JP6645431B2 - 低誘電接着剤組成物 - Google Patents

低誘電接着剤組成物 Download PDF

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Publication number
JP6645431B2
JP6645431B2 JP2016545004A JP2016545004A JP6645431B2 JP 6645431 B2 JP6645431 B2 JP 6645431B2 JP 2016545004 A JP2016545004 A JP 2016545004A JP 2016545004 A JP2016545004 A JP 2016545004A JP 6645431 B2 JP6645431 B2 JP 6645431B2
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Japan
Prior art keywords
component
mass
parts
resin
adhesive composition
Prior art date
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JP2016545004A
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English (en)
Japanese (ja)
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JPWO2016031342A1 (ja
Inventor
忠彦 三上
忠彦 三上
伊藤　武
武 伊藤
健二 柏原
健二 柏原
坂田　秀行
秀行 坂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
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Toyobo Co Ltd
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2016545004A 2014-08-27 2015-06-10 低誘電接着剤組成物 Active JP6645431B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014172308 2014-08-27
JP2014172308 2014-08-27
PCT/JP2015/066736 WO2016031342A1 (fr) 2014-08-27 2015-06-10 Composition adhésive faiblement diélectrique

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019128450A Division JP6761588B2 (ja) 2014-08-27 2019-07-10 低誘電接着剤組成物

Publications (2)

Publication Number Publication Date
JPWO2016031342A1 JPWO2016031342A1 (ja) 2017-06-08
JP6645431B2 true JP6645431B2 (ja) 2020-02-14

Family

ID=55399247

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016545004A Active JP6645431B2 (ja) 2014-08-27 2015-06-10 低誘電接着剤組成物
JP2019128450A Active JP6761588B2 (ja) 2014-08-27 2019-07-10 低誘電接着剤組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019128450A Active JP6761588B2 (ja) 2014-08-27 2019-07-10 低誘電接着剤組成物

Country Status (5)

Country Link
JP (2) JP6645431B2 (fr)
KR (1) KR102178215B1 (fr)
CN (1) CN106459704B (fr)
TW (1) TWI660021B (fr)
WO (1) WO2016031342A1 (fr)

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CN107075335B (zh) * 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
JP6902827B2 (ja) * 2016-02-08 2021-07-14 藤森工業株式会社 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム
KR102400950B1 (ko) * 2016-05-10 2022-05-23 디아이씨 가부시끼가이샤 래미네이트용 접착제, 그것을 이용한 적층체, 및 이차 전지
CN108473836B (zh) * 2016-06-24 2021-04-06 Dic株式会社 层压用粘接剂组合物、层叠体和二次电池
TWI747950B (zh) * 2016-09-07 2021-12-01 日商琳得科股份有限公司 黏著劑組合物、密封片及密封體
EP3511386B1 (fr) * 2016-09-07 2021-08-25 Lintec Corporation Composition d'adhésif, feuille de scellement, et corps de scellement
CN109790427B (zh) * 2016-09-07 2021-08-20 琳得科株式会社 粘接剂组合物、密封片、以及密封体
JP6940224B2 (ja) * 2016-09-07 2021-09-22 リンテック株式会社 ガスバリア性積層体、及び封止体
JP7094671B2 (ja) * 2017-08-23 2022-07-04 藤森工業株式会社 接着性樹脂組成物及び積層体
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
US20210009865A1 (en) * 2018-03-07 2021-01-14 Toagosei Co., Ltd. Adhesive composition, and adhesive layer-equipped layered product using same
JP2019171662A (ja) * 2018-03-28 2019-10-10 三井化学株式会社 積層体の製造方法及び積層体
KR102552552B1 (ko) * 2018-05-28 2023-07-06 도요보 엠씨 가부시키가이샤 저유전 접착제 조성물
EP3848428A4 (fr) 2018-09-06 2022-06-22 Riken Technos Corporation Adhésif thermofusible, bande renforcement, et câble plat flexible renforcé au niveau d'une borne conductrice avec la bande de renforcement
CN109868102B (zh) * 2019-01-02 2021-07-16 浙江华正新材料股份有限公司 Lcp基柔性覆铜板用改性环氧树脂胶黏剂及制备方法与应用
JP7428022B2 (ja) * 2019-03-27 2024-02-06 Ｍｃｐｐイノベーション合同会社 接着性樹脂組成物
WO2021024702A1 (fr) * 2019-08-08 2021-02-11 東洋紡株式会社 Composition adhésive, feuille adhésive, stratifié et carte de câblage imprimé
WO2021045125A1 (fr) * 2019-09-06 2021-03-11 東洋紡株式会社 Composition d'adhésif à base de polyoléfine
KR20220079852A (ko) * 2019-10-08 2022-06-14 도요보 가부시키가이샤 폴리올레핀계 접착제 조성물
WO2021075367A1 (fr) * 2019-10-18 2021-04-22 東洋紡株式会社 Composition adhésive à base de polyoléfine
WO2021106847A1 (fr) * 2019-11-28 2021-06-03 東洋紡株式会社 Film adhésif, stratifié, et carte de circuit imprimé
KR20220107147A (ko) * 2019-11-29 2022-08-02 도요보 가부시키가이샤 접착제 조성물, 접착 시트, 적층체 및 프린트 배선판
KR20220128348A (ko) * 2020-01-16 2022-09-20 스미토모 세이카 가부시키가이샤 동박과 에폭시 수지 조성물층을 구비한 적층체
TW202136398A (zh) * 2020-01-17 2021-10-01 日商東洋紡股份有限公司 積層薄膜
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JPWO2003078488A1 (ja) * 2002-03-18 2005-07-14 三井化学株式会社 液晶ポリマー用接着樹脂及び接着樹脂組成物
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Also Published As

Publication number Publication date
KR20170047194A (ko) 2017-05-04
JP6761588B2 (ja) 2020-09-30
WO2016031342A1 (fr) 2016-03-03
CN106459704B (zh) 2020-08-25
CN106459704A (zh) 2017-02-22
KR102178215B1 (ko) 2020-11-12
TW201614027A (en) 2016-04-16
JP2019203136A (ja) 2019-11-28
TWI660021B (zh) 2019-05-21
JPWO2016031342A1 (ja) 2017-06-08

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