JP6636515B2 - 透明スピネル物品及びそれを作製するためのテープ成形方法 - Google Patents
透明スピネル物品及びそれを作製するためのテープ成形方法 Download PDFInfo
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- JP6636515B2 JP6636515B2 JP2017521017A JP2017521017A JP6636515B2 JP 6636515 B2 JP6636515 B2 JP 6636515B2 JP 2017521017 A JP2017521017 A JP 2017521017A JP 2017521017 A JP2017521017 A JP 2017521017A JP 6636515 B2 JP6636515 B2 JP 6636515B2
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- tape
- spinel
- powder
- article
- micrometers
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- 229910052596 spinel Inorganic materials 0.000 title claims description 134
- 239000011029 spinel Substances 0.000 title claims description 134
- 238000004519 manufacturing process Methods 0.000 title description 17
- 238000000034 method Methods 0.000 claims description 125
- 239000000843 powder Substances 0.000 claims description 77
- 239000011230 binding agent Substances 0.000 claims description 70
- 238000005245 sintering Methods 0.000 claims description 60
- 239000002245 particle Substances 0.000 claims description 56
- 239000002002 slurry Substances 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 38
- 238000010304 firing Methods 0.000 claims description 16
- 238000003801 milling Methods 0.000 claims description 14
- 238000007872 degassing Methods 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 12
- 239000004014 plasticizer Substances 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 7
- 239000002518 antifoaming agent Substances 0.000 claims description 6
- 239000003125 aqueous solvent Substances 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 238000010345 tape casting Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 description 62
- 238000001513 hot isostatic pressing Methods 0.000 description 38
- 238000000465 moulding Methods 0.000 description 27
- 239000007787 solid Substances 0.000 description 26
- 239000010410 layer Substances 0.000 description 25
- 238000010030 laminating Methods 0.000 description 21
- 239000000919 ceramic Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 229920000642 polymer Polymers 0.000 description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 16
- 239000000306 component Substances 0.000 description 15
- 238000000227 grinding Methods 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052786 argon Inorganic materials 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 238000009472 formulation Methods 0.000 description 9
