JP2018006115A - 表示装置 - Google Patents
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
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- H10K77/10—Substrates, e.g. flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
【解決手段】本発明の一実施形態における表示装置は、絶縁表面上に形成された画素電極をそれぞれ有する複数の画素がマトリクス状に配置された表示領域を有する表示装置であって、前記画素電極の端部を覆うバンクと、前記画素電極における発光領域を覆う発光層を含む有機層と、前記有機層及び前記バンク上に設けられた対向電極と、前記対向電極上に設けられた第1無機絶縁層と、隣接する2つの前記発光領域の間で、前記対向電極及び前記第1無機絶縁層が不連続となる領域と、を有する。
【選択図】図3
Description
図1は、本発明の一実施形態に係る有機EL表示装置100の構成を示した概略図であり、有機EL表示装置100を平面視した場合における概略構成を示している。本明細書では、有機EL表示装置100を画面(表示領域)に垂直な方向から見た様子を「平面視」と呼ぶ。
以下、上述した構成を備える本実施形態の有機EL表示装置100におけるアレイ基板の製造工程について、図5〜図11を参照して説明する。
図12は、第2実施形態の有機EL表示装置1200における画素の構成の別の一例による断面構造を示す図である。図12に示した有機EL表示装置1200、図3に示した第1実施形態の有機EL表示装置100における画素の構成と同一又は類似の構成については、図3における参照番号と同一の参照番号を付し、詳細な説明を省略する。
以下では、本実施形態の有機EL表示装置1200におけるアレイ基板の製造工程について、図13〜図15を参照して説明する。尚、上述した上述した第1実施形態の係る有機L表示装置100の製造方法と同一の製造工程の説明は省略する。
以上に述べた本発明の第1実施形態及び第2実施形態に係る有機EL表示装置100、1200では、表示領域102において、第3絶縁層(第2無機絶縁層)331、対向電極333、1301及び第4絶縁層(第1無機絶縁層)335が不連続となる領域209が、平面視で、一つの発光素子201を囲むように設けられる。しかしながら、領域209の位置は、これに限定されず、平面視で、少なくとも一つの発光素子201を囲むように設けられればよい。
Claims (7)
- 絶縁表面上に形成された画素電極をそれぞれ有する複数の画素がマトリクス状に配置された表示領域を有する表示装置であって、
前記画素電極の端部を覆うバンクと、
前記画素電極における発光領域を覆う発光層を含む有機層と、
前記有機層及び前記バンク上に設けられた対向電極と、
前記対向電極上に設けられた第1無機絶縁層と、
隣接する2つの前記発光領域の間で、前記対向電極及び前記第1無機絶縁層が不連続となる領域と、
を有する、表示装置。 - 前記不連続となる領域は、平面視において、前記発光領域を囲んでいることを特徴とする、請求項1記載の表示装置。
- 前記表示領域において、前記有機層の端部は、前記不連続となる領域の間にあることを特徴とする、請求項1記載の表示装置。
- 前記バンク上に設けられた第2無機絶縁層をさらに有し、
前記不連続となる領域で、前記第2無機絶縁層は不連続となることを特徴とする、請求項1記載の表示装置。 - 前記バンク上に設けられた第2無機絶縁層をさらに有し、
前記不連続となる領域で、前記第2無機絶縁層は不連続となり、
前記表示領域において、前記対向電極の端部は、前記第2無機絶縁層の端部よりも発光領域に近い側にあり、
前記表示領域において、前記有機層の端部は、前記第2無機絶縁層の端部よりも前記発光領域に近い側にあることを特徴とする、請求項3記載の表示装置。 - 前記隣接する2つの発光領域の間で、前記バンクよりも下層に設けられた配線層をさらに有し、
前記配線層は、前記対向電極と電気的に接続されていることを特徴とする、請求項1記載の表示装置。 - 前記絶縁表面は、可撓性を有する樹脂基板上に設けられていることを特徴とする、請求項1乃至請求項6のいずれか一記載の表示装置。
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JP2016130267A JP6784522B2 (ja) | 2016-06-30 | 2016-06-30 | 表示装置 |
US15/635,389 US10062863B2 (en) | 2016-06-30 | 2017-06-28 | Display device |
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JP2016130267A JP6784522B2 (ja) | 2016-06-30 | 2016-06-30 | 表示装置 |
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JP2018006115A true JP2018006115A (ja) | 2018-01-11 |
JP2018006115A5 JP2018006115A5 (ja) | 2019-08-08 |
JP6784522B2 JP6784522B2 (ja) | 2020-11-11 |
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Cited By (4)
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WO2019142261A1 (ja) * | 2018-01-17 | 2019-07-25 | シャープ株式会社 | 表示装置及びその製造方法 |
JP2019159321A (ja) * | 2018-03-08 | 2019-09-19 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 表示装置 |
JP2020087935A (ja) * | 2018-11-28 | 2020-06-04 | エルジー ディスプレイ カンパニー リミテッド | 有機発光ダイオード装置 |
WO2022214904A1 (ja) * | 2021-04-08 | 2022-10-13 | 株式会社半導体エネルギー研究所 | 表示装置 |
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KR102576993B1 (ko) * | 2018-07-27 | 2023-09-12 | 삼성디스플레이 주식회사 | 표시 장치, 표시 장치의 제조장치 및 표시 장치의 제조방법 |
CN109065758B (zh) * | 2018-08-10 | 2021-09-17 | 京东方科技集团股份有限公司 | 柔性显示装置及其制造方法 |
CN109065596B (zh) * | 2018-08-17 | 2022-07-01 | 京东方科技集团股份有限公司 | 阵列基板、显示面板及显示装置 |
US11943955B2 (en) * | 2018-09-27 | 2024-03-26 | Sharp Kabushiki Kaisha | Display device and method for manufacturing display device |
CN110197845B (zh) * | 2019-06-20 | 2021-06-25 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
US11195859B2 (en) * | 2019-12-10 | 2021-12-07 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Array substrate and flexible display panel |
US11500248B2 (en) * | 2020-07-31 | 2022-11-15 | Innolux Corporation | Sealing structure and an electronic device having the same |
JP2022109620A (ja) * | 2021-01-15 | 2022-07-28 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102616039B1 (ko) * | 2021-02-15 | 2023-12-21 | 주식회사 유니텍스 | 패턴화된 유기 박막을 형성하기 위한 박막 증착 장치 |
KR20230048179A (ko) * | 2021-10-01 | 2023-04-11 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조 방법 |
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US20180006267A1 (en) | 2018-01-04 |
US10062863B2 (en) | 2018-08-28 |
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