JP6717700B2 - 表示装置の製造方法 - Google Patents

表示装置の製造方法 Download PDF

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Publication number
JP6717700B2
JP6717700B2 JP2016148487A JP2016148487A JP6717700B2 JP 6717700 B2 JP6717700 B2 JP 6717700B2 JP 2016148487 A JP2016148487 A JP 2016148487A JP 2016148487 A JP2016148487 A JP 2016148487A JP 6717700 B2 JP6717700 B2 JP 6717700B2
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Japan
Prior art keywords
insulating film
region
display device
film
manufacturing
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Application number
JP2016148487A
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English (en)
Japanese (ja)
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JP2018018702A (ja
JP2018018702A5 (enExample
Inventor
松澤　興明
興明 松澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2016148487A priority Critical patent/JP6717700B2/ja
Priority to TW106115257A priority patent/TWI659527B/zh
Priority to KR1020170064616A priority patent/KR101908230B1/ko
Priority to CN201710391404.1A priority patent/CN107665957B/zh
Priority to US15/632,485 priority patent/US9941491B2/en
Publication of JP2018018702A publication Critical patent/JP2018018702A/ja
Publication of JP2018018702A5 publication Critical patent/JP2018018702A5/ja
Application granted granted Critical
Publication of JP6717700B2 publication Critical patent/JP6717700B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
JP2016148487A 2016-07-28 2016-07-28 表示装置の製造方法 Active JP6717700B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016148487A JP6717700B2 (ja) 2016-07-28 2016-07-28 表示装置の製造方法
TW106115257A TWI659527B (zh) 2016-07-28 2017-05-09 顯示裝置之製造方法
KR1020170064616A KR101908230B1 (ko) 2016-07-28 2017-05-25 표시 장치의 제조 방법
CN201710391404.1A CN107665957B (zh) 2016-07-28 2017-05-27 显示装置的制造方法
US15/632,485 US9941491B2 (en) 2016-07-28 2017-06-26 Method of manufacturing display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016148487A JP6717700B2 (ja) 2016-07-28 2016-07-28 表示装置の製造方法

Publications (3)

Publication Number Publication Date
JP2018018702A JP2018018702A (ja) 2018-02-01
JP2018018702A5 JP2018018702A5 (enExample) 2019-06-20
JP6717700B2 true JP6717700B2 (ja) 2020-07-01

Family

ID=61010625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016148487A Active JP6717700B2 (ja) 2016-07-28 2016-07-28 表示装置の製造方法

Country Status (5)

Country Link
US (1) US9941491B2 (enExample)
JP (1) JP6717700B2 (enExample)
KR (1) KR101908230B1 (enExample)
CN (1) CN107665957B (enExample)
TW (1) TWI659527B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019167270A1 (ja) * 2018-03-02 2019-09-06 シャープ株式会社 表示装置及びその製造方法
US20220181582A1 (en) * 2019-03-28 2022-06-09 Sharp Kabushiki Kaisha Display device, and method for manufacturing display device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5985740A (en) * 1996-01-19 1999-11-16 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including reduction of a catalyst
US6465287B1 (en) * 1996-01-27 2002-10-15 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device using a metal catalyst and high temperature crystallization
US6312979B1 (en) * 1998-04-28 2001-11-06 Lg.Philips Lcd Co., Ltd. Method of crystallizing an amorphous silicon layer
US7109653B2 (en) 2002-01-15 2006-09-19 Seiko Epson Corporation Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
JP4656916B2 (ja) * 2003-11-14 2011-03-23 株式会社半導体エネルギー研究所 発光装置の作製方法
US7612498B2 (en) * 2003-11-27 2009-11-03 Toshiba Matsushita Display Technology Co., Ltd. Display element, optical device, and optical device manufacturing method
US7732334B2 (en) * 2004-08-23 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5025107B2 (ja) * 2004-08-23 2012-09-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4865999B2 (ja) * 2004-11-19 2012-02-01 株式会社日立製作所 電界効果トランジスタの作製方法
TWI396464B (zh) * 2007-01-22 2013-05-11 Innolux Corp 有機電致發光顯示裝置及其製作方法
JP2009196318A (ja) * 2008-02-25 2009-09-03 Fujifilm Corp 積層体とバリア性フィルム基板の製造方法、バリア材料、デバイスおよび光学部材
JP5424738B2 (ja) * 2009-06-23 2014-02-26 キヤノン株式会社 表示装置
JP2011018686A (ja) * 2009-07-07 2011-01-27 Hitachi Displays Ltd 有機ｅｌ表示装置
JP2011210544A (ja) * 2010-03-30 2011-10-20 Canon Inc 有機発光装置及びその製造方法
JP3195992U (ja) * 2011-06-17 2015-02-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｏｌｅｄ処理のためのｃｖｄマスクアライメント
JP5971679B2 (ja) * 2011-11-21 2016-08-17 株式会社ジャパンディスプレイ 液晶表示装置
KR101948173B1 (ko) * 2012-11-29 2019-02-14 엘지디스플레이 주식회사 유기전계발광 표시소자
CN105514298B (zh) * 2015-12-31 2018-12-18 固安翌光科技有限公司 一种薄膜封装结构及薄膜封装方法

Also Published As

Publication number Publication date
CN107665957A (zh) 2018-02-06
US9941491B2 (en) 2018-04-10
JP2018018702A (ja) 2018-02-01
US20180034008A1 (en) 2018-02-01
TW201816997A (zh) 2018-05-01
CN107665957B (zh) 2019-07-09
KR101908230B1 (ko) 2018-10-15
KR20180013698A (ko) 2018-02-07
TWI659527B (zh) 2019-05-11

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