- 238000005336 cracking Methods 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 238000005498 polishing Methods 0.000 description 8
- 229920002799 BoPET Polymers 0.000 description 7
- 238000001914 filtration Methods 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 229910052566 spinel group Inorganic materials 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000005041 Mylar™ Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
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- 238000012545 processing Methods 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920002274 Nalgene Polymers 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920005822 acrylic binder Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000908 ammonium hydroxide Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000002902 bimodal effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
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- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
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- 239000007858 starting material Substances 0.000 description 2
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 229920006355 Tefzel Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
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- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004814 ceramic processing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009770 conventional sintering Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical compound C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
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- 239000002105 nanoparticle Substances 0.000 description 1
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- 239000005416 organic matter Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/44—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminates
- C04B35/443—Magnesium aluminate spinel
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Description
透明スピネルシートを作製するテープ成形方法;
水性バインダ系をベースとする透明スピネルシートを作製するテープ成形方法;
成形されたテープの厚さ全体にわたり均一なグリーン微小構造を提供する、テープ成形方法;
焼結助剤を用いずに又は焼結助剤の不在下で透明スピネルシートを作製するテープ成形方法;
例えば35〜85体積%の固体含量を有する均一なグリーンテープを提供する、透明スピネルシートを作製するテープ成形方法;
テープ成形により、数センチメートル以上の所望の厚さへのラミネート加工に適した、例えば10マイクロメートル〜1ミリメートルの極めて薄いテープを提供する、透明スピネルシートを作製するテープ成形方法;及び
