JPWO2019215805A1 - 締結構造体および締結構造体を用いた電力変換装置 - Google Patents
締結構造体および締結構造体を用いた電力変換装置 Download PDFInfo
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- JPWO2019215805A1 JPWO2019215805A1 JP2020517649A JP2020517649A JPWO2019215805A1 JP WO2019215805 A1 JPWO2019215805 A1 JP WO2019215805A1 JP 2020517649 A JP2020517649 A JP 2020517649A JP 2020517649 A JP2020517649 A JP 2020517649A JP WO2019215805 A1 JPWO2019215805 A1 JP WO2019215805A1
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- Prior art keywords
- shaped spring
- fastening structure
- spring member
- hole
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/641—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
図1は実施の形態1による締結構造体を示す分解斜視図である。図2は実施の形態1による締結構造体における押え用板状ばね部材を被固定部材側から見た正面図である。
図3は実施の形態2による締結構造体の要部を示す要部拡大斜視図である。図4は実施の形態2による締結構造体を示す側面図である。図5は実施の形態2による締結構造体を示す斜視図である
図6は実施の形態3による締結構造体の要部を示す要部拡大側面図である。図7は実施の形態3による締結構造体の要部を下方向から見た図である。
従って、例示されていない無数の変形例が、本願明細書に開示される技術の範囲内において想定される。例えば、少なくとも1つの構成要素を変形する場合、追加する場合または省略する場合、さらには、少なくとも1つの構成要素を抽出し、他の実施の形態の構成要素と組み合わせる場合が含まれるものとする。
Claims (10)
- 一方側に被固定部材が載置される被締結部材と、前記被固定部材の反被締結部材側に配置される押え用板状ばね部材と、前記押え用板状ばね部材の長手方向中心部の端部外方に伸張するとともに貫通穴が形成された支持体と、前記支持体に設けられ、前記被締結部材側に折曲された支柱体と、前記被締結部材に設けられ、前記支持体の前記貫通穴の位置と同一軸心状に配置された固定用ねじ穴と、前記支持体の前記貫通穴に挿通され、前記固定用ねじ穴に螺着された固定用ねじとを備えたことを特徴とする締結構造体。
- 前記支柱体は、前記支持体の前記貫通穴の周囲に配置され、折曲された先端部は前記被締結部材に当接されることを特徴とする請求項1に記載の締結構造体。
- 前記押え用板状ばね部材の前記支持体は、前記被締結部材との位置決めを行う位置決め用突起体が設けられ、前記被締結部材に前記位置決め用突起体が係合する係合穴が設けられることを特徴とする請求項1または請求項2に記載の締結構造体。
- 前記押え用板状ばね部材は、前記押え用板状ばね部材の反被固定部材側に前記押え用板状ばね部材の長手方向中心部の端部間に凸形状のリブが設けられていることを特徴とする請求項1から請求項3のいずれか1項に記載の締結構造体。
- 前記押え用板状ばね部材は、ステンレス材で構成されていることを特徴とする請求項1から請求項4のいずれか1項に記載の締結構造体。
- 前記被固定部材は、長手方向に直列に複数配置され、前記押え用板状ばね部材と前記支持体は、長手方向に直列に複数配置されることを特徴とする請求項1に記載の締結構造体。
- 前記押え用板状ばね部材および前記支持体は長手方向に直列に一体化されていることを特徴とする請求項6に記載の締結構造体。
- 前記被固定部材は、半導体素子が樹脂封止された半導体モジュールであることを特徴とする請求項1から請求項7のいずれか1項に記載の締結構造体。
- 前記被締結部材は、ヒートシンクであることを特徴とする請求項1から請求項8のいずれか1項に記載の締結構造体。
- 請求項1から請求項9のいずれか1項に記載の締結構造体を用いることを特徴とする電力変換装置。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/017729 WO2019215805A1 (ja) | 2018-05-08 | 2018-05-08 | 締結構造体および締結構造体を用いた電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2019215805A1 true JPWO2019215805A1 (ja) | 2021-01-14 |
| JP6873324B2 JP6873324B2 (ja) | 2021-05-19 |
Family
ID=68467860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020517649A Active JP6873324B2 (ja) | 2018-05-08 | 2018-05-08 | 締結構造体および締結構造体を用いた電力変換装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11430713B2 (ja) |
| JP (1) | JP6873324B2 (ja) |
| CN (1) | CN112074948B (ja) |
| DE (1) | DE112018007572T5 (ja) |
