M424526 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種電連接器組件及其散熱系統，尤其涉及 一種可電性連接晶片模組至印刷電路板之電連接器組件 及該電連接器組件之散熱系統。 【先前技術】 [0002] 美國專利公告7, 589, 972號揭示了 一種與本創作相關之 電連接器組件，包括具有多個導電端子之連接器 '安裝 於連接器之晶片模組及一散熱裝置。所述散熱裝置用以 按壓晶片模組，包括一散熱塊及將散熱塊固定在晶片模 組上表面上之扣件。扣件設有一組按壓晶片模組之第一 彈性臂及一組按壓散熱塊之第二彈性臂。 [0003] 然而，該電連接器組件之一個缺陷在於：扣件上向下延 伸之彈性臂可能導致整個電氣連接系統高度較大。此外 ，為了保證對晶片模組和散熱塊施加之力均勻分佈，需 要數量足夠且均勻分佈之第一 '第二彈性臂，由此導致 扣件之結構有點複雜。 [0004] 故，有必要提供一種改進之電連接器組件，以克服相關 技藝之缺陷。 【新型内容】 [0005] 本創作所要解決之技術問題係提供一種整體高度較小之 電連接器組件之散熱系統及電連接器組件。 [0006] 為解決上述技術問題，本創作提供一種電連接器組件， 包括絕緣本體、在絕緣本虹方與之電性觸之晶片模 表單煸號A0101 第3頁/共15頁 M424526 •卫、放置在晶片模組上之散熱裝置及使散熱裝置與晶片 模組保持接觸之扣件，其t所述散熱裝置設有均勾佈置 之彈簧以承載所述扣件。 國本_㈣提供-種電連接器組件之㈣线用於對 ^裝在電連接器上之晶片模組進行散熱，其包括放置在 晶片模組上之設有均勻佈置之彈簧之散熱裝置及置於散 熱裝置上且可按壓彈簧之扣件。 闕與先前技術相比，本創作之電連接器組件及其散熱系統 具有以下優點：散熱裝置上設有承載所述扣件之彈簧， 所述彈簧受壓時變形，由此該散熱系統與電連接器組件 之其他元件組合後，電連接器組件之整體高度較低。 【實施方式】 圆請參考第—圖至第"，本創作之電連接器組件3可電性 連接晶片模組1至電路板2，其包括絕緣本體3〇、保護蓋 31、扣件32、容納有一根散熱管34之承載件33及複數固 定件36 » 圆請參考第四圖和第五圖，保護蓋31之-端設有兩個連接 部310，以枢接在絕緣本體3〇之相對之兩側壁上使保護 蓋31相對於絕緣本體30可以在一開啟位置和閉合也置之 間轉動。保護蓋31之另一端設有一其上設有開口之延長 部312。同時’所述保護蓋31之延長部312之底面上設有 一與前述開口相通之螺紋部314。請參考第二圖，當保護 蓋31處於閉合狀態時，通過一扣持件38來連接螺紋部314 。所述扣持件38之兩端分別設有螺紋及與絕緣本體3〇配 表單編號合^刀刀部380 ’以限制保護蓋31在閉合狀態。承载件33 第4頁/共15頁 及散熱管34位於晶片模組1之上方，扣件32覆蓋在它們之 上方。 [0011] 請參考第四圖，絕緣本體30設有收容晶片模組之收容空 間301。保護蓋31由金屬板衝壓而成且安裝在絕緣本體3〇 上。保護蓋31設有與收容空間301對應之開口 316，使承 载件33能夠和晶片模組1接觸。 [0012] 請參考第五圖和第六圖，扣件32自上方覆蓋承載件33和 絕緣本體3〇。扣件32包括一片狀之延伸板320及一對分另 自延伸板320相對端向下延伸之翼部322。所述翼部322 分別設有一對向下彎折後沿水平延伸之安裝片324，每_ 個安裝片324上設有通孔3240 »延伸板320具有一按壓承 載件33上之彈簧332之平坦底面》 [0013] 請參考第三圖至第五圖，承載件33之上表面均勻設有四 個收容孔330，每一個收容孔330裏面均容納有一個彈簧 332。非工作狀態下，彈簧332之下端收容在收容孔33〇 中’上端延伸出來承載件33之上表面。 [0014] 組裝時，將晶片模組1放入絕緣本體3〇之收容空間3〇1中 同時將承載件33放在晶片模組1上。扣件32覆蓋在承載 件33上方且其平坦底面與彈簧332之上端接觸。由於彈簧 332係均勻分佈之，所以扣件32將能對承載件“及晶片模 組1施以均勻之下壓力。由此，電連接器組件3在晶片模 組1和電路板2之間建立起具備散熱功能之電性連接。 [0015] 請參考第六圖，在扣件32被固定件36固定到電路板2上後 ，彈簧332被壓縮。壓縮後，彈簧332之上端大致與承栽 表單編號A0101 笫5頁/共15頁 M424526 件33之上表面平齊，因此整個電氣系統之高度相對較低 。此外，扣件32利用一具有平坦底面之延伸板320按屋承 載件33及晶片模組1，不需要設置彈性臂，因此結構相對 簡單，成本低。 [0016] 綜上所述，本創作符合新型專利要件，爰依法提出專利 申請。惟，以上所述者僅為本創作之較佳實施方式，本 創作之範圍並不以前述實施方式為限，舉凡熟習本案技 藝之人士援依本創作之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0017] 第一圖係本創作之電連接器組件與電路板組裝在一起之 立體圖； [0018] 第二圖顯示了本創作之電連接器組件之底部狀態； [0019] 第三圖係本創作之電連接器組件部分元件之組裝圖； [0020] 第四圖係第一圖所示組裝體之立體分解圖； [0021] 第五圖係第一圖所示組裝體另外一個角度之立體分解圖 ;及 [0022] 第六圖係沿第一圖中VI-VI線之刮視圖。 【主要元件符號說明】 [0023] 晶片模組：1 [0024] 電路板：2 [0025] 電連接器組件：3 表單编號A0101 第6頁/共15頁 [0026]M4.24526 [0027] [0028] [0029] [0030] [0031] [0032]M424526 V. New Description: [New Technology Field] [0001] The present invention relates to an electrical connector assembly and a heat dissipation system thereof, and more particularly to an electrical connector assembly that electrically connects a wafer module to a printed circuit board and The heat dissipation system of the electrical connector assembly. [Prior Art] [0002] US Patent Publication No. 7,589,972 discloses an electrical connector assembly related to the present invention, including a connector having a plurality of conductive terminals, a chip module mounted on the connector, and a heat sink Device. The heat dissipating device is configured to press the wafer module, and includes a heat dissipating block and a fastener for fixing the heat dissipating block on the upper surface of the wafer module. The fastener is provided with a first elastic arm for pressing the wafer module and a second elastic arm for pressing the heat dissipation block. [0003] However, one drawback of this electrical connector assembly is that the resilient arms extending downwardly on the fastener may result in a greater overall electrical connection system. In addition, in order to ensure a uniform distribution of the force applied to the wafer module and the heat sink block, a sufficient number and uniform distribution of the first 'second elastic