水性テープ成形又は非水性テープ成形を用いて達成できる、透明スピネルシートを作製するテープ成形方法。
「体積パーセント固体含量(volume percent solids loading)」、「体積%固体含量(vol% solids loading)」又は同様の表現は、成形されたテープ中の無機固体を指す。体積%固体含量は、無機成分(即ちスピネル)のみを考慮する。典型的な体積%固体含量は例えば、45〜65体積%、50〜65体積%、55〜65体積%、60〜65体積%(中間値及び範囲を含む)とすることができる。
10〜300マイクロメートルの単一層厚さ;又は
複数のラミネート加工された単一層を備えるラミネートであって、50マイクロメートル〜10ミリメートル以上の厚さを有する、ラミネート;
のうちの少なくとも1つを備える、透明なテープ成形されたスピネル物品を提供し、
上記スピネル物品は:
例えば87%の最高理論透明度に基づく、80%〜87%、例えば84%〜87%の透明度;並びに
例えば1〜7マイクロメートル、2〜7マイクロメートル、3〜6マイクロメートル、4〜5マイクロメートル(中間値及び範囲を含む)の焼結粒径
を有する。
1550℃、4時間のHIPで4.6マイクロメートル;
1500℃、4時間のHIPで3.6マイクロメートル;及び
1475℃、4時間のHIPで2.8マイクロメートル
を用いて、S15CRスピネル粒子から調製された3つの透明スピネル試料に関して得た。
75〜500ナノメートル、好ましくは100〜500マイクロメートル、より好ましくは200〜400マイクロメートルの平均粒径を有するスピネル粉末、バインダ、分散剤、可塑剤、消泡剤、及び水性溶媒を含むバッチ混合物を10分〜10時間、好ましくは30分〜6時間、より好ましくは1時間〜3時間にわたり摩擦粉砕して、スラリーを形成するステップ;
得られる単離されたスラリーを真空下で脱ガスするステップ;
脱ガスされたスラリーを20〜2,000マイクロメートル、好ましくは50〜1,000マイクロメートル、より好ましくは100〜500マイクロメートルの湿潤厚さにテープ成形するステップ;
テープ成形されたスラリーを、アンダーベッドヒータ及び加熱された流動空気を用いて、20〜100℃、好ましくは40〜80℃、より好ましくは60〜70℃で制御乾燥して、5〜1,000マイクロメートル、好ましくは20〜500マイクロメートル、より好ましくは40〜200マイクロメートルの乾燥厚さを有するグリーンテープを形成するステップ;並びに
上記グリーンテープを十分な時間にわたり十分な温度で焼成して、焼結透明スピネルを提供するステップ
を含む。
例えば1500〜1600℃で2〜8時間にわたりグリーンテープを焼結して、バインダバーンアウト(binder burn out:BBO)を達成し、焼結透明スピネルを得るステップ;
アルゴンの不活性ガス雰囲気中等で、上記焼結透明スピネルを、例えば1500〜1600℃で4〜12時間にわたり、例えば5〜60kpsi、好ましくは10〜40kpsi、より好ましくは20〜30kpsiの圧力において熱間等方圧プレス(「HIP」)を行うステップ。実施形態では、結果が良好な熱間等方圧プレスは約29kpsi又は約200MPaにおいて達成され、これによりスピネル中の残留気孔率が低下し、ここで熱間等方圧プレス後の焼結透明スピネルの総気孔率は、中間値及び範囲を含む、約500ppm未満、好ましくは約200ppm未満、より好ましくは約100ppm未満、更に好ましくは約50ppm未満である;並びに
例えば1000〜1200℃で2〜8時間にわたり、0.2〜30kpsi、好ましくは1〜20kpsi、より好ましくは5〜10kpsi(中間値及び範囲を含む)の圧力において、HIP焼結された透明スピネルに酸素熱間等方圧プレス(「O2HIP」)を行うステップ
を含むことができる。
焼結助剤を使用せずに透明スピネルを焼結することを可能とする高密度グリーンテープを形成するテープ成形方法。焼結助剤の不在は、焼結プロセス中の粒成長を制限する。これにより、LiF焼結助剤及び熱間プレス法を用いた場合の100マイクロメートル超の粒径に比べて、約1〜5マイクロメートルの最終粒径がもたらされる。より小さい粒径は、他の市販のスピネル(例えばSurmet又はArmorline)と比較すると、得られるスピネルに有意に増大した強度を提供できる。
スピネル粉末
WB4101は、溶液中に添加剤を有する、特許品のアクリル系バインダである。DF002は、非シリコーン消泡剤である。DS001はポリマー分散剤である。PL005は高pH可塑剤である。これらの成分は、カリフォルニア州ビスタのPolymer Innovations, Incによって、水性セラミックテープ成形のために処方された。
従来のテープ成形プロセス及び装置は、James S. Reedによる「Principles of Ceramic Processing」、第2版、ISBN−13:978−0471597216に開示及び例示されている。
粉砕(図1B):粉砕プロセスは重要なステップであり、これは完全に解凝集した粒子を提供し、均一な、即ち良好に分散されたスラリーを生成しなければならない。Union Process製の摩擦粉砕器(別称:撹拌ボールミル)は、解凝集、即ちスピネル粉末の凝集粒子又はナノ凝集粒子の破壊を達成するために好ましい粉砕器であり、上記解凝集は、代替的な方法では、効率的かつ経済的に達成することが困難である。これにより、他の技術に比べて短い期間、例えばボールミルによる50〜100時間に対して1〜3時間で、バッチをより小さな粒径に粉砕できる。
