JP6628869B2 - 薄膜製造装置、薄膜製造方法 - Google Patents

薄膜製造装置、薄膜製造方法 Download PDF

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Publication number
JP6628869B2
JP6628869B2 JP2018515709A JP2018515709A JP6628869B2 JP 6628869 B2 JP6628869 B2 JP 6628869B2 JP 2018515709 A JP2018515709 A JP 2018515709A JP 2018515709 A JP2018515709 A JP 2018515709A JP 6628869 B2 JP6628869 B2 JP 6628869B2
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Prior art keywords
film
film thickness
thickness sensor
thin film
growth rate
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Japanese (ja)
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JPWO2017191796A1 (ja
Inventor
孔 木村
孔 木村
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Ulvac Inc
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Ulvac Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2018515709A 2016-05-06 2017-04-26 薄膜製造装置、薄膜製造方法 Active JP6628869B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016093400 2016-05-06
JP2016093400 2016-05-06
PCT/JP2017/016584 WO2017191796A1 (ja) 2016-05-06 2017-04-26 薄膜製造装置、薄膜製造方法

Publications (2)

Publication Number Publication Date
JPWO2017191796A1 JPWO2017191796A1 (ja) 2018-10-25
JP6628869B2 true JP6628869B2 (ja) 2020-01-15

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JP2018515709A Active JP6628869B2 (ja) 2016-05-06 2017-04-26 薄膜製造装置、薄膜製造方法

Country Status (5)

Country Link
JP (1) JP6628869B2 (zh)
KR (1) KR102193817B1 (zh)
CN (1) CN109154071B (zh)
TW (1) TW201809327A (zh)
WO (1) WO2017191796A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108342699B (zh) * 2018-02-11 2020-06-30 中国科学院上海光学精密机械研究所 综合沉积镀膜设备及综合镀膜方法
JP7064407B2 (ja) * 2018-08-31 2022-05-10 キヤノントッキ株式会社 成膜装置及び成膜装置の制御方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58217673A (ja) * 1982-06-11 1983-12-17 Anelva Corp 膜厚制御方法
JPS5910339A (ja) * 1982-07-09 1984-01-19 Hitachi Ltd 連続成膜装置
JPH07283281A (ja) * 1994-04-05 1995-10-27 Toshiba Corp ターゲットの寿命判断方法及びスパッタ装置
JP4706380B2 (ja) * 2005-08-04 2011-06-22 ソニー株式会社 蒸着装置及び蒸着方法
JP4728143B2 (ja) * 2006-02-27 2011-07-20 株式会社シンクロン 薄膜形成装置
WO2011071064A1 (ja) * 2009-12-09 2011-06-16 株式会社アルバック 有機薄膜の成膜装置および有機材料成膜方法
KR20120023273A (ko) * 2010-09-01 2012-03-13 (주)알파플러스 셔터를 이용하는 진공증착막의 두께 모니터링 방법 및 이 방법을 채용하는 진공증착장치
JP5910339B2 (ja) * 2012-06-13 2016-04-27 富士通株式会社 カプラ、ソケット及びプラグ
KR101959975B1 (ko) * 2012-07-10 2019-07-16 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
WO2015182090A1 (ja) 2014-05-26 2015-12-03 株式会社アルバック 成膜装置、有機膜の膜厚測定方法および有機膜用膜厚センサ
CN105177520B (zh) * 2015-08-05 2016-06-08 京东方科技集团股份有限公司 膜厚调节器及其制造方法、调节方法、蒸镀设备

Also Published As

Publication number Publication date
KR102193817B1 (ko) 2020-12-22
CN109154071A (zh) 2019-01-04
KR20180110004A (ko) 2018-10-08
JPWO2017191796A1 (ja) 2018-10-25
WO2017191796A1 (ja) 2017-11-09
CN109154071B (zh) 2020-10-27
TW201809327A (zh) 2018-03-16

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