈性扣片30、安置於固持框上2〇並位於一對彈性扣片 φ 30之間之散熱管40以及連接件60。 如第二圖、第三圖及第六圖所示，絕緣本體1〇設有承接面1〇1、與承接面 101相對之安裝面102以及垂直圍繞於承接面1〇1之侧壁1〇3。側壁1〇3凹設有配 合槽104 ,其中配合槽1〇4延伸至安裝面1〇2。固持框2〇爲金屬製成，設有主體 部2(U、貫穿主體部之窗口2〇2、窗〇之間設置之凸肋（未標號）、自主體部2〇1 向上延伸並位於窗口202兩側之一對凸柱2〇3、自主體部2〇1向下延伸形成並位 於囪口2〇2周邊之凸台206以及自主體部2〇1側邊中部及兩端部向下延伸形成之 钩部204與卡持部205。鈎部204呈L狀設置，其設有垂直延伸之連接部（未標號） 以及自連接部末端向内水平延伸之扣合部（未標號）。 # 如第三圖所示’彈性扣片30爲金屬製成，其設有弧狀基部301及自基部301 -向兩端彎折延伸之组接端3〇2。基部301設有與凸柱203對應之定位孔3011， 組接端302設有上下方向貫穿之一對組接孔3〇21，該對組接孔3〇21孔徑大小不 一。電路板70以及背板80均設有與組接孔3〇21對應之通孔（未標號）。 請翏閱第三圖至第五圖’組裝時，先將晶片模組5〇安裝至絕緣本體]〇内， 再將平板狀之導熱片100平放並粘貼於晶片模組5〇之上，然後將固持框2〇組裝 至絕緣本體10，固持框20之卡持部2〇5與絕緣本體1〇之侧壁1〇3相互卡持，鈎部 204可與配合槽104組合，凸台206將按壓於導熱片100上（如圖4所示），接下來 將彈性扣片30安放至固持框20上，固持框2〇之凸柱2〇3穿過彈性扣片3〇之定位 孔3011以形成定位，彈性扣片30通過連接件6〇依次穿過組接端3〇2設有之組接孔 7 M349083 3021、電路板70以及背板80對應組接孔3〇21設置之通孔從而連接至電路板川， 此％ ’彈性扣片30之基部301將對固持框2〇之主體部2〇1施加壓力，此塵力依次 由固持框2〇傳遞至導熱綱制晶賴㈣制導電舒9G，最後將散熱管 40安裝於固持框20上，散熱管4〇將與導熱片1〇〇接觸。 ，… 上述將彈性扣片30連接至電路板7〇過程中，由於固持框2〇設置之釣部施 與絕緣本體K)之配合槽刚相組合，從而可以防止卡持部2_側壁地卡持力 不足而導朗雜_起、辟晶#做_域絲不到位之情況。且組裝 時更爲方便。 、、In order to achieve the above purpose, the connection between the chip module and the circuit board is controlled by the crystal chip, and the elastic clips on the frame and connected to the circuit board through the connecting member are disposed. The heat-dissipating tube on the frame and the α-face extending downwards and the miscellaneously extend the α-face. The county body is provided with a matching groove corresponding to the flap. Therefore, when the elastic buckle is pressed into the Wei board, the green touch can be brought up. question. Compared with the prior art, the combination of the present electrical connector can solve the following technical problems: 'When the elastic buckle M349083 is assembled to the circuit board, the holding frame and the chip mold peak can be prevented from being brought into a bad connection effect. The problem 'may thus affect the electrical stability of the electrical connector assembly. [Embodiment] As shown in the first and second figures, the three-dimensional exploded view of the two different viewing angles of the creative electrical connector assembly (not labeled) and the wafer module 50, the circuit board 70, and the backplane 80 is electrically connected. The combination includes an insulating body 1 容 having a conductive terminal 9 〇, a thermal conductive sheet 1 平 placed on the wafer module 5 〇〇, a crystal holder, a mold, and 5 〇 and is blamed on the 'hot film The holding frame 20 on the upper side of the holding frame 20 is pressed on the holding frame 2 并可 and can be connected to the elastic plate 30 of the circuit board 7 through the connecting member 60, placed on the holding frame 2 〇 and located on a pair of elastic buckle pieces φ The heat pipe 40 between the 30 and the connecting member 60. As shown in the second, third and sixth figures, the insulative housing 1 is provided with a receiving surface 1〇1, a mounting surface 102 opposite to the receiving surface 101, and a side wall 1垂直 vertically surrounding the receiving surface 1〇1. 3. The side wall 1〇3 is recessed with a matching groove 104, wherein the engaging groove 1〇4 extends to the mounting surface 1〇2. The holding frame 2 is made of metal, and is provided with a main body portion 2 (U, a window penetrating through the main body portion 2, a rib provided between the window sills (not labeled), extending upward from the main body portion 2〇1 and located at the window One of the two sides of the pair of the pair of posts 2〇3, extending downward from the main body portion 2〇1 and located at the periphery of the chimney 2〇2, and the central portion and the two ends of the side from the side of the main body portion 2〇1 The hook portion 204 and the retaining portion 205 are extended. The hook portion 204 is disposed in an L shape, and is provided with a vertically extending connecting portion (not labeled) and a fastening portion (not labeled) extending horizontally inward from the end of the connecting portion. # As shown in the third figure, the elastic clasp 30 is made of metal, and is provided with an arcuate base 301 and a connecting end 3〇2 extending from the base 301 to both ends. The base 301 is provided with a stud The positioning hole 3011 corresponding to the 203, the assembly end 302 is provided with a pair of connection holes 3〇21 extending in the up and down direction, and the pair of connection holes 3〇21 have different aperture sizes. The circuit board 70 and the back plate 80 are respectively provided with The through hole (not labeled) corresponding to the hole 3〇21. Please refer to the third to fifth figures. 