arm' is required, resulting in a somewhat complicated structure of the fastener. [0004] Therefore, it would be desirable to provide an improved electrical connector assembly that overcomes the deficiencies of the related art. [New Content] [0005] The technical problem to be solved by the present invention is to provide a heat dissipation system and an electrical connector assembly of an overall low-profile electrical connector assembly. [0006] In order to solve the above technical problem, the present invention provides an electrical connector assembly, including an insulative body, a wafer mold form insulating a rainbow and an electrical contact, A0101, page 3, a total of 15 pages, M424526, a heat dissipating device disposed on the chip module and a fastener for holding the heat dissipating device in contact with the wafer module, wherein the heat dissipating device is provided with a spring arranged to hook the fastener. (4) Providing a (four) line of the electrical connector assembly for dissipating heat from the wafer module mounted on the electrical connector, comprising a heat sink disposed on the wafer module and having a uniformly arranged spring A fastener that is placed on the heat sink and that can press the spring.电 Compared with the prior art, the present electrical connector assembly and its heat dissipation system have the following advantages: the heat sink is provided with a spring carrying the fastener, and the spring is deformed when pressed, thereby the heat dissipation system and the electricity After the other components of the connector assembly are combined, the overall height of the electrical connector assembly is low. [Embodiment] Please refer to the first to the first embodiment of the circle. The electrical connector assembly 3 of the present invention can electrically connect the chip module 1 to the circuit board 2, and includes an insulative housing 3, a protective cover 31, and a fastener 32. The carrier 33 and the plurality of fixing members 36 are accommodated in a heat pipe 34. Please refer to the fourth and fifth figures for the circle. The end of the protective cover 31 is provided with two connecting portions 310 for pivoting to the insulating body 3〇. The opposite side walls allow the protective cover 31 to rotate relative to the insulative housing 30 between an open position and a closed position. The other end of the protective cover 31 is provided with an extension 312 having an opening. At the same time, the bottom surface of the extension portion 312 of the protective cover 31 is provided with a threaded portion 314 which communicates with the opening. Referring to the second figure, when the protective cover 31 is in the closed state, the threaded portion 314 is coupled by a holding member 38. Both ends of the holding member 38 are respectively provided with a thread and a form number is combined with the insulative housing 3 to limit the protective cover 31 in a closed state. The carrier 33 is page 4 of 15 and the heat pipe 34 is located above the wafer module 1 with the fasteners 32 overlying them. [0011] Referring to the fourth figure, the insulative housing 30 is provided with a receiving space 301 for receiving the wafer module. The protective cover 31 is stamped from a metal plate and mounted on the insulative housing 3''. The protective cover 31 is provided with an opening 316 corresponding to the accommodating space 301 so that the carrier member 33 can come into contact with the wafer module 1. [0012] Referring to the fifth and sixth figures, the fastener 32 covers the carrier 33 and the insulative housing 3 from above. The fastener 32 includes a sheet-like extension panel 320 and a pair of wings 322 extending downwardly from opposite ends of the