JP6698155B2 - バインダー樹脂及びこれを含む感光性樹脂組成物 - Google Patents
バインダー樹脂及びこれを含む感光性樹脂組成物 Download PDFInfo
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- JP6698155B2 JP6698155B2 JP2018517273A JP2018517273A JP6698155B2 JP 6698155 B2 JP6698155 B2 JP 6698155B2 JP 2018517273 A JP2018517273 A JP 2018517273A JP 2018517273 A JP2018517273 A JP 2018517273A JP 6698155 B2 JP6698155 B2 JP 6698155B2
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- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000001834 xanthenyl group Chemical group C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/123—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/137—Acids or hydroxy compounds containing cycloaliphatic rings
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
- C08L31/06—Homopolymers or copolymers of esters of polycarboxylic acids
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- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/06—Homopolymers or copolymers of esters of polycarboxylic acids
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- Health & Medical Sciences (AREA)
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- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
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Description
前記バインダー樹脂は、例えば、有機酸、有機酸無水物またはアミド酸(amic acid)で末端終結された樹脂であり得る。
前記バインダー樹脂の重量平均分子量は、例えば、1,000〜100,000g/molであり得る。
前記バインダー樹脂は、例えば、分散度が1.0〜5.0であり得る。
本発明は、バインダー樹脂及びこれを含む感光性樹脂組成物に関する。前記感光性樹脂組成物は、バインダーに加えて光開始剤、光活性化合物、溶媒などを含むことができ、その他にも熱安定剤、熱架橋剤、光硬化促進剤または界面活性剤などの添加剤をさらに含んで製造することができる。
本発明は、下記の化学式5〜8で表されるモノマーとこのようなモノマーを繰り返し単位として有する重合体である下記化学式Iで表されるバインダー樹脂を提供する。
前記末端封止反応は、例えば、30分〜4時間、または1時間〜3時間の間に100〜130℃、または110〜120℃で実施することができる。
本発明のネガ型感光性樹脂組成物は、本記載のバインダー樹脂、光開始剤、有機溶媒および添加剤を含むことを特徴とする。
本発明は、前記バインダー樹脂を含むポジ型感光性樹脂組成物を提供する。本記載の感光性樹脂組成物は、前記バインダー樹脂に加えて光活性化合物、添加物および有機溶媒を含むことを特徴とする。
本発明は、以下の具体的な合成例及び実施例に基づいてさらに詳細に説明される。下記の実施例は、本発明を例示するためのものであり、これによって本発明の範囲が限定されるものではない。
モノマー合成
1段階:2,2’−((((9H−フルオレン−9,9−ジイル)ビス(4,1−フェニレン))ビス(オキシ))ビス(メチレン))ビス(オキシラン)合成(化学式1の例)
製造例1:BTCP/BPDAバインダーの製造
前記バインダーの製造例1により製造されたBTCP/BPDAバインダー35gとTris−P PAC(登録商標)3gを入れ、これらの固形分含有量が35重量%となるように有機溶媒PGMEAに溶解させ、前記溶液60gにシリコン系界面活性剤(BYK333、BYK)0.03g、エポキシ系接着助剤(KBM403、信越)0.02gを添加して混合してポジ型有機絶縁膜組成物を製造した。
前記バインダーの製造例2により製造されたBTCP/BTDAバインダー樹脂35gを使用したことを除いては、前記実施例1と同様な方法でポジ型有機絶縁膜組成物を製造した。
前記バインダー製造例3により製造されたBTCP/PMDAバインダー樹脂35gを使用したことを除いては、前記実施例1と同様な方法でポジ型有機絶縁膜組成物を製造した。
前記バインダー製造例4により製造されたBTCP/CHDAバインダー樹脂35gを使用したことを除いては、前記実施例1と同様な方法でポジ型有機絶縁膜組成物を製造した。
前記バインダーの製造例5により製造されたBTCP/CBDAバインダー樹脂35gを使用したことを除いては、前記実施例1と同様な方法でポジ型有機絶縁膜組成物を製造した。
前記バインダーの製造例1により製造されたBTCP/BPDAバインダー35gとオキシムエステル系光開始剤1.0g(TPM−P07(登録商標))を有機溶媒PGMEAに対して35重量部になるように溶解させ、溶液に界面活性剤(BYK333)0.03g、接着助剤(KBM403)0.02gを添加して混合してネガ型感光性樹脂組成物を製造した。
前記バインダーの製造例2により製造されたBTCP/BTDAバインダー樹脂35gを使用したことを除いては、前記実施例5と同様な方法でネガ型感光性樹脂組成物を製造した。
前記バインダー製造例3により製造されたBTCP/PMDAバインダー樹脂35gを使用したことを除いては、前記実施例5と同様な方法でネガ型感光性樹脂組成物を製造した。