'Assembly, first mount the chip module 5〇 to the insulating body】〇 Then, the flat heat conductive sheet 100 is laid flat and pasted on the wafer module 5〇, and then the holding frame 2〇 is assembled to the insulating body 10, and the holding portion 2〇5 of the holding frame 20 and the insulating body 1 are assembled. The side walls 1〇3 are mutually engaged, the hook portion 204 can be combined with the matching groove 104, the boss 206 will be pressed against the heat conductive sheet 100 (as shown in FIG. 4), and then the elastic buckle piece 30 is placed on the holding frame 20. The protruding post 2〇3 of the holding frame 2 passes through the positioning hole 3011 of the elastic clasp 3〇 to form a positioning, and the elastic clasp 30 passes through the connecting hole provided by the connecting end 3〇2 through the connecting piece 6〇. 7 M349083 3021, the circuit board 70 and the back board 80 are connected to the circuit board through the through holes provided in the grouping holes 3〇21, and the base portion 301 of the % 'elastic buckle piece 30 will be opposite to the main body portion 2 of the holding frame 2〇 1 Applying pressure, the dust force is sequentially transmitted from the holding frame 2〇 to the heat conduction system (4), and the heat dissipation tube 40 is mounted on the holding frame 20, and the heat dissipation tube 4〇 is in contact with the thermal conductive sheet 1〇〇. The above is the process of connecting the elastic clasp 30 to the circuit board 7〇, and the fishing part applied by the holding frame 2〇 is applied to the insulating body K) Just in combination with the groove, thereby preventing the side wall of the catch portion 2_ insufficient latching force from the guide _ Long heteroaryl, where do _ # provision crystal domains in place of the silk. And it is more convenient to assemble. ,
綜上所述，本創作符合新型專利要件，依法提出專利申請。惟，以上所述 者僅為本_實施例，本創作之範上述細_，舉凡孰^ 之人士援依娜之精神所作之等效修飾娜，皆應涵^ 请專利範圍内。 ΓΤ 【圖式簡單說明】 圖； 第一圖為本創作電連接器組合與晶片模; 、電路板以及背板之立體分〕 第-圖為第-圖所示另_個視角之立體分解圖； 弟二圖為將晶片模組組接至絕緣本體後之部分电 第四圖為_馳組合緣本雜之部分組相；’ 體分解圖。 10 承接面 側壁 2圖為摘作電連接驗純裝骂路板之立體組合圖； 弟八圖為第二圖所示絕緣本體與固持框之立彳 【主要元件符號説明 絕緣本體 安裝面 ^ 承接面 肋 103 8 102 M349083 配合槽 104 固持框 20 主體部 201 窗口 202 凸柱 203 鈎部 204 卡持部 205 凸台 206 彈性扣片 30 基部 301 定位孔 3011 組接端 302 組接孔 3021 散熱管 40 晶片模組 50 連接件 60 電路板 70 背板 80 導電端子 90 導熱片 100In summary, the creation complies with the new patent requirements and proposes a patent application according to law. However, the above-mentioned ones are only the present embodiment, and the above-mentioned details of the creation of the _ _ _ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ΓΤ [Simple diagram of the diagram] Figure 1 is the perspective of the creation of the electrical connector assembly and the wafer module; the circuit board and the backplane] - Figure 3 is an exploded perspective view of the other perspective The second picture shows the part of the electric circuit after the wafer module is connected to the insulating body. The fourth picture is the part of the phase of the combination of the merging and the body; 10 The side wall of the bearing surface 2 is a three-dimensional combination diagram of the electrical connection verification and the installation of the road board; the eighth figure is the standing body of the insulating body and the holding frame shown in the second figure [main component symbol indicates the insulating body mounting surface ^ Face rib 103 8 102 M349083 Cooperating groove 104 Holding frame 20 Main body 201 Window 202 Bump 203 Hook 204 Holding portion 205 Stud 206 Elastic clasp 30 Base 301 Positioning hole 3011 Assembly end 302 Assembly hole 3021 Heat pipe 40 Wafer module 50 connector 60 circuit board 70 back plate 80 conductive terminal 90 thermal pad 100