JP6687445B2 - 熱硬化性化合物 - Google Patents

熱硬化性化合物 Download PDF

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Publication number
JP6687445B2
JP6687445B2 JP2016068665A JP2016068665A JP6687445B2 JP 6687445 B2 JP6687445 B2 JP 6687445B2 JP 2016068665 A JP2016068665 A JP 2016068665A JP 2016068665 A JP2016068665 A JP 2016068665A JP 6687445 B2 JP6687445 B2 JP 6687445B2
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group
thermosetting
divalent
ring
hydrocarbon group
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Japanese (ja)
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JP2017179120A (ja
Inventor
晃司 中谷
晃司 中谷
井上　慶三
慶三 井上
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Daicel Corp
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Daicel Corp
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Priority to JP2016068665A priority Critical patent/JP6687445B2/ja
Application filed by Daicel Corp filed Critical Daicel Corp
Priority to US16/089,159 priority patent/US20190119489A1/en
Priority to EP17774282.2A priority patent/EP3438140A4/en
Priority to KR1020187030277A priority patent/KR20180130526A/ko
Priority to PCT/JP2017/010175 priority patent/WO2017169738A1/ja
Priority to CN201780021115.0A priority patent/CN108884190A/zh
Priority to TW106108925A priority patent/TW201805315A/zh
Publication of JP2017179120A publication Critical patent/JP2017179120A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/36—Amides or imides
    • C08F22/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/456—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to other ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
JP2016068665A 2016-03-30 2016-03-30 熱硬化性化合物 Active JP6687445B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2016068665A JP6687445B2 (ja) 2016-03-30 2016-03-30 熱硬化性化合物
EP17774282.2A EP3438140A4 (en) 2016-03-30 2017-03-14 HEAT-HARDENING CONNECTION
KR1020187030277A KR20180130526A (ko) 2016-03-30 2017-03-14 열경화성 화합물
PCT/JP2017/010175 WO2017169738A1 (ja) 2016-03-30 2017-03-14 熱硬化性化合物
US16/089,159 US20190119489A1 (en) 2016-03-30 2017-03-14 Thermosetting compound
CN201780021115.0A CN108884190A (zh) 2016-03-30 2017-03-14 热固化性化合物
TW106108925A TW201805315A (zh) 2016-03-30 2017-03-17 熱硬化性化合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016068665A JP6687445B2 (ja) 2016-03-30 2016-03-30 熱硬化性化合物

Publications (2)

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JP2017179120A JP2017179120A (ja) 2017-10-05
JP6687445B2 true JP6687445B2 (ja) 2020-04-22

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JP2016068665A Active JP6687445B2 (ja) 2016-03-30 2016-03-30 熱硬化性化合物

Country Status (7)

Country Link
US (1) US20190119489A1 (ko)
EP (1) EP3438140A4 (ko)
JP (1) JP6687445B2 (ko)
KR (1) KR20180130526A (ko)
CN (1) CN108884190A (ko)
TW (1) TW201805315A (ko)
WO (1) WO2017169738A1 (ko)

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Publication number Priority date Publication date Assignee Title
JP6939780B2 (ja) * 2016-06-03 2021-09-22 Dic株式会社 アリル基含有マレイミド化合物およびその製造方法、並びに前記化合物を用いた組成物および硬化物
WO2018107453A1 (zh) 2016-12-16 2018-06-21 株式会社大赛璐 固化性化合物
JP2019137713A (ja) * 2018-02-06 2019-08-22 株式会社ダイセル 熱硬化性組成物
JP7361029B2 (ja) 2018-06-20 2023-10-13 株式会社ダイセル 硬化性化合物
EP3812426A4 (en) * 2018-06-20 2022-05-11 Daicel Corporation SETTING COMPOSITION
WO2020045897A1 (ko) * 2018-08-28 2020-03-05 주식회사 엘지화학 향상된 충격 강도를 갖는 프탈로니트릴계 수지
KR102218559B1 (ko) * 2018-08-28 2021-02-22 주식회사 엘지화학 향상된 충격 강도를 갖는 프탈로니트릴계 수지
KR102229664B1 (ko) * 2018-08-30 2021-03-18 주식회사 엘지화학 폴리카보네이트 및 이의 제조방법
US10678740B1 (en) 2018-11-21 2020-06-09 Zoox, Inc. Coordinated component interface control framework
KR102625057B1 (ko) * 2019-08-19 2024-01-12 주식회사 엘지화학 디올 화합물, 폴리카보네이트 및 이의 제조방법
KR102617881B1 (ko) * 2019-09-04 2023-12-22 주식회사 엘지화학 폴리카보네이트
WO2021153588A1 (ja) 2020-01-30 2021-08-05 富士フイルム株式会社 α線遮蔽膜形成用組成物、α線遮蔽膜、積層体、半導体装置
WO2022059648A1 (ja) * 2020-09-16 2022-03-24 ポリプラスチックス株式会社 熱硬化性組成物及びその硬化物並びにフィルム
WO2023238515A1 (ja) * 2022-06-07 2023-12-14 日東電工株式会社 組成物、液晶ポリマーシート、低誘電基板材、及び配線回路基板
CN117264419B (zh) * 2023-11-23 2024-02-13 成都科宜高分子科技有限公司 一种无卤阻燃高Tg树脂组合物、树脂胶液、半固化片、覆铜板及其制备方法、电路板

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Also Published As

Publication number Publication date
WO2017169738A1 (ja) 2017-10-05
EP3438140A1 (en) 2019-02-06
US20190119489A1 (en) 2019-04-25
CN108884190A (zh) 2018-11-23
EP3438140A4 (en) 2019-10-02
KR20180130526A (ko) 2018-12-07
JP2017179120A (ja) 2017-10-05
TW201805315A (zh) 2018-02-16

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