JP6639931B2 - 電子部品の製造装置及び製造方法並びに電子部品 - Google Patents

電子部品の製造装置及び製造方法並びに電子部品 Download PDF

Info

Publication number
JP6639931B2
JP6639931B2 JP2016017681A JP2016017681A JP6639931B2 JP 6639931 B2 JP6639931 B2 JP 6639931B2 JP 2016017681 A JP2016017681 A JP 2016017681A JP 2016017681 A JP2016017681 A JP 2016017681A JP 6639931 B2 JP6639931 B2 JP 6639931B2
Authority
JP
Japan
Prior art keywords
porous metal
resin
electronic component
chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016017681A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017139278A (ja
JP2017139278A5 (enExample
Inventor
竹内　慎
慎 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2016017681A priority Critical patent/JP6639931B2/ja
Priority to KR1020160167370A priority patent/KR101920972B1/ko
Priority to CN201710058162.4A priority patent/CN107026107B/zh
Priority to TW106103074A priority patent/TW201806097A/zh
Publication of JP2017139278A publication Critical patent/JP2017139278A/ja
Publication of JP2017139278A5 publication Critical patent/JP2017139278A5/ja
Application granted granted Critical
Publication of JP6639931B2 publication Critical patent/JP6639931B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
JP2016017681A 2016-02-02 2016-02-02 電子部品の製造装置及び製造方法並びに電子部品 Active JP6639931B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016017681A JP6639931B2 (ja) 2016-02-02 2016-02-02 電子部品の製造装置及び製造方法並びに電子部品
KR1020160167370A KR101920972B1 (ko) 2016-02-02 2016-12-09 전자 부품의 제조 방법
CN201710058162.4A CN107026107B (zh) 2016-02-02 2017-01-23 电子部件的制造装置及制造方法以及电子部件
TW106103074A TW201806097A (zh) 2016-02-02 2017-01-25 電子部件的製造裝置及其製造方法、以及電子部件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016017681A JP6639931B2 (ja) 2016-02-02 2016-02-02 電子部品の製造装置及び製造方法並びに電子部品

Publications (3)

Publication Number Publication Date
JP2017139278A JP2017139278A (ja) 2017-08-10
JP2017139278A5 JP2017139278A5 (enExample) 2018-07-05
JP6639931B2 true JP6639931B2 (ja) 2020-02-05

Family

ID=59525307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016017681A Active JP6639931B2 (ja) 2016-02-02 2016-02-02 電子部品の製造装置及び製造方法並びに電子部品

Country Status (4)

