WO2009001731A1 - 導電性接触子ホルダおよび導電性接触子ユニット - Google Patents

導電性接触子ホルダおよび導電性接触子ユニット Download PDF

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Publication number
WO2009001731A1
WO2009001731A1 PCT/JP2008/061157 JP2008061157W WO2009001731A1 WO 2009001731 A1 WO2009001731 A1 WO 2009001731A1 JP 2008061157 W JP2008061157 W JP 2008061157W WO 2009001731 A1 WO2009001731 A1 WO 2009001731A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive contact
conductive
holder
insulating
opposite ends
Prior art date
Application number
PCT/JP2008/061157
Other languages
English (en)
French (fr)
Inventor
Hiroshi Nakayama
Kohei Hironaka
Mitsuhiro Kondo
Osamu Ito
Takashi Sudo
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to JP2009520518A priority Critical patent/JP5193200B2/ja
Publication of WO2009001731A1 publication Critical patent/WO2009001731A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

　伝送信号のロスが少なく、電気特性に優れた導電性接触子ホルダおよび導電性接触子ユニットを提供する。この目的のため、絶縁性材料によって形成され、異なる回路構造間の電気信号の入出力を行う導電性接触子を、両端部を除く略全長にわたって挿通した状態で保持する絶縁性ホルダ部材と、略柱状をなす導電性材料によって形成され、絶縁性ホルダ部材によって保持される導電性ブロック部材と、を備え、導電性ブロック部材は、互いに相反する二つの表面が、絶縁性ホルダ部材の表面のうち導電性接触子の両端部を突出させる表面から露出している。
PCT/JP2008/061157 2007-06-22 2008-06-18 導電性接触子ホルダおよび導電性接触子ユニット WO2009001731A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009520518A JP5193200B2 (ja) 2007-06-22 2008-06-18 導電性接触子ホルダおよび導電性接触子ユニット

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007165396 2007-06-22
JP2007-165396 2007-06-22

Publications (1)

Publication Number Publication Date
WO2009001731A1 true WO2009001731A1 (ja) 2008-12-31

Family

ID=40185550

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061157 WO2009001731A1 (ja) 2007-06-22 2008-06-18 導電性接触子ホルダおよび導電性接触子ユニット

Country Status (3)

Country Link
JP (1) JP5193200B2 (ja)
TW (1) TWI368742B (ja)
WO (1) WO2009001731A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151252A (ja) * 2011-01-18 2012-08-09 Fujitsu Ltd 接続部品
JP2012173003A (ja) * 2011-02-17 2012-09-10 Ueno Seiki Kk 電子部品測定装置
US20180196096A1 (en) * 2015-09-10 2018-07-12 Leeno Industrial Inc. Probe socket
WO2019049482A1 (ja) * 2017-09-08 2019-03-14 株式会社エンプラス 電気接続用ソケット
JP2019537707A (ja) * 2016-11-29 2019-12-26 リーノ インダストリアル インコーポレイテッド カメラモジュール検査装置
WO2023228830A1 (ja) * 2022-05-27 2023-11-30 株式会社ヨコオ 検査装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9772373B2 (en) * 2014-03-25 2017-09-26 Advantest Corporation Handler apparatus, device holder, and test apparatus
US9645172B2 (en) 2014-10-10 2017-05-09 Samtec, Inc. Cable assembly
KR101882209B1 (ko) * 2016-03-23 2018-07-27 리노공업주식회사 동축 테스트소켓 조립체
KR101975836B1 (ko) * 2017-08-11 2019-08-28 리노공업주식회사 검사장치
TWI646335B (zh) * 2018-05-10 2019-01-01 中華精測科技股份有限公司 導位板及其製造方法和具有該導位板之探針頭

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328149A (ja) * 2001-04-27 2002-11-15 Sony Corp Ｉｃソケット
JP2005127794A (ja) * 2003-10-22 2005-05-19 Murata Mfg Co Ltd 電子部品の測定治具及び電子部品の測定方法
JP2005337904A (ja) * 2004-05-27 2005-12-08 New Japan Radio Co Ltd 半導体装置特性測定用治具および半導体装置特性測定方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005049163A (ja) * 2003-07-31 2005-02-24 Yokowo Co Ltd 高周波・高速用デバイスの検査治具および検査用プローブ
JP4689196B2 (ja) * 2003-11-05 2011-05-25 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002328149A (ja) * 2001-04-27 2002-11-15 Sony Corp Ｉｃソケット
JP2005127794A (ja) * 2003-10-22 2005-05-19 Murata Mfg Co Ltd 電子部品の測定治具及び電子部品の測定方法
JP2005337904A (ja) * 2004-05-27 2005-12-08 New Japan Radio Co Ltd 半導体装置特性測定用治具および半導体装置特性測定方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151252A (ja) * 2011-01-18 2012-08-09 Fujitsu Ltd 接続部品
JP2012173003A (ja) * 2011-02-17 2012-09-10 Ueno Seiki Kk 電子部品測定装置
US10884047B2 (en) * 2015-09-10 2021-01-05 Leeno Industrial Inc. Probe socket
JP2018529951A (ja) * 2015-09-10 2018-10-11 リーノ インダストリアル インコーポレイテッド プローブソケット
US20180196096A1 (en) * 2015-09-10 2018-07-12 Leeno Industrial Inc. Probe socket
JP2019537707A (ja) * 2016-11-29 2019-12-26 リーノ インダストリアル インコーポレイテッド カメラモジュール検査装置
WO2019049482A1 (ja) * 2017-09-08 2019-03-14 株式会社エンプラス 電気接続用ソケット
WO2019049481A1 (ja) * 2017-09-08 2019-03-14 株式会社エンプラス 電気接続用ソケット
JPWO2019049482A1 (ja) * 2017-09-08 2020-10-22 株式会社エンプラス 電気接続用ソケット
JPWO2019049481A1 (ja) * 2017-09-08 2020-10-22 株式会社エンプラス 電気接続用ソケット
JP7125407B2 (ja) 2017-09-08 2022-08-24 株式会社エンプラス 電気接続用ソケット
JP7125408B2 (ja) 2017-09-08 2022-08-24 株式会社エンプラス 電気接続用ソケット
WO2023228830A1 (ja) * 2022-05-27 2023-11-30 株式会社ヨコオ 検査装置

Also Published As

Publication number Publication date
JP5193200B2 (ja) 2013-05-08
TW200902985A (en) 2009-01-16
JPWO2009001731A1 (ja) 2010-08-26
TWI368742B (en) 2012-07-21

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