前記バインダー製造例4により製造されたBTCP/CHDAバインダー樹脂35gを使用したことを除いては、前記実施例5と同様な方法でネガ型感光性樹脂組成物を製造した。
前記バインダーの製造例5により製造されたBTCP/CBDAバインダー樹脂35gを使用したことを除いては、前記実施例5と同様な方法でネガ型感光性樹脂組成物を製造した。
前記実施例1におけるBTCP/BPDAバインダーの代わりにベンジルメタクリレート30重量部、メチルメタクリレート10重量部、メタクリル酸10重量部、スチレンモノマー10重量部をPGMEA溶媒下で40%の固形分含有量で重合した重量平均分子量15,000g/molであるアクリルポリマーを30g使用したことを除いては、前記実施例1と同様な方法でポジ型有機絶縁膜組成物を製造した。
前記実施例1におけるBTCP/BPDAバインダーの代わりにベンジルメタクリレート30重量部、メチルメタクリレート10重量部、メタクリル酸10重量部、スチレンモノマー10重量部をPGMEA溶媒下で40%の固形分含有量で重合した重量平均分子量15,000g/molであるアクリルポリマー30gと光開始剤1.0g(OXE01(登録商標))を、有機溶媒PGMEAに対して35重量%の濃度になるように溶解させ、前記溶液に界面活性剤(BYK333)0.03g、接着助剤(KBM403)0.02gを添加して混合してネガ型感光性樹脂組成物を製造した。
三口フラスコに還流凝縮器と温度計をセットした後、前記1段階で化学式1の例として合成した2,2’−((((9H−フルオレン−9,9−ジイル)ビス(4,1−フェニレン ))ビス(オキシ))ビス(メチレン))ビス(オキシラン)149g、アクリル酸46g、TBAB1.5gを入れ、50重量%になるようにPGMEA200gを入れた後、115℃まで昇温させ、HPLCで反応度を確認しながらアクリレート基が置換されたモノマーを合成した。
前記比較例3のバインダー35gと光開始剤1.0g(OXE01(登録商標))を、これらの固形分含有量が35重量%になるように有機溶媒PGMEAに溶解させ、前記溶液に界面活性剤(BYK333)0.03g、接着助剤(KBM403)0.02gを添加して混合してネガ型感光性樹脂組成物を製造した。
前記実施例1〜10及び比較例1〜4により得られた感光性樹脂組成物のそれぞれをスピンコーターに800〜900rpmで15秒間塗布した後、ホットプレートで90℃で100秒の間乾燥させた。所定のマスクを用いて、光源として超高圧水銀ランプを用いて露光した後、水溶性アルカリ現像液に25℃で60秒間スピン現像した後、水洗した。水洗乾燥後、230℃で40分間ベークしてパターンを得た。得られたパターンに対して以下の評価を行った。
上記組成された各々の感光性樹脂組成物をスピンコーターでガラス基板(三星コーニング社製、Eagle2000)に塗布し、ホットプレートで90℃、1分間乾燥させた。乾燥後、触針式膜厚測定器(KLA−Tencor社製、α−step500)で測定して感光性薄膜を得た。パターンのあるフォトマスクを用いて、超高圧水銀ランプで露光した後、水溶性アルカリ現像液によりスプレー現像してフォトレジストパターンを得た。
20ミクロンのマスクパターンのような寸法を形成することができる適正露光量(mJ/cm2)を表示した。すなわち、露光量の少ないレジストは、少ない光エネルギーでもパターン形成が可能なので、高感度であることを示す。
前記感度の評価の過程において現像後のパターンの厚さを測定することにより残膜率に対する評価結果を示すことができる。
前記組成物をガラス基板上にスピンコーティングして3ミクロンの均一な厚さを形成した後、400mJ/cm2の全面露光を行い、240℃で40分間ポストベークし、各段階でUVスペクトロメータ(spectrometer)を用いて400nm〜800nmまでの平均透過率を測定した。
前記評価において現像後、20ミクロンのマスクパターンと同じ感度が形成されたパターン基板を240℃で40分間ポストベークした後、SEMを用いてパターンのテーパ角を測定した。
JIS D 0202の試験方法に基づいて、露光および現像後、240℃で40分間加熱した塗膜に格子状でクロスカットを入れ、次いでセロハンテープによってピーリングテストを行い、格子状の剥離状態を観察して評価した。全く剥離がない場合は○、剥離が認められたものを×で表示した。
このような結果のうち、感度、残膜率及び密着性に対する結果を以下の表1に示した。
Claims (10)
- 下記化学式Iで表される重合体であることを特徴とするバインダー樹脂:
- 前記バインダー樹脂は、ディスプレイ用感光材にバインダーとして使用されることを特徴とする請求項1に記載のバインダー樹脂。
- 前記バインダー樹脂は、有機酸、有機酸無水物またはアミド酸で末端終結された樹脂であることを特徴とする請求項1に記載のバインダー樹脂。
- 前記バインダー樹脂の重量平均分子量は、1,000〜100,000g/molであることを特徴とする請求項1に記載のバインダー樹脂。
- 前記バインダー樹脂の分散度は、1.0〜5.0であることを特徴とする請求項1に記載のバインダー樹脂。
- 請求項1乃至請求項5のうちのいずれか一項に記載のバインダー樹脂、光開始剤、有機溶媒および界面活性剤を含むことを特徴とするネガ型感光性樹脂組成物。
- 請求項1乃至請求項5のうちのいずれか一項に記載のバインダー樹脂、光活性化合物、有機溶媒および界面活性剤を含むことを特徴とするポジ型感光性樹脂組成物。
- 請求項6に記載の感光性樹脂組成物から形成された樹脂硬化パターンを含む基板。
- 請求項7に記載の感光性樹脂組成物から形成された樹脂硬化パターンを含む基板。
- 下記化学式5〜8のいずれかで表されるモノマーと、下記化学式9で表されるカルボン酸二無水物とを重合反応させる段階を含むことを特徴とするバインダー樹脂の製造方法。
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KR102361604B1 (ko) * | 2017-08-07 | 2022-02-10 | 동우 화인켐 주식회사 | 착색 감광성 수지 조성물, 이를 포함하는 컬러필터 및 이를 포함하는 표시장치 |
KR102362443B1 (ko) * | 2017-08-31 | 2022-02-11 | 동우 화인켐 주식회사 | 청색 감광성 수지 조성물, 이를 이용하여 제조된 컬러필터 및 화상 표시 장치 |
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