| WO (1) | WO2019215805A1 (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7392430B2 (ja) * | 2019-11-29 | 2023-12-06 | Tdk株式会社 | 支持構造、及び支持具のセット |
| CN111225544B (zh) * | 2019-12-06 | 2021-11-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | 用于电子元件的散热装置 |
| BR112022019235A2 (pt) * | 2020-04-01 | 2022-11-16 | Atlas Copco Wuxi Compressor Co Ltd | Unidade de potência |
| US12020972B2 (en) * | 2020-04-29 | 2024-06-25 | Semiconductor Components Industries, Llc | Curved semiconductor die systems and related methods |
| DE102020209923B3 (de) | 2020-08-06 | 2022-01-20 | Vitesco Technologies GmbH | Schaltungsträgeranordnung und Verfahren zum Herstellen einer solchen Schaltungsträgeranordnung |
| JP7452373B2 (ja) * | 2020-10-19 | 2024-03-19 | 株式会社デンソー | 電力変換装置 |
| JP7567696B2 (ja) * | 2021-07-08 | 2024-10-16 | 株式会社豊田自動織機 | 電動圧縮機 |
| TWI800392B (zh) * | 2022-05-31 | 2023-04-21 | 大陸商深圳興奇宏科技有限公司 | 散熱座均力結構 |
| WO2024070581A1 (ja) * | 2022-09-26 | 2024-04-04 | ローム株式会社 | 電力変換ユニット |
| DE102023123648A1 (de) | 2023-09-01 | 2025-03-06 | Valeo Eautomotive Germany Gmbh | Schaltzelle mit einer zusätzlichen Halterung |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61144692U (ja) * | 1985-02-28 | 1986-09-06 | ||
| JPH01145193U (ja) * | 1988-03-28 | 1989-10-05 | ||
| JPH02104697U (ja) * | 1989-02-07 | 1990-08-20 | ||
| JPH0511451U (ja) * | 1991-07-19 | 1993-02-12 | 菊水電子工業株式会社 | 強制空冷形放熱器 |
| JP2001284850A (ja) * | 2000-03-31 | 2001-10-12 | Densei Lambda Kk | 電子部品固定構造及び電子部品固定具 |
| JP2004087552A (ja) * | 2002-08-23 | 2004-03-18 | Mitsubishi Electric Corp | 半導体装置 |
| JP2013074138A (ja) * | 2011-09-28 | 2013-04-22 | Keihin Corp | 半導体制御装置 |
| JP2016063200A (ja) * | 2014-09-22 | 2016-04-25 | Tdk株式会社 | 基板実装構造及び電源装置 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4845590A (en) * | 1987-11-02 | 1989-07-04 | Chrysler Motors Corporation | Heat sink for electrical components |
| US6816375B2 (en) * | 2001-08-03 | 2004-11-09 | Texas Instruments Incorporated | Heat sink attachment |
| US6449157B1 (en) * | 2001-10-03 | 2002-09-10 | Ho Kang Chu | IC package assembly with retention mechanism |
| US6639800B1 (en) | 2002-04-30 | 2003-10-28 | Advanced Micro Devices, Inc. | Heat sink subassembly |
| EP1508916B1 (en) * | 2003-08-07 | 2008-03-05 | Harman Becker Automotive Systems GmbH | Apparatus for cooling semiconductor devices attached to a printed circuit board |
| JP3914209B2 (ja) | 2004-02-19 | 2007-05-16 | 三菱電機株式会社 | 半導体装置 |
| US7605962B2 (en) * | 2004-03-19 | 2009-10-20 | Thomson | Video processor alignment clamping |
| US7274572B2 (en) * | 2005-04-26 | 2007-09-25 | Inventec Corporation | Supporting plate |
| JP5014016B2 (ja) * | 2007-08-08 | 2012-08-29 | 三菱電機株式会社 | 半導体装置 |