脱気した。脱気は、乾燥機チャンバ、及び続いてマゼルスター真空遊星式攪拌機を用いて達成した。スラリーを乾燥機チャンバに装填し、最大10分間脱気した。初期脱気後、スラリーを遊星式攪拌機に装填し、真空下で5分間動作させた。マゼルスター攪拌機を除外できる代替的な脱気手順は、乾燥機チャンバにおいてより高い真空を用いることである。
透明スピネルを作製するための本開示の水性プロセスに関連する、非水性テープ成形プロセスも実証した。エタノールをベースとする溶媒系及びポリビニルブチラールバインダを用いて、スピネルテープを作製できる。市販のスピネル粉末Baikowski S30CRを、直径1mmの3YSZ粉砕媒体を使用して1時間摩擦粉砕し、凝集粒子を破壊した。粉砕バッチ(MB)の組成を表11に列挙する。
テープ成形された、ラミネート加工された、透明スピネルを作製する方法‐S15粉末;高い透明度。
テープ成形された透明スピネルを作製する方法
6m2/gの推定BET表面積、3.58g/cm3の密度、及び279nmの推定粒径を有する仮想例であるTARGET S粉末(表10を参照)等の、異なるスピネル開始粉末を選択することを除き、実施例1を繰り返した。テープ成形品の透明度は高い。4〜約28層のテープ成形品を有するラミネートは、上述のラミネート加工プロセスによって製造する。
失敗に終わった、テープキャストされた透明スピネルを作製する方法‐S30CR粉末;透明度を有しない;亀裂。
失敗に終わった、テープキャストされた透明スピネルを作製する方法‐S8粉末;透明度を有しない;低いバインダ含有量。
10〜300マイクロメートルの単一層厚さ;又は
複数のラミネート加工された単一層を備えるラミネートであって、50マイクロメートル〜10ミリメートル以上の厚さを有する、ラミネート;
のうちの少なくとも1つを備える、透明なテープ成形されたスピネル物品であって、
上記スピネル物品は:
80%〜87%の透明度;及び
1〜7マイクロメートルの焼結粒径
を有する、透明なテープ成形されたスピネル物品。
上記物品は、300〜500MPaの焼結強度を有する、実施形態1に記載のスピネル物品。
上記物品は、10〜16GPaの200g荷重により測定されたヌープ硬度値を有する、実施形態1又は2に記載のスピネル物品。
上記物品は、テープ成形されたスピネル粉末を含み、
上記粉末は、50〜500ナノメートルの中央粒径、及び5〜30m2/gのBET表面積を有する、実施形態1〜3のいずれか1つに記載のスピネル物品。
上記物品は、テープ成形されたスピネル粉末を含み、
上記粉末は、100〜300ナノメートルの中央粒径、及び6〜15m2/gのBET表面積を有する、実施形態1〜4のいずれか1つに記載のスピネル物品。
上記物品は、テープ成形されたスピネル粉末を含み、
上記粉末は99.5重量%〜99.9重量%の純度を有し、
上記粉末は0.01重量%〜0.001重量%未満の低い硫黄含有量を有する、実施形態1〜5のいずれか1つに記載のスピネル物品。
テープ成形された透明スピネルを作製する方法であって:
75〜500ナノメートルの平均粒径を有するスピネル粉末、バインダ、分散剤、可塑剤、消泡剤、及び水性溶媒を含むバッチ混合物を10分〜10時間にわたり摩擦粉砕して、スラリーを形成するステップ;
得られる単離された上記スラリーを真空下で脱ガスするステップ;
脱ガスされた上記スラリーを20〜2,000マイクロメートルの湿潤厚さにテープ成形するステップ;
テープ成形された上記スラリーを、アンダーベッドヒータ及びに加熱された流動空気を用いて、20〜100℃で制御乾燥して、5〜1,000マイクロメートルの乾燥厚さを有するグリーンテープを形成するステップ;並びに
上記グリーンテープを十分な時間にわたり十分な温度で焼成して、焼結透明スピネルを提供するステップ
を含む、方法。
上記グリーンテープを複数のグリーンテープ層にラミネート加工し、続いてラミネート加工された透明スピネルを提供するために形成するステップを更に含む、実施形態7に記載の方法。
上記スピネル粉末は、99.5重量%〜99.9重量%の純度を有し、
上記スピネル粉末は0.01重量%〜0.001重量%未満の低い硫黄含有量を有する、実施形態7又は8に記載のスピネル物品。
上記スピネル粉末は、上記スラリー中に導入される前は、2〜30m2/gのBET表面積を有し、上記グリーンテープの微小構造は均質である、実施形態7〜9のいずれか1つに記載の方法。
上記スピネル粉末は、上記スラリー中に、5〜60体積%のセラミック固体含量を有し、上記グリーンテープは、35〜85体積%のセラミック固体含量を有する、実施形態7〜10のいずれか1つに記載の方法。
上記グリーンテープを焼成するステップは:
1500〜1600℃で2〜8時間にわたり上記グリーンテープを焼結して、バインダバーンアウトを達成し、焼結透明スピネルを得るステップ;
上記焼結透明スピネルを、1500〜1600℃で4〜12時間、5〜60kpsiの圧力において熱間等方圧プレスすることにより、上記スピネル中の残留気孔率を低下させるステップであって、ここで上記熱間等方圧プレス後の上記焼結透明スピネルの総気孔率は約500ppm未満である、ステップ;及び
1000〜1200℃で2〜8時間にわたり、0.2〜30kpsiの圧力において、HIP焼結された上記透明スピネルの酸素熱間等方圧プレスを行うことにより、得られる酸素熱間等方圧プレスされた上記焼結透明スピネルにおいて、好ましくない色中心を低減するステップ
