JP6847208B2 - カメラモジュール検査装置 - Google Patents
カメラモジュール検査装置 Download PDFInfo
- Publication number
- JP6847208B2 JP6847208B2 JP2019519270A JP2019519270A JP6847208B2 JP 6847208 B2 JP6847208 B2 JP 6847208B2 JP 2019519270 A JP2019519270 A JP 2019519270A JP 2019519270 A JP2019519270 A JP 2019519270A JP 6847208 B2 JP6847208 B2 JP 6847208B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- camera module
- grounding
- signal
- conductive block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007689 inspection Methods 0.000 title claims description 41
- 239000000523 sample Substances 0.000 claims description 92
- 230000004888 barrier function Effects 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2016-0160670 | 2016-11-29 | ||
KR1020160160670A KR101906575B1 (ko) | 2016-11-29 | 2016-11-29 | 카메라모듈 검사장치 |
PCT/KR2017/013411 WO2018101674A1 (en) | 2016-11-29 | 2017-11-23 | Camera module test device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019537707A JP2019537707A (ja) | 2019-12-26 |
JP6847208B2 true JP6847208B2 (ja) | 2021-03-31 |
Family
ID=62242517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019519270A Active JP6847208B2 (ja) | 2016-11-29 | 2017-11-23 | カメラモジュール検査装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6847208B2 (zh) |
KR (1) | KR101906575B1 (zh) |
CN (1) | CN109983769B (zh) |
TW (1) | TWI644110B (zh) |
WO (1) | WO2018101674A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112213533A (zh) * | 2019-07-10 | 2021-01-12 | 三赢科技(深圳)有限公司 | 针座结构及采用该针座结构的测试治具 |
KR20230052081A (ko) | 2021-10-12 | 2023-04-19 | 김광일 | 보이스 코일 모터를 포함한 카메라 모듈 테스트용 소켓 장치 |
CN115190233B (zh) * | 2022-08-15 | 2024-05-28 | 维沃移动通信有限公司 | 摄像头模组和电子设备 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1482313B1 (en) * | 2002-02-07 | 2007-11-21 | Yokowo Co., Ltd | Capacity load type probe, and test jig using the same |
JP4242199B2 (ja) * | 2003-04-25 | 2009-03-18 | 株式会社ヨコオ | Icソケット |
US20060066328A1 (en) * | 2004-09-30 | 2006-03-30 | Probelogic, Inc. | Buckling beam probe test assembly |
WO2006062911A1 (en) * | 2004-12-08 | 2006-06-15 | K & S Interconnect, Inc. | Test socket and method for making |
TWI323503B (en) * | 2005-12-12 | 2010-04-11 | Optopac Co Ltd | Apparatus, unit and method for testing image sensor packages |
JP2008070146A (ja) * | 2006-09-12 | 2008-03-27 | Yokowo Co Ltd | 検査用ソケット |
CN101221194B (zh) * | 2007-01-09 | 2011-11-16 | 旺矽科技股份有限公司 | 高频探针 |
WO2009001731A1 (ja) * | 2007-06-22 | 2008-12-31 | Nhk Spring Co., Ltd. | 導電性接触子ホルダおよび導電性接触子ユニット |
TWI372248B (en) * | 2008-08-21 | 2012-09-11 | King Yuan Electronics Co Ltd | A pogo tower and fabrication method thereof |
US7740508B2 (en) * | 2008-09-08 | 2010-06-22 | 3M Innovative Properties Company | Probe block assembly |
JP2010175371A (ja) * | 2009-01-29 | 2010-08-12 | Yokowo Co Ltd | 検査ソケット |
KR20100095142A (ko) * | 2009-02-20 | 2010-08-30 | 리노공업주식회사 | 검사용 소켓 |
JP2010243303A (ja) * | 2009-04-04 | 2010-10-28 | Advanced Systems Japan Inc | 低熱膨張インターポーザ |
CN101865938A (zh) * | 2009-04-14 | 2010-10-20 | 南茂科技股份有限公司 | 探针卡组件及其中的探针座 |
KR100985500B1 (ko) * | 2009-08-17 | 2010-10-26 | 리노공업주식회사 | 검사용 소켓 |
JP2011086453A (ja) * | 2009-10-14 | 2011-04-28 | Unitechno Inc | 高周波検査ソケット |
JP5788767B2 (ja) * | 2011-11-07 | 2015-10-07 | 株式会社日本マイクロニクス | プローブブロックとそれを備えるプローブカード並びにプローブ装置 |
KR101703688B1 (ko) * | 2012-05-02 | 2017-02-07 | 리노공업주식회사 | 테스트 소켓 |
KR101534778B1 (ko) * | 2014-01-24 | 2015-07-09 | 리노공업주식회사 | 검사장치 |
KR101552552B1 (ko) * | 2014-08-22 | 2015-09-14 | 리노공업주식회사 | 테스트 소켓 |
TWM514004U (zh) * | 2015-07-30 | 2015-12-11 | Cheng Yun Technology Co Ltd | 積體電路的檢測裝置及檢測設備 |
-
2016
- 2016-11-29 KR KR1020160160670A patent/KR101906575B1/ko active IP Right Grant
-
2017
- 2017-08-03 TW TW106126156A patent/TWI644110B/zh active
- 2017-11-23 CN CN201780070606.4A patent/CN109983769B/zh active Active
- 2017-11-23 WO PCT/KR2017/013411 patent/WO2018101674A1/en active Application Filing
- 2017-11-23 JP JP2019519270A patent/JP6847208B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN109983769A (zh) | 2019-07-05 |
JP2019537707A (ja) | 2019-12-26 |
KR20180060781A (ko) | 2018-06-07 |
WO2018101674A1 (en) | 2018-06-07 |
TW201819942A (zh) | 2018-06-01 |
CN109983769B (zh) | 2020-12-29 |
TWI644110B (zh) | 2018-12-11 |
KR101906575B1 (ko) | 2018-10-11 |
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