Country Link
JP (1) JP6639931B2 (enExample)
KR (1) KR101920972B1 (enExample)
CN (1) CN107026107B (enExample)
TW (1) TW201806097A (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108321127A (zh) * 2017-12-05 2018-07-24 合肥矽迈微电子科技有限公司 一种塑封方法及采用该塑封方法制备的封装体
JP2019165173A (ja) * 2018-03-20 2019-09-26 株式会社東芝 半導体装置および半導体装置の製造方法
CN109326527B (zh) * 2018-09-27 2020-10-13 泉州智慧果技术服务有限公司 一种功率元件封装模块及其制备方法
US11037883B2 (en) * 2018-11-16 2021-06-15 Analog Devices International Unlimited Company Regulator circuit package techniques
KR102711765B1 (ko) 2019-03-06 2024-09-27 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
JP7162725B2 (ja) * 2019-03-20 2022-10-28 三菱電機株式会社 半導体装置
WO2020213572A1 (ja) 2019-04-15 2020-10-22 株式会社村田製作所 電子部品モジュール
KR102345062B1 (ko) * 2019-11-20 2021-12-30 (주)에이티세미콘 반도체 패키지 및 그 제조 방법
WO2021177093A1 (ja) * 2020-03-06 2021-09-10 株式会社村田製作所 放熱構造体及び電子機器
CN111834238A (zh) * 2020-08-10 2020-10-27 李元雄 一种采用凸块与倒装的大功率半导体器件封装方法
CN111952206B (zh) * 2020-08-14 2022-09-13 深圳市天成照明有限公司 一种电子元器件生产用封装装置
JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7526642B2 (ja) 2020-11-20 2024-08-01 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
EP4283665A4 (en) 2021-01-19 2024-07-24 Beji Sasaki ELECTRONIC DEVICE AND PRODUCT
KR102832193B1 (ko) 2021-03-04 2025-07-09 삼성전자주식회사 반도체 칩 몰딩 금형 장치
CN113299566B (zh) * 2021-05-20 2023-01-24 合肥速芯微电子有限责任公司 封装结构及其制备方法
CN114496808B (zh) * 2022-01-25 2024-03-12 河北博威集成电路有限公司 倒装式塑封的装配方法、屏蔽系统、散热系统及应用
JP7813591B2 (ja) * 2022-01-27 2026-02-13 ヤマハロボティクス株式会社 樹脂封止装置及び樹脂封止方法
CN114823370B (zh) * 2022-05-10 2022-10-14 山东汉旗科技有限公司 指纹识别芯片封装结构及其封装的方法
TWI844243B (zh) * 2023-01-18 2024-06-01 宏碁股份有限公司 電子封裝結構
JP7892268B2 (ja) * 2023-04-24 2026-07-21 ヤマハロボティクス株式会社 樹脂封止装置及び樹脂封止方法
TWI864819B (zh) * 2023-06-13 2024-12-01 南茂科技股份有限公司 薄膜覆晶封裝結構
CN117457618B (zh) * 2023-12-25 2024-04-09 长电集成电路(绍兴)有限公司 芯片封装结构及芯片封装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3434711B2 (ja) * 1998-09-24 2003-08-11 株式会社巴川製紙所 放熱シート
JP4253992B2 (ja) * 2000-03-16 2009-04-15 株式会社デンソー 樹脂封止型半導体装置
JP4630449B2 (ja) * 2000-11-16 2011-02-09 Ｔｏｗａ株式会社 半導体装置及びその製造方法
CN101587887A (zh) * 2008-05-23 2009-11-25 富准精密工业(深圳)有限公司 发光二极管结构
JP5740995B2 (ja) * 2011-01-17 2015-07-01 富士通株式会社 半導体装置及びその製造方法
JP6169516B2 (ja) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6017492B2 (ja) * 2014-04-24 2016-11-02 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP5944445B2 (ja) * 2014-07-18 2016-07-05 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、樹脂封止電子部品、及び突起電極付き板状部材の製造方法

Also Published As

Publication number Publication date
CN107026107A (zh) 2017-08-08
JP2017139278A (ja) 2017-08-10
CN107026107B (zh) 2020-08-18
KR20170092096A (ko) 2017-08-10
TW201806097A (zh) 2018-02-16
KR101920972B1 (ko) 2018-11-21

Similar Documents

Publication Publication Date Title
CN107026107B (zh) 电子部件的制造装置及制造方法以及电子部件
JP6654994B2 (ja) 回路部品の製造方法
JP6672113B2 (ja) 電子回路装置及び電子回路装置の製造方法
CN100449754C (zh) 半导体器件及其制造方法
US7520052B2 (en) Method of manufacturing a semiconductor device
CN102097339B (zh) 半导体器件及其制造方法
CN114765142B (zh) 电子封装件及其制法
EP1524690A1 (en) Semiconductor package with heat spreader
US20110057327A1 (en) Semiconductor device and method of manufacturing the same
CN104752242A (zh) 用于制造半导体装置的方法和接合夹具
JP2004031607A (ja) 半導体装置及びその製造方法
JP6017492B2 (ja) 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
US10804190B2 (en) Multi-chip module and method for manufacturing same
US7663254B2 (en) Semiconductor apparatus and method of manufacturing the same
TWI635586B (zh) 樹脂封裝裝置及樹脂封裝方法
CN110739281A (zh) 半导体封装
JP2000294723A (ja) 積層型半導体装置およびその製造方法
KR20060125574A (ko) 오버행 다이용 에폭시 범프
US10964627B2 (en) Integrated electronic device having a dissipative package, in particular dual side cooling package
JP2022014121A (ja) 半導体装置およびその製造方法
US8586413B2 (en) Multi-chip module having a support structure and method of manufacture
JP2008187144A (ja) 回路装置およびその製造方法
TW200412659A (en) Semiconductor package with heat dissipating structure
JP4626445B2 (ja) 半導体パッケージの製造方法
JP2012004435A (ja) 回路装置の製造方法および樹脂封止装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180521

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181226

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190823

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190903

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191011

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191112

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191121

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191210

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191225

R150 Certificate of patent or registration of utility model

Ref document number: 6639931

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250