| TWM349083U (en) | 2008-06-10 | 2009-01-11 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly |
| DE112009004614B4 (de) * | 2009-03-31 | 2013-10-02 | Mitsubishi Electric Corp. | Plattenbefestigungsstruktur |
| JP5585071B2 (ja) * | 2009-12-18 | 2014-09-10 | 富士通株式会社 | 電子装置及びその製造方法 |
| JP2012182224A (ja) * | 2011-02-28 | 2012-09-20 | Tdk Corp | 電子部品の固定用ばね具及び放熱構造体 |
| JP5944643B2 (ja) * | 2011-09-28 | 2016-07-05 | グローバルウェーハズ・ジャパン株式会社 | シリコンウェーハの熱処理方法 |
| KR200484015Y1 (ko) * | 2013-09-12 | 2017-07-20 | 엘에스산전 주식회사 | 전력 변환 장치 |
| JP5954305B2 (ja) | 2013-12-17 | 2016-07-20 | Tdk株式会社 | 固定金具 |
| US9848517B2 (en) * | 2014-05-22 | 2017-12-19 | Saint Regis Mohawk Tribe | System and method for thermally coupling memory devices to a memory controller in a computer memory board |
| TWI566345B (zh) | 2014-09-05 | 2017-01-11 | 台達電子工業股份有限公司 | 用於夾持電子元件的夾具 |
| DE102015202142A1 (de) * | 2015-02-06 | 2016-08-11 | Mahle International Gmbh | Elektrische Einrichtung |
| DE102015202300A1 (de) * | 2015-02-10 | 2016-08-11 | Robert Bosch Gmbh | Wärmetransferblech |
| JP6633433B2 (ja) * | 2016-03-16 | 2020-01-22 | 京セラ株式会社 | 電力変換装置 |
| US10126127B2 (en) * | 2016-04-29 | 2018-11-13 | Microsoft Technology Licensing, Llc | Athermalized mounting of inertial measurement unit |
| US10772190B2 (en) * | 2017-09-29 | 2020-09-08 | Apple Inc. | Heat-removal assemblies with opposing springs |
-
2018
- 2018-05-08 US US16/960,794 patent/US11430713B2/en active Active
- 2018-05-08 CN CN201880093097.1A patent/CN112074948B/zh active Active
- 2018-05-08 DE DE112018007572.9T patent/DE112018007572T5/de active Pending
- 2018-05-08 WO PCT/JP2018/017729 patent/WO2019215805A1/ja not_active Ceased
- 2018-05-08 JP JP2020517649A patent/JP6873324B2/ja active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61144692U (ja) * | 1985-02-28 | 1986-09-06 | ||
| JPH01145193U (ja) * | 1988-03-28 | 1989-10-05 | ||
| JPH02104697U (ja) * | 1989-02-07 | 1990-08-20 | ||
| JPH0511451U (ja) * | 1991-07-19 | 1993-02-12 | 菊水電子工業株式会社 | 強制空冷形放熱器 |
| JP2001284850A (ja) * | 2000-03-31 | 2001-10-12 | Densei Lambda Kk | 電子部品固定構造及び電子部品固定具 |
| JP2004087552A (ja) * | 2002-08-23 | 2004-03-18 | Mitsubishi Electric Corp | 半導体装置 |
| JP2013074138A (ja) * | 2011-09-28 | 2013-04-22 | Keihin Corp | 半導体制御装置 |
| JP2016063200A (ja) * | 2014-09-22 | 2016-04-25 | Tdk株式会社 | 基板実装構造及び電源装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20210066161A1 (en) | 2021-03-04 |
| DE112018007572T5 (de) | 2021-01-21 |
| CN112074948B (zh) | 2024-09-24 |
| WO2019215805A1 (ja) | 2019-11-14 |
| JP6873324B2 (ja) | 2021-05-19 |
| CN112074948A (zh) | 2020-12-11 |
| US11430713B2 (en) | 2022-08-30 |
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