extension panel 320. The wing portions 322 are respectively provided with a pair of downwardly bent and horizontally extending mounting pieces 324, and each of the mounting pieces 324 is provided with a through hole 3240. The extension plate 320 has a flat spring 332 on the pressing carrier 33. [0013] Referring to the third to fifth figures, the upper surface of the carrier 33 is evenly provided with four receiving holes 330, and each of the receiving holes 330 accommodates a spring 332 therein. In the non-operating state, the lower end of the spring 332 is received in the upper end of the receiving hole 33〇 and extends out of the upper surface of the carrier 33. [0014] During assembly, the wafer module 1 is placed in the receiving space 3〇1 of the insulative housing 3 while the carrier 33 is placed on the wafer module 1. The fastener 32 covers the carrier 33 and its flat bottom surface is in contact with the upper end of the spring 332. Since the springs 332 are evenly distributed, the fasteners 32 will be able to apply uniform pressure to the carrier "and the wafer module 1. Thus, the electrical connector assembly 3 is established between the wafer module 1 and the circuit board 2. The electrical connection with the heat dissipation function is provided. [0015] Referring to the sixth figure, after the fastener 32 is fixed to the circuit board 2 by the fixing member 36, the spring 332 is compressed. After compression, the upper end of the spring 332 is substantially loaded with the bearing. Form No. A0101 笫 5 pages / 15 pages M424526 The upper surface of the piece 33 is flush, so the height of the entire electrical system is relatively low. In addition, the fastener 32 utilizes an extension plate 320 having a flat bottom surface to press the house carrier 33 and the wafer. The module 1 does not need to be provided with a resilient arm, so the structure is relatively simple and the cost is low. [0016] In summary, the creation complies with the new patent requirements, and the patent application is filed according to law. However, the above is only the creation of the patent. In the preferred embodiment, the scope of the present invention is not limited to the foregoing embodiments, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0017] The first figure is a perspective view of the assembled electrical connector assembly and the circuit board; [0018] The second figure shows the bottom state of the electrical connector assembly of the present invention; [0019] The third figure is an assembled view of some components of the electrical connector assembly of the present invention; [0020] The fourth figure is an exploded perspective view of the assembly shown in the first figure; [0021] The fifth figure is the assembly shown in the first figure A perspective view of another angle; and [0022] The sixth figure is a view along the VI-VI line in the first figure. [Main component symbol description] [0023] Wafer module: 1 [0024] Circuit board: 2 [0025] Electrical Connector Assembly: 3 Form No. A0101 Page 6 of 15 [0026] M4.24526 [0027] [0029] [0032] [0032]
[0033] [0034] [0035] [0036] [0037] [0038][0038] [0038] [0038] [0038]
[0039] [0040] [0041] [0042] [0043] [0044] 絕緣本體：30 收容空間：301 保護蓋：31 連接部：310 延長部：312 螺紋部：314 開口 ： 316 扣件：32 延伸板：320 翼部：322 安裝片：324 通孔：3240 承載件：33 收容孔：330 彈簧：332 散熱管：34 固定件：36 扣持件：38 刀刃部：3 8 0 表單編號A0101 第7頁/共15頁[0044] [0044] [0044] Insulating body: 30 receiving space: 301 protective cover: 31 connecting portion: 310 extension: 312 threaded portion: 314 opening: 316 fastener: 32 extension Plate: 320 Wing: 322 Mounting piece: 324 Through hole: 3240 Carrier: 33 Housing hole: 330 Spring: 332 Heat pipe: 34 Fixing member: 36 Fastening member: 38 Blade: 3 8 0 Form number A0101 No. 7 Page / Total 15 pages