KR101908230B1 - 표시 장치의 제조 방법 - Google Patents

표시 장치의 제조 방법 Download PDF

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Publication number
KR101908230B1
KR101908230B1 KR1020170064616A KR20170064616A KR101908230B1 KR 101908230 B1 KR101908230 B1 KR 101908230B1 KR 1020170064616 A KR1020170064616 A KR 1020170064616A KR 20170064616 A KR20170064616 A KR 20170064616A KR 101908230 B1 KR101908230 B1 KR 101908230B1
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South Korea
Prior art keywords
insulating film
region
film
display device
organic molecules
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KR1020170064616A
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English (en)
Korean (ko)
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KR20180013698A (ko
Inventor
고메이 마쯔자와
Original Assignee
가부시키가이샤 재팬 디스프레이
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Publication of KR20180013698A publication Critical patent/KR20180013698A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H01L51/5253—
    • H01L27/3244—
    • H01L51/5246—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020170064616A 2016-07-28 2017-05-25 표시 장치의 제조 방법 Active KR101908230B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-148487 2016-07-28
JP2016148487A JP6717700B2 (ja) 2016-07-28 2016-07-28 表示装置の製造方法

Publications (2)

Publication Number Publication Date
KR20180013698A KR20180013698A (ko) 2018-02-07
KR101908230B1 true KR101908230B1 (ko) 2018-10-15

Family

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Application Number Title Priority Date Filing Date
KR1020170064616A Active KR101908230B1 (ko) 2016-07-28 2017-05-25 표시 장치의 제조 방법

Country Status (5)

Country Link
US (1) US9941491B2 (enExample)
JP (1) JP6717700B2 (enExample)
KR (1) KR101908230B1 (enExample)
CN (1) CN107665957B (enExample)
TW (1) TWI659527B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11417862B2 (en) * 2018-03-02 2022-08-16 Sharp Kabushiki Kaisha Display device including lead wiring lines covered by first and second organic films, and production method therefor
US20220181582A1 (en) * 2019-03-28 2022-06-09 Sharp Kabushiki Kaisha Display device, and method for manufacturing display device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196318A (ja) * 2008-02-25 2009-09-03 Fujifilm Corp 積層体とバリア性フィルム基板の製造方法、バリア材料、デバイスおよび光学部材

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
US5985740A (en) * 1996-01-19 1999-11-16 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including reduction of a catalyst
US6465287B1 (en) * 1996-01-27 2002-10-15 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device using a metal catalyst and high temperature crystallization
US6312979B1 (en) * 1998-04-28 2001-11-06 Lg.Philips Lcd Co., Ltd. Method of crystallizing an amorphous silicon layer
US7109653B2 (en) 2002-01-15 2006-09-19 Seiko Epson Corporation Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
JP4656916B2 (ja) * 2003-11-14 2011-03-23 株式会社半導体エネルギー研究所 発光装置の作製方法
US7612498B2 (en) * 2003-11-27 2009-11-03 Toshiba Matsushita Display Technology Co., Ltd. Display element, optical device, and optical device manufacturing method
US7732334B2 (en) * 2004-08-23 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5025107B2 (ja) * 2004-08-23 2012-09-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4865999B2 (ja) * 2004-11-19 2012-02-01 株式会社日立製作所 電界効果トランジスタの作製方法
TWI396464B (zh) * 2007-01-22 2013-05-11 Innolux Corp 有機電致發光顯示裝置及其製作方法
JP5424738B2 (ja) * 2009-06-23 2014-02-26 キヤノン株式会社 表示装置
JP2011018686A (ja) * 2009-07-07 2011-01-27 Hitachi Displays Ltd 有機ｅｌ表示装置
JP2011210544A (ja) * 2010-03-30 2011-10-20 Canon Inc 有機発光装置及びその製造方法
JP3195992U (ja) * 2011-06-17 2015-02-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｏｌｅｄ処理のためのｃｖｄマスクアライメント
JP5971679B2 (ja) * 2011-11-21 2016-08-17 株式会社ジャパンディスプレイ 液晶表示装置
KR101948173B1 (ko) * 2012-11-29 2019-02-14 엘지디스플레이 주식회사 유기전계발광 표시소자
CN105514298B (zh) * 2015-12-31 2018-12-18 固安翌光科技有限公司 一种薄膜封装结构及薄膜封装方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196318A (ja) * 2008-02-25 2009-09-03 Fujifilm Corp 積層体とバリア性フィルム基板の製造方法、バリア材料、デバイスおよび光学部材

Also Published As

Publication number Publication date
KR20180013698A (ko) 2018-02-07
US9941491B2 (en) 2018-04-10
JP6717700B2 (ja) 2020-07-01
TW201816997A (zh) 2018-05-01
CN107665957A (zh) 2018-02-06
US20180034008A1 (en) 2018-02-01
CN107665957B (zh) 2019-07-09
JP2018018702A (ja) 2018-02-01
TWI659527B (zh) 2019-05-11

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