を含む、実施形態7〜11のいずれか1つに記載の方法。
上記焼成は、焼結助剤なしで達成される、実施形態7〜12のいずれか1つに記載の方法。
上記水性溶媒は脱イオン水であり、
上記バインダ、上記分散剤、上記可塑剤、及び上記水性溶媒は、9〜12のpHを有する、実施形態7〜13のいずれか1つに記載の方法。
上記方法の少なくとも1つの上記ステップは、微粒子制御環境において達成される、実施形態7〜14のいずれか1つに記載の方法。
上記グリーンテープは、約0.01〜約25体積%の気孔率を有する、実施形態7〜15のいずれか1つに記載の方法。
上記グリーンテープを所望の形状に形状形成するステップを更に含む、実施形態7〜16のいずれか1つに記載の方法。
脱ガスされた上記スラリーを濾過して汚染物質を取り除くステップを更に含む、実施形態7〜17のいずれか1つに記載の方法。
上記焼結透明スピネルを所望の厚さ及び表面テクスチャへと表面仕上げするステップを更に含む、実施形態7〜18のいずれか1つに記載の方法。
焼結された上記テープ又は焼結された上記テープラミネートは、上記グリーンテープのセラミック固体含量が45体積パーセント超である場合、上記テープ成形スラリー中の上記バインダの量、又は上記気孔率の量に対して非感受性である、実施形態8に記載の方法。
Claims (7)
- 10〜300マイクロメートルの単一層厚さ;又は
複数のラミネート加工された単一層を備えるラミネートであって、50マイクロメートル〜10ミリメートル以上の厚さを有する、ラミネート;
のうちの少なくとも1つを備える、透明なテープ成形されたスピネル物品であって、
前記スピネル物品は:
80%〜87%の透明度;及び
1〜7マイクロメートルの焼結粒径
を有する、透明なテープ成形されたスピネル物品。 - 前記物品は、300〜500MPaの焼結強度を有する、請求項1に記載のスピネル物品。
- 前記物品は、10〜16GPaの200g荷重により測定されたヌープ硬度値を有する、請求項1又は2に記載のスピネル物品。
- 前記物品は、テープ成形されたスピネル粉末を含み、
前記粉末は、50〜500ナノメートルの中央粒径、及び5〜30m2/gのBET表面積を有する、請求項1〜3のいずれか1項に記載のスピネル物品。 - 前記物品は、テープ成形されたスピネル粉末を含み、
前記粉末は、100〜300ナノメートルの中央粒径、及び6〜15m2/gのBET表面積を有する、請求項1〜4のいずれか1項に記載のスピネル物品。 - 前記物品は、テープ成形されたスピネル粉末を含み、
前記粉末は99.5重量%〜99.9重量%の純度を有し、
前記粉末は0.01重量%〜0.001重量%未満の低い硫黄含有量を有する、請求項1〜5のいずれか1項に記載のスピネル物品。 - テープ成形された透明スピネルを作製する方法であって:
75〜500ナノメートルの平均粒径を有するスピネル粉末、バインダ、分散剤、可塑剤、消泡剤、及び水性溶媒を含むバッチ混合物を10分〜10時間にわたり摩擦粉砕して、スラリーを形成するステップ;
得られる単離された前記スラリーを真空下で脱ガスするステップ;
脱ガスされた前記スラリーを20〜2,000マイクロメートルの湿潤厚さにテープ成形するステップ;
テープ成形された前記スラリーを、アンダーベッドヒータ及びに加熱された流動空気を用いて、20〜100℃で制御乾燥して、5〜1,000マイクロメートルの乾燥厚さを有するグリーンテープを形成するステップ;並びに
前記グリーンテープを十分な時間にわたり十分な温度で焼成して、焼結透明スピネルを提供するステップ
を含む、方法。
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-
2015
- 2015-06-11 US US14/736,935 patent/US9624136B2/en active Active
- 2015-06-30 EP EP15744755.8A patent/EP3164372A1/en not_active Withdrawn
- 2015-06-30 CN CN201580036358.2A patent/CN106795057B/zh active Active
- 2015-06-30 KR KR1020177002922A patent/KR20170026586A/ko unknown
- 2015-06-30 JP JP2017521017A patent/JP6636515B2/ja active Active
- 2015-06-30 WO PCT/US2015/038429 patent/WO2016003965A1/en active Application Filing
- 2015-07-01 TW TW104121366A patent/TWI677431B/zh active
-
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US20170183265A1 (en) | 2017-06-29 |
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US9624136B2 (en) | 2